Descripción del proyecto
Nanotecnología al servicio de la industria electrónica
La fabricación de productos electrónicos es una de las industrias más innovadoras y que más rápido evolucionan. Sin embargo, los desafíos técnicos frenan la velocidad a la que progresa el rendimiento y la miniaturización. Para resolver este problema, las industrias dedicadas a los semiconductores y la microelectrónica adoptaron un conjunto de estrategias como el cambio a la tecnología tridimensional y el uso de placas de circuitos impresos flexibles. Sin embargo, pasar a una dimensión adicional presenta desafíos a nivel tanto micrométrico como industrial. La empresa alemana NanoWired GmbH desarrolló un proceso basado en nanotecnología que permite un montaje y fabricación de componentes electrónicos sencillos y de alta calidad a temperatura ambiente. Con la comercialización de esta tecnología, el proyecto NanoWelds, financiado con fondos europeos, tiene como objetivo abrir nuevos horizontes para las industrias de los chips y la electrónica.
Objetivo
NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.
Ámbito científico
- natural scienceschemical sciencesinorganic chemistryinorganic compounds
- natural scienceschemical sciencesinorganic chemistrytransition metals
- engineering and technologynanotechnology
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural sciencesphysical scienceselectromagnetism and electronicsmicroelectronics
Programa(s)
Convocatoria de propuestas
Consulte otros proyectos de esta convocatoriaConvocatoria de subcontratación
H2020-SMEInst-2018-2020-2
Régimen de financiación
SME-2 - SME instrument phase 2Coordinador
64579 Gernsheim
Alemania
Organización definida por ella misma como pequeña y mediana empresa (pyme) en el momento de la firma del acuerdo de subvención.