Design of the TOF detector and procurement of components (scintillator, SiPM, ASICs),
A Timepix3 chip will be bonded to a standard 300 µm thick silicon pixel detector of the same cell size (55µm×55µm) to produce a sensor-Timepix3 chipset.
project web site for communication, dissemination, exploitation and outreach
technical/scientific review meeting documents fro the first reporting period
The interim technical report is meant to provide an intermediate overview on all the deliverables (DEM) due at M18 and M24 (D2.1, D3.1, D3.2, D3.3, D4.2, D4.3,D5.2, D5.3, D6.1, D6.2, D7.1) with respect to the design, technicalities of the demonstrators (mainly). It is meant to assure that there is enough substance for the review that will take place right after the end of the first reporting period (M12), and this includes scientific information on top of the management information present in the periodic reports (RP1).
Interim plan for the dissemination and exploitation of result as required
Data management plan as required