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Development of a demonstrator for the Penetrating Particle Analyser (PAN) technology

Deliverables

TOF components

Design of the TOF detector and procurement of components (scintillator, SiPM, ASICs),

Pixel chipsets

A Timepix3 chip will be bonded to a standard 300 µm thick silicon pixel detector of the same cell size (55µm×55µm) to produce a sensor-Timepix3 chipset.

Project web site

project web site for communication, dissemination, exploitation and outreach

technical/scientific review meeting documents 1

technical/scientific review meeting documents fro the first reporting period

Interim technical report

The interim technical report is meant to provide an intermediate overview on all the deliverables (DEM) due at M18 and M24 (D2.1, D3.1, D3.2, D3.3, D4.2, D4.3,D5.2, D5.3, D6.1, D6.2, D7.1) with respect to the design, technicalities of the demonstrators (mainly). It is meant to assure that there is enough substance for the review that will take place right after the end of the first reporting period (M12), and this includes scientific information on top of the management information present in the periodic reports (RP1).

Interim dissemination and exploitation plan

Interim plan for the dissemination and exploitation of result as required

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