Non-contact millimeter and Terahertz frequency measurement paradigm for instrumentation and sensing applications unlocking metrology-grade results

Project Information

TERAmeasure

Grant agreement ID: 862788

DOI

10.3030/862788

Project closed

EC signature date 24 September 2019

Start date 1 November 2019

End date 31 October 2023

Funded under

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Total cost

€ 3 119 251,25

EU contribution

€ 2 969 251,25

Coordinated by

UNIVERSIDAD CARLOS III DE MADRID
Spain

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Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (3)

Performance of non-contact head beyond instrumentation proof-of-concept applications

Report on the evaluation of developed measurement system on applications beyond instrumentation

TERAmeasure probe datasheet

From the characterization results the consortium will develop this report to become the TERAmeasure probe head datasheet It is aimed as commercial information with pictures sketches of the concept and a summary of its most relevant characteritics

VNA MMW/THz measurements and calibration essays using TERAmeasure head

Report which will provide information regarding the first evaluation of the probe heads interfaced to Vector Network Analyzer for frequency reponse measurements

Other (5)

Samples from final fabrication batch of components

Delivery of samples from the second (and final) fabrication batch, of micromachined silicon rod waveguides and chip with photomixers for transmitter and receiver functionalities for SUB-SYSTEM 2 as well as photonic integrated optical sources for SUB-SYSTEM 2 including the improvements/enhancements that were identified in D1.5 from analysis of first fabrication batch.

Final version of interconnection head assembly

Pictures of the final version of the assembled interconnection head, including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide from the final fabrication batch

First batch samples interconnect head

First fabrication batch Pictures of the initial set of sample devices of micromachined silicon rod waveguides from KTH and chip with photomixers for transmitter and receiver functionalities from HHI for SUBSYSTEM 1

First photonic-based VNA signal source

First fabrication batch Pictures of the first set of sample devices from this fabrication batch of photonic integrated optical sources for SUBSYSTEM 2

Interconnection head assembly

Pictures of the assembled interconnection head including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide

Open Research Data Pilot (1)

Data Management Plan

Outline of practices for collecting organizing backing up and storing the data that will be generated ensuring the availability after the project completion

Publications

Peer reviewed articles (6)

Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range

Author(s): A. Rivera-Lavado, M. Ali, D. Gallego-Cabo, L. -E. García-Muñoz, D. Lioubtchenko and G. Carpintero
Published in: IEEE Transactions on Terahertz Science and Technology, 2022, ISSN 2156-342X
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tthz.2022.3213470

Ultra-Wideband Integrated Graphene-Based Absorbers for Terahertz Waveguide Systems

Author(s): James Campion, Nikolaos Xenidis, Serguei Smirnov, Roman Ivanov, Joachim Oberhammer, Irina Hussainova, Dmitri Lioubtchenko
Published in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Publisher: Wiley-VCH GmbH
DOI: 10.1002/aelm.202200106

Terahertz photodiode integration with multi-octave-bandwidth dielectric rod waveguide probe

Author(s): Shuya Iwamatsu, Muhsin Ali, José Luis Fernández Estévez, Marcel Grzeslo, Sumer Makhlouf, Alejandro Rivera, Guillermo Carpintero, and Andreas Stöhr
Published in: Optics Letters, Issue 48, 2023, Page(s) 6275-6278, ISSN 1539-4794
Publisher: OPTICA
DOI: 10.1364/ol.504354

Characterization of silver nanowire layers in the terahertz frequency range

Author(s): Przewłoka, A., Smirnov, S., Nefedova, I., Krajewska, A., Nefedov, I.S., Demchenko, P.S., Zykov, D.V., Chebotarev, V.S., But, D.B., Stelmaszczyk, K., Dub, M., Zasada, D., Lisauskas, A., Oberhammer, J., Khodzitsky, M.K., Knap, W., Lioubtchenko, D.
Published in: Materials, 2021, ISSN 1996-1944
Publisher: MDPI Open Access Publishing
DOI: 10.3390/ma14237399

Terahertz integration platforms using substrateless all-silicon microstructures

Author(s): D. Headland, M. Fujita, G. Carpintero, T. Nagatsuma, W. Withayachumnankul “”. APL Photonics 1 (Sept 2023); 8 (9): 091101.
Published in: APL Photonics, Issue 8(9), 2023, Page(s) 091101, ISSN 2378-0967
Publisher: American Institute of Physics
DOI: 10.1063/5.0158350

Ultra-Wideband Multi-Octave Planar Interconnect for Multi-Band THz Communications” J. Infrared Milli. Terahz. Waves 44, pp. 532–550 (2023).

Author(s): S. Iwamatsu, M. Ali, J.L. Fernández-Estévez, J. Tebart, A. Kumar, S. Makhlouf, G. Carpintero, A. Stöhr
Published in: Journal of Infrared, Millimeter, and Terahertz Waves, 2023, ISSN 1866-6906
Publisher: Springer
DOI: 10.1007/s10762-023-00926-1

Conference proceedings (2)

Interconnection challenges on integrated terahertz photonic systems

Author(s): G Carpintero, A Rivera, M Ali, D Gallego, L.E. García-Muñoz, D. de Felipe, N Keil, L Liebermeister, S Lauck, B Globisch, D Lyubchenko, N Xenidis, E Prados, J M Pindado, R Rossetti, M Nagel
Published in: 2021 SPIE Photonics West Proceedings, Issue Volume 11692, Optical Interconnects XXI, 2021
Publisher: SPIE
DOI: 10.1117/12.2582982

Terahertz Band Data Communications using Dielectric Rod Waveguide

Author(s): Muhsin Ali; Jonas Tebart; Alejandro Rivera-Lavado; Dmitri Lioubtchenko; Luis Enrique Garcia-Muñoz; Andreas Stöhr; Guillermo Carpintero
Published in: 2022 Optical Fiber Communications Conference and Exhibition (OFC), 2022
Publisher: IEEE
DOI: 10.1364/OFC.2022.W1H.5

Intellectual Property Rights

Patent (2)

ULTRA-WIDEBAND INTERCONNECTION

Application/Publication number: 20 382960
Date: 2020-11-05
Applicant(s): UNIVERSIDAD CARLOS III DE MADRID

ULTRA-WIDEBAND INTERCONNECTION

Application/Publication number: 20 382960
Date: 2020-11-05
Applicant(s): UNIVERSIDAD CARLOS III DE MADRID