Non-contact millimeter and Terahertz frequency measurement paradigm for instrumentation and sensing applications unlocking metrology-grade results

Informations projet

TERAmeasure

N° de convention de subvention: 862788

DOI

10.3030/862788

Projet clôturé

Date de signature de la CE 24 Septembre 2019

Date de début 1 Novembre 2019

Date de fin 31 Octobre 2023

Financé au titre de

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Coût total

€ 3 119 251,25

Contribution de l’UE

€ 2 969 251,25

Coordonné par

UNIVERSIDAD CARLOS III DE MADRID
Spain

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Documents, reports (3)

Performance of non-contact head beyond instrumentation proof-of-concept applications

Report on the evaluation of developed measurement system on applications beyond instrumentation

TERAmeasure probe datasheet

From the characterization results the consortium will develop this report to become the TERAmeasure probe head datasheet It is aimed as commercial information with pictures sketches of the concept and a summary of its most relevant characteritics

VNA MMW/THz measurements and calibration essays using TERAmeasure head

Report which will provide information regarding the first evaluation of the probe heads interfaced to Vector Network Analyzer for frequency reponse measurements

Other (5)

Samples from final fabrication batch of components

Delivery of samples from the second (and final) fabrication batch, of micromachined silicon rod waveguides and chip with photomixers for transmitter and receiver functionalities for SUB-SYSTEM 2 as well as photonic integrated optical sources for SUB-SYSTEM 2 including the improvements/enhancements that were identified in D1.5 from analysis of first fabrication batch.

Final version of interconnection head assembly

Pictures of the final version of the assembled interconnection head, including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide from the final fabrication batch

First batch samples interconnect head

First fabrication batch Pictures of the initial set of sample devices of micromachined silicon rod waveguides from KTH and chip with photomixers for transmitter and receiver functionalities from HHI for SUBSYSTEM 1

First photonic-based VNA signal source

First fabrication batch Pictures of the first set of sample devices from this fabrication batch of photonic integrated optical sources for SUBSYSTEM 2

Interconnection head assembly

Pictures of the assembled interconnection head including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide

Open Research Data Pilot (1)

Data Management Plan

Outline of practices for collecting organizing backing up and storing the data that will be generated ensuring the availability after the project completion

Publications

Peer reviewed articles (6)

Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range

Auteurs: A. Rivera-Lavado, M. Ali, D. Gallego-Cabo, L. -E. García-Muñoz, D. Lioubtchenko and G. Carpintero
Publié dans: IEEE Transactions on Terahertz Science and Technology, 2022, ISSN 2156-342X
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tthz.2022.3213470

Ultra-Wideband Integrated Graphene-Based Absorbers for Terahertz Waveguide Systems

Auteurs: James Campion, Nikolaos Xenidis, Serguei Smirnov, Roman Ivanov, Joachim Oberhammer, Irina Hussainova, Dmitri Lioubtchenko
Publié dans: Advanced Electronic Materials, 2022, ISSN 2199-160X
Éditeur: Wiley-VCH GmbH
DOI: 10.1002/aelm.202200106

Terahertz photodiode integration with multi-octave-bandwidth dielectric rod waveguide probe

Auteurs: Shuya Iwamatsu, Muhsin Ali, José Luis Fernández Estévez, Marcel Grzeslo, Sumer Makhlouf, Alejandro Rivera, Guillermo Carpintero, and Andreas Stöhr
Publié dans: Optics Letters, Numéro 48, 2023, Page(s) 6275-6278, ISSN 1539-4794
Éditeur: OPTICA
DOI: 10.1364/ol.504354

Characterization of silver nanowire layers in the terahertz frequency range

Auteurs: Przewłoka, A., Smirnov, S., Nefedova, I., Krajewska, A., Nefedov, I.S., Demchenko, P.S., Zykov, D.V., Chebotarev, V.S., But, D.B., Stelmaszczyk, K., Dub, M., Zasada, D., Lisauskas, A., Oberhammer, J., Khodzitsky, M.K., Knap, W., Lioubtchenko, D.
Publié dans: Materials, 2021, ISSN 1996-1944
Éditeur: MDPI Open Access Publishing
DOI: 10.3390/ma14237399

Terahertz integration platforms using substrateless all-silicon microstructures

Auteurs: D. Headland, M. Fujita, G. Carpintero, T. Nagatsuma, W. Withayachumnankul “”. APL Photonics 1 (Sept 2023); 8 (9): 091101.
Publié dans: APL Photonics, Numéro 8(9), 2023, Page(s) 091101, ISSN 2378-0967
Éditeur: American Institute of Physics
DOI: 10.1063/5.0158350

Ultra-Wideband Multi-Octave Planar Interconnect for Multi-Band THz Communications” J. Infrared Milli. Terahz. Waves 44, pp. 532–550 (2023).

Auteurs: S. Iwamatsu, M. Ali, J.L. Fernández-Estévez, J. Tebart, A. Kumar, S. Makhlouf, G. Carpintero, A. Stöhr
Publié dans: Journal of Infrared, Millimeter, and Terahertz Waves, 2023, ISSN 1866-6906
Éditeur: Springer
DOI: 10.1007/s10762-023-00926-1

Conference proceedings (2)

Interconnection challenges on integrated terahertz photonic systems

Auteurs: G Carpintero, A Rivera, M Ali, D Gallego, L.E. García-Muñoz, D. de Felipe, N Keil, L Liebermeister, S Lauck, B Globisch, D Lyubchenko, N Xenidis, E Prados, J M Pindado, R Rossetti, M Nagel
Publié dans: 2021 SPIE Photonics West Proceedings, Numéro Volume 11692, Optical Interconnects XXI, 2021
Éditeur: SPIE
DOI: 10.1117/12.2582982

Terahertz Band Data Communications using Dielectric Rod Waveguide

Auteurs: Muhsin Ali; Jonas Tebart; Alejandro Rivera-Lavado; Dmitri Lioubtchenko; Luis Enrique Garcia-Muñoz; Andreas Stöhr; Guillermo Carpintero
Publié dans: 2022 Optical Fiber Communications Conference and Exhibition (OFC), 2022
Éditeur: IEEE
DOI: 10.1364/OFC.2022.W1H.5

Droits de propriété intellectuelle

Patent (1)

ULTRA-WIDEBAND INTERCONNECTION

Numéro de demande/publication: 20 382960
Date: 2020-11-05
Demandeur(s): UNIVERSIDAD CARLOS III DE MADRID