Non-contact millimeter and Terahertz frequency measurement paradigm for instrumentation and sensing applications unlocking metrology-grade results

Informazioni relative al progetto

TERAmeasure

ID dell’accordo di sovvenzione: 862788

DOI

10.3030/862788

Progetto chiuso

Data della firma CE 24 Settembre 2019

Data di avvio 1 Novembre 2019

Data di completamento 31 Ottobre 2023

Finanziato da

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Costo totale

€ 3 119 251,25

Contributo UE

€ 2 969 251,25

Coordinato da

UNIVERSIDAD CARLOS III DE MADRID
Spain

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Documents, reports (3)

Performance of non-contact head beyond instrumentation proof-of-concept applications

Report on the evaluation of developed measurement system on applications beyond instrumentation

TERAmeasure probe datasheet

From the characterization results the consortium will develop this report to become the TERAmeasure probe head datasheet It is aimed as commercial information with pictures sketches of the concept and a summary of its most relevant characteritics

VNA MMW/THz measurements and calibration essays using TERAmeasure head

Report which will provide information regarding the first evaluation of the probe heads interfaced to Vector Network Analyzer for frequency reponse measurements

Other (5)

Samples from final fabrication batch of components

Delivery of samples from the second (and final) fabrication batch, of micromachined silicon rod waveguides and chip with photomixers for transmitter and receiver functionalities for SUB-SYSTEM 2 as well as photonic integrated optical sources for SUB-SYSTEM 2 including the improvements/enhancements that were identified in D1.5 from analysis of first fabrication batch.

Final version of interconnection head assembly

Pictures of the final version of the assembled interconnection head, including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide from the final fabrication batch

First batch samples interconnect head

First fabrication batch Pictures of the initial set of sample devices of micromachined silicon rod waveguides from KTH and chip with photomixers for transmitter and receiver functionalities from HHI for SUBSYSTEM 1

First photonic-based VNA signal source

First fabrication batch Pictures of the first set of sample devices from this fabrication batch of photonic integrated optical sources for SUBSYSTEM 2

Interconnection head assembly

Pictures of the assembled interconnection head including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide

Open Research Data Pilot (1)

Data Management Plan

Outline of practices for collecting organizing backing up and storing the data that will be generated ensuring the availability after the project completion

Pubblicazioni

Peer reviewed articles (6)

Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range

Autori: A. Rivera-Lavado, M. Ali, D. Gallego-Cabo, L. -E. García-Muñoz, D. Lioubtchenko and G. Carpintero
Pubblicato in: IEEE Transactions on Terahertz Science and Technology, 2022, ISSN 2156-342X
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tthz.2022.3213470

Ultra-Wideband Integrated Graphene-Based Absorbers for Terahertz Waveguide Systems

Autori: James Campion, Nikolaos Xenidis, Serguei Smirnov, Roman Ivanov, Joachim Oberhammer, Irina Hussainova, Dmitri Lioubtchenko
Pubblicato in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Editore: Wiley-VCH GmbH
DOI: 10.1002/aelm.202200106

Terahertz photodiode integration with multi-octave-bandwidth dielectric rod waveguide probe

Autori: Shuya Iwamatsu, Muhsin Ali, José Luis Fernández Estévez, Marcel Grzeslo, Sumer Makhlouf, Alejandro Rivera, Guillermo Carpintero, and Andreas Stöhr
Pubblicato in: Optics Letters, Numero 48, 2023, Pagina/e 6275-6278, ISSN 1539-4794
Editore: OPTICA
DOI: 10.1364/ol.504354

Characterization of silver nanowire layers in the terahertz frequency range

Autori: Przewłoka, A., Smirnov, S., Nefedova, I., Krajewska, A., Nefedov, I.S., Demchenko, P.S., Zykov, D.V., Chebotarev, V.S., But, D.B., Stelmaszczyk, K., Dub, M., Zasada, D., Lisauskas, A., Oberhammer, J., Khodzitsky, M.K., Knap, W., Lioubtchenko, D.
Pubblicato in: Materials, 2021, ISSN 1996-1944
Editore: MDPI Open Access Publishing
DOI: 10.3390/ma14237399

Terahertz integration platforms using substrateless all-silicon microstructures

Autori: D. Headland, M. Fujita, G. Carpintero, T. Nagatsuma, W. Withayachumnankul “”. APL Photonics 1 (Sept 2023); 8 (9): 091101.
Pubblicato in: APL Photonics, Numero 8(9), 2023, Pagina/e 091101, ISSN 2378-0967
Editore: American Institute of Physics
DOI: 10.1063/5.0158350

Ultra-Wideband Multi-Octave Planar Interconnect for Multi-Band THz Communications” J. Infrared Milli. Terahz. Waves 44, pp. 532–550 (2023).

Autori: S. Iwamatsu, M. Ali, J.L. Fernández-Estévez, J. Tebart, A. Kumar, S. Makhlouf, G. Carpintero, A. Stöhr
Pubblicato in: Journal of Infrared, Millimeter, and Terahertz Waves, 2023, ISSN 1866-6906
Editore: Springer
DOI: 10.1007/s10762-023-00926-1

Conference proceedings (2)

Interconnection challenges on integrated terahertz photonic systems

Autori: G Carpintero, A Rivera, M Ali, D Gallego, L.E. García-Muñoz, D. de Felipe, N Keil, L Liebermeister, S Lauck, B Globisch, D Lyubchenko, N Xenidis, E Prados, J M Pindado, R Rossetti, M Nagel
Pubblicato in: 2021 SPIE Photonics West Proceedings, Numero Volume 11692, Optical Interconnects XXI, 2021
Editore: SPIE
DOI: 10.1117/12.2582982

Terahertz Band Data Communications using Dielectric Rod Waveguide

Autori: Muhsin Ali; Jonas Tebart; Alejandro Rivera-Lavado; Dmitri Lioubtchenko; Luis Enrique Garcia-Muñoz; Andreas Stöhr; Guillermo Carpintero
Pubblicato in: 2022 Optical Fiber Communications Conference and Exhibition (OFC), 2022
Editore: IEEE
DOI: 10.1364/OFC.2022.W1H.5

Diritti di proprietà intellettuale

Patent (2)

ULTRA-WIDEBAND INTERCONNECTION

Numero candidatura/pubblicazione: 20 382960
Data: 2020-11-05
Candidato/i: UNIVERSIDAD CARLOS III DE MADRID

ULTRA-WIDEBAND INTERCONNECTION

Numero candidatura/pubblicazione: 20 382960
Data: 2020-11-05
Candidato/i: UNIVERSIDAD CARLOS III DE MADRID