Non-contact millimeter and Terahertz frequency measurement paradigm for instrumentation and sensing applications unlocking metrology-grade results

Leistungen

Performance of non-contact head beyond instrumentation proof-of-concept applications

Report on the evaluation of developed measurement system on applications beyond instrumentation

From the characterization results the consortium will develop this report to become the TERAmeasure probe head datasheet It is aimed as commercial information with pictures sketches of the concept and a summary of its most relevant characteritics

VNA MMW/THz measurements and calibration essays using TERAmeasure head

Report which will provide information regarding the first evaluation of the probe heads interfaced to Vector Network Analyzer for frequency reponse measurements

Samples from final fabrication batch of components

Delivery of samples from the second (and final) fabrication batch, of micromachined silicon rod waveguides and chip with photomixers for transmitter and receiver functionalities for SUB-SYSTEM 2 as well as photonic integrated optical sources for SUB-SYSTEM 2 including the improvements/enhancements that were identified in D1.5 from analysis of first fabrication batch.

Final version of interconnection head assembly

Pictures of the final version of the assembled interconnection head, including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide from the final fabrication batch

First batch samples interconnect head

First fabrication batch Pictures of the initial set of sample devices of micromachined silicon rod waveguides from KTH and chip with photomixers for transmitter and receiver functionalities from HHI for SUBSYSTEM 1

First photonic-based VNA signal source

First fabrication batch Pictures of the first set of sample devices from this fabrication batch of photonic integrated optical sources for SUBSYSTEM 2

Interconnection head assembly

Pictures of the assembled interconnection head including photonic integrated photomixer chip onto the micromachined dielectric rod waveguide

Data Management Plan

Outline of practices for collecting organizing backing up and storing the data that will be generated ensuring the availability after the project completion

Veröffentlichungen

Contactless RF Probe Interconnect Technology Enabling Broadband Testing to the Terahertz Range

Autoren: A. Rivera-Lavado, M. Ali, D. Gallego-Cabo, L. -E. García-Muñoz, D. Lioubtchenko and G. Carpintero
Veröffentlicht in: IEEE Transactions on Terahertz Science and Technology, 2022, ISSN 2156-342X
Herausgeber: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tthz.2022.3213470

Ultra-Wideband Integrated Graphene-Based Absorbers for Terahertz Waveguide Systems

Autoren: James Campion, Nikolaos Xenidis, Serguei Smirnov, Roman Ivanov, Joachim Oberhammer, Irina Hussainova, Dmitri Lioubtchenko
Veröffentlicht in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Herausgeber: Wiley-VCH GmbH
DOI: 10.1002/aelm.202200106

Terahertz photodiode integration with multi-octave-bandwidth dielectric rod waveguide probe

Autoren: Shuya Iwamatsu, Muhsin Ali, José Luis Fernández Estévez, Marcel Grzeslo, Sumer Makhlouf, Alejandro Rivera, Guillermo Carpintero, and Andreas Stöhr
Veröffentlicht in: Optics Letters, Ausgabe 48, 2023, Seite(n) 6275-6278, ISSN 1539-4794
Herausgeber: OPTICA
DOI: 10.1364/ol.504354

Characterization of silver nanowire layers in the terahertz frequency range

Autoren: Przewłoka, A., Smirnov, S., Nefedova, I., Krajewska, A., Nefedov, I.S., Demchenko, P.S., Zykov, D.V., Chebotarev, V.S., But, D.B., Stelmaszczyk, K., Dub, M., Zasada, D., Lisauskas, A., Oberhammer, J., Khodzitsky, M.K., Knap, W., Lioubtchenko, D.
Veröffentlicht in: Materials, 2021, ISSN 1996-1944
Herausgeber: MDPI Open Access Publishing
DOI: 10.3390/ma14237399

Terahertz integration platforms using substrateless all-silicon microstructures

Autoren: D. Headland, M. Fujita, G. Carpintero, T. Nagatsuma, W. Withayachumnankul “”. APL Photonics 1 (Sept 2023); 8 (9): 091101.
Veröffentlicht in: APL Photonics, Ausgabe 8(9), 2023, Seite(n) 091101, ISSN 2378-0967
Herausgeber: American Institute of Physics
DOI: 10.1063/5.0158350

Ultra-Wideband Multi-Octave Planar Interconnect for Multi-Band THz Communications” J. Infrared Milli. Terahz. Waves 44, pp. 532–550 (2023).

Autoren: S. Iwamatsu, M. Ali, J.L. Fernández-Estévez, J. Tebart, A. Kumar, S. Makhlouf, G. Carpintero, A. Stöhr
Veröffentlicht in: Journal of Infrared, Millimeter, and Terahertz Waves, 2023, ISSN 1866-6906
Herausgeber: Springer
DOI: 10.1007/s10762-023-00926-1

Interconnection challenges on integrated terahertz photonic systems

Autoren: G Carpintero, A Rivera, M Ali, D Gallego, L.E. García-Muñoz, D. de Felipe, N Keil, L Liebermeister, S Lauck, B Globisch, D Lyubchenko, N Xenidis, E Prados, J M Pindado, R Rossetti, M Nagel
Veröffentlicht in: 2021 SPIE Photonics West Proceedings, Ausgabe Volume 11692, Optical Interconnects XXI, 2021
Herausgeber: SPIE
DOI: 10.1117/12.2582982

Terahertz Band Data Communications using Dielectric Rod Waveguide

Autoren: Muhsin Ali; Jonas Tebart; Alejandro Rivera-Lavado; Dmitri Lioubtchenko; Luis Enrique Garcia-Muñoz; Andreas Stöhr; Guillermo Carpintero
Veröffentlicht in: 2022 Optical Fiber Communications Conference and Exhibition (OFC), 2022
Herausgeber: IEEE
DOI: 10.1364/OFC.2022.W1H.5

Rechte des geistigen Eigentums

ULTRA-WIDEBAND INTERCONNECTION

Antrags-/Publikationsnummer: 20 382960
Datum: 2020-11-05

Leistungen

Veröffentlichungen

Rechte des geistigen Eigentums

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