Nanomechanical Switch-Based Logic and Non-Volatile Memory for Robust Ultra-Low Power Circuits

Información del proyecto

ZeroAMP

Identificador del acuerdo de subvención: 871740

DOI

10.3030/871740

Proyecto cerrado

Fecha de la firma de la CE 5 Diciembre 2019

Fecha de inicio 1 Enero 2020

Fecha de finalización 30 Junio 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total

€ 3 481 243,75

Aportación de la UE

€ 3 481 243,75

Coordinado por

MICROCHIP TECHNOLOGY CALDICOT LIMITED
United Kingdom

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Demonstrators, pilots, prototypes (3)

Manufactured and packaged FPGA demonstrator.

Manufactured and packaged FPGA demonstrator. Packaged FPGA chip ready for final testing

Manufactured and packaged NVM demonstrator.

Manufactured and packaged NVM demonstrator. Packaged NVM chip ready for final testing

Discrete NEM switches integrated in circuits on breadboard.

Discrete NEM switches integrated in circuits on breadboard. Functional prototype NEMswitch circuit produced by assembling discrete NEM switches on a breadboard.

Websites, patent fillings, videos etc. (4)

Interim workshop.

Interim workshop Summary of the feedback on concepts and preliminary results received at this interim workshop

Website.

Website. Public project website serving as a dissemination gateway. A first version will be published at the latest in M03, a comprehensive version in M06

Final conference and exhibition.

Final conference and exhibition. A final conference will be organized to be held inside a main European conference. The conference will present the results of the project to the scientific community.

Flyer, introductory video and press kit.

Flyer, introductory video and press kit. Summary description of the TiGRE flyer, intro video and ready-made press kits.

Publicaciones

Thesis and dissertations (1)

Nanoelectromechanical technology for radiation and temperature harsh environments

Autores: Elliott Worsey
Publicado en: 2024
Editor: University of Bristol

Conference proceedings (5)

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

Autores: Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F
Publicado en: WaferBond’22 Conference, 2022
Editor: WaferBond’22 Conference

Nanoelectromechanical analog-to-digital converter for low power and harsh environments

Autores: Elliott Worsey, Qi Tang, Manu Bala Krishnan, Mukesh Kumar Kulsreshath, I D B Pamunuwa
Publicado en: 2024 IEEE International Symposium on Circuits and Systems (ISCAS), 2024
Editor: IEEE
DOI: 10.1109/iscas58744.2024.10558630

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Autores: Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Y. Takabayashi, Hamed Sattari, Niels Quack, Moises A. Jezzini de Anda, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn B. Gylfason, Frank Niklaus
Publicado en: Silicon Photonics XVI, 2021, Página(s) 11, ISBN 9781510642188
Editor: SPIE
DOI: 10.1117/12.2582975

Fully Microelectromechanical Non-Volatile Memory Cell

Autores: Worsey, Elliott; Tang, Qi; Kulsreshath, Mukesh Kumar; Pamunuwa, I D B
Publicado en: Worsey , E , Tang , Q , Kulsreshath , M K & Pamunuwa , I D B 2023 , Fully Microelectromechanical Non-Volatile Memory Cell . in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 . Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , vol. 2023-January , Institute of Electrical and Electronics Engineers (IEEE) , pp. 507-510, Edición 1, 2023
Editor: IEEE
DOI: 10.1109/mems49605.2023.10052290

Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay

Autores: Yingying Li, Simon J. Bleiker, Pierre Edinger, Elliott Worsey, Mukesh Kumar Kulsreshath, Qi Tang, Alain Yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn B. Gylfason, Dinesh Pamunuwa and Frank Niklaus
Publicado en: IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems, 2023
Editor: IEEE

Peer reviewed articles (6)

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction

Autores: Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.
Publicado en: Advanced Materials Technologies, 2022, ISSN 2365-709X
Editor: Wiley
DOI: 10.1002/admt.202200411

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic

Autores: Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.
Publicado en: Advanced Electronic Materials, 2022, ISSN 2199-160X
Editor: Wiley
DOI: 10.1002/aelm.202200584

Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process

Autores: Yingying Li, Elliott Worsey, Simon j. Bleiker, Pierre Edinger, Mukesh kumar Kulsreshath, Qi Tang, Alain yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn b. Gylfason, Dinesh Pamunuwa, Frank Niklaus
Publicado en: Nanoscale, 2023, ISSN 2040-3364
Editor: Royal Society of Chemistry
DOI: 10.1039/d3nr03429a

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory

Autores: Dinesh Pamunuwa, Elliott Worsey, Jamie D Reynolds, Derek Seward, Harold M H Chong, Sunil Rana
Publicado en: IEEE Journal of Microelectromechanical Systems, 2022, ISSN 1941-0158
Editor: IEEE
DOI: 10.1109/jmems.2021.3138022

Digital Nanoelectromechanical Non-Volatile Memory Cell

Autores: Mukesh Kumar Kulsreshath, Qi Tang, Elliott Worsey, Manu Bala Krishnan, Yingying Li, Simon Bleiker, Frank Niklaus, I D B Pamunuwa
Publicado en: IEEE Electron Device Lett., 2024, ISSN 0741-3106
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2024.3362956

Wafer-level hermetically sealed silicon photonic MEMS

Autores: Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, and Frank Niklaus
Publicado en: Photonics Research, 2022, ISSN 2327-9125
Editor: Optica Publishing Group and Chinese Laser Press (CLP)
DOI: 10.1364/prj.441215

Derechos de propiedad intelectual

Patent (2)

MICRO ELECTROMECHANICAL RELAY

Número de solicitud/publicación: 20 1816954040
Fecha: 2018-12-20
Solicitante(s): UNIVERSITY OF BRISTOL

MICRO ELECTROMECHANICAL RELAY

Número de solicitud/publicación: 20 1816954040
Fecha: 2018-12-20
Solicitante(s): UNIVERSITY OF BRISTOL