Nanomechanical Switch-Based Logic and Non-Volatile Memory for Robust Ultra-Low Power Circuits

Informazioni relative al progetto

ZeroAMP

ID dell’accordo di sovvenzione: 871740

DOI

10.3030/871740

Progetto chiuso

Data della firma CE 5 Dicembre 2019

Data di avvio 1 Gennaio 2020

Data di completamento 30 Giugno 2024

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale

€ 3 481 243,75

Contributo UE

€ 3 481 243,75

Coordinato da

MICROCHIP TECHNOLOGY CALDICOT LIMITED
United Kingdom

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Demonstrators, pilots, prototypes (3)

Manufactured and packaged FPGA demonstrator.

Manufactured and packaged FPGA demonstrator. Packaged FPGA chip ready for final testing

Manufactured and packaged NVM demonstrator.

Manufactured and packaged NVM demonstrator. Packaged NVM chip ready for final testing

Discrete NEM switches integrated in circuits on breadboard.

Discrete NEM switches integrated in circuits on breadboard. Functional prototype NEMswitch circuit produced by assembling discrete NEM switches on a breadboard.

Websites, patent fillings, videos etc. (4)

Interim workshop.

Interim workshop Summary of the feedback on concepts and preliminary results received at this interim workshop

Website.

Website. Public project website serving as a dissemination gateway. A first version will be published at the latest in M03, a comprehensive version in M06

Final conference and exhibition.

Final conference and exhibition. A final conference will be organized to be held inside a main European conference. The conference will present the results of the project to the scientific community.

Flyer, introductory video and press kit.

Flyer, introductory video and press kit. Summary description of the TiGRE flyer, intro video and ready-made press kits.

Pubblicazioni

Thesis and dissertations (1)

Nanoelectromechanical technology for radiation and temperature harsh environments

Autori: Elliott Worsey
Pubblicato in: 2024
Editore: University of Bristol

Conference proceedings (5)

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

Autori: Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F
Pubblicato in: WaferBond’22 Conference, 2022
Editore: WaferBond’22 Conference

Nanoelectromechanical analog-to-digital converter for low power and harsh environments

Autori: Elliott Worsey, Qi Tang, Manu Bala Krishnan, Mukesh Kumar Kulsreshath, I D B Pamunuwa
Pubblicato in: 2024 IEEE International Symposium on Circuits and Systems (ISCAS), 2024
Editore: IEEE
DOI: 10.1109/iscas58744.2024.10558630

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Autori: Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Y. Takabayashi, Hamed Sattari, Niels Quack, Moises A. Jezzini de Anda, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn B. Gylfason, Frank Niklaus
Pubblicato in: Silicon Photonics XVI, 2021, Pagina/e 11, ISBN 9781510642188
Editore: SPIE
DOI: 10.1117/12.2582975

Fully Microelectromechanical Non-Volatile Memory Cell

Autori: Worsey, Elliott; Tang, Qi; Kulsreshath, Mukesh Kumar; Pamunuwa, I D B
Pubblicato in: Worsey , E , Tang , Q , Kulsreshath , M K & Pamunuwa , I D B 2023 , Fully Microelectromechanical Non-Volatile Memory Cell . in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 . Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , vol. 2023-January , Institute of Electrical and Electronics Engineers (IEEE) , pp. 507-510, Numero 1, 2023
Editore: IEEE
DOI: 10.1109/mems49605.2023.10052290

Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay

Autori: Yingying Li, Simon J. Bleiker, Pierre Edinger, Elliott Worsey, Mukesh Kumar Kulsreshath, Qi Tang, Alain Yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn B. Gylfason, Dinesh Pamunuwa and Frank Niklaus
Pubblicato in: IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems, 2023
Editore: IEEE

Peer reviewed articles (6)

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction

Autori: Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.
Pubblicato in: Advanced Materials Technologies, 2022, ISSN 2365-709X
Editore: Wiley
DOI: 10.1002/admt.202200411

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic

Autori: Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.
Pubblicato in: Advanced Electronic Materials, 2022, ISSN 2199-160X
Editore: Wiley
DOI: 10.1002/aelm.202200584

Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process

Autori: Yingying Li, Elliott Worsey, Simon j. Bleiker, Pierre Edinger, Mukesh kumar Kulsreshath, Qi Tang, Alain yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn b. Gylfason, Dinesh Pamunuwa, Frank Niklaus
Pubblicato in: Nanoscale, 2023, ISSN 2040-3364
Editore: Royal Society of Chemistry
DOI: 10.1039/d3nr03429a

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory

Autori: Dinesh Pamunuwa, Elliott Worsey, Jamie D Reynolds, Derek Seward, Harold M H Chong, Sunil Rana
Pubblicato in: IEEE Journal of Microelectromechanical Systems, 2022, ISSN 1941-0158
Editore: IEEE
DOI: 10.1109/jmems.2021.3138022

Digital Nanoelectromechanical Non-Volatile Memory Cell

Autori: Mukesh Kumar Kulsreshath, Qi Tang, Elliott Worsey, Manu Bala Krishnan, Yingying Li, Simon Bleiker, Frank Niklaus, I D B Pamunuwa
Pubblicato in: IEEE Electron Device Lett., 2024, ISSN 0741-3106
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2024.3362956

Wafer-level hermetically sealed silicon photonic MEMS

Autori: Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, and Frank Niklaus
Pubblicato in: Photonics Research, 2022, ISSN 2327-9125
Editore: Optica Publishing Group and Chinese Laser Press (CLP)
DOI: 10.1364/prj.441215

Diritti di proprietà intellettuale

Patent (2)

MICRO ELECTROMECHANICAL RELAY

Numero candidatura/pubblicazione: 20 1816954040
Data: 2018-12-20
Candidato/i: UNIVERSITY OF BRISTOL

MICRO ELECTROMECHANICAL RELAY

Numero candidatura/pubblicazione: 20 1816954040
Data: 2018-12-20
Candidato/i: UNIVERSITY OF BRISTOL