Nanomechanical Switch-Based Logic and Non-Volatile Memory for Robust Ultra-Low Power Circuits

Informations projet

ZeroAMP

N° de convention de subvention: 871740

DOI

10.3030/871740

Projet clôturé

Date de signature de la CE 5 Decembre 2019

Date de début 1 Janvier 2020

Date de fin 30 Juin 2024

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total

€ 3 481 243,75

Contribution de l’UE

€ 3 481 243,75

Coordonné par

MICROCHIP TECHNOLOGY CALDICOT LIMITED
United Kingdom

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Demonstrators, pilots, prototypes (3)

Manufactured and packaged FPGA demonstrator.

Manufactured and packaged FPGA demonstrator. Packaged FPGA chip ready for final testing

Manufactured and packaged NVM demonstrator.

Manufactured and packaged NVM demonstrator. Packaged NVM chip ready for final testing

Discrete NEM switches integrated in circuits on breadboard.

Discrete NEM switches integrated in circuits on breadboard. Functional prototype NEMswitch circuit produced by assembling discrete NEM switches on a breadboard.

Websites, patent fillings, videos etc. (4)

Interim workshop.

Interim workshop Summary of the feedback on concepts and preliminary results received at this interim workshop

Website.

Website. Public project website serving as a dissemination gateway. A first version will be published at the latest in M03, a comprehensive version in M06

Final conference and exhibition.

Final conference and exhibition. A final conference will be organized to be held inside a main European conference. The conference will present the results of the project to the scientific community.

Flyer, introductory video and press kit.

Flyer, introductory video and press kit. Summary description of the TiGRE flyer, intro video and ready-made press kits.

Publications

Thesis and dissertations (1)

Nanoelectromechanical technology for radiation and temperature harsh environments

Auteurs: Elliott Worsey
Publié dans: 2024
Éditeur: University of Bristol

Conference proceedings (5)

Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

Auteurs: Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Yuji Takabayashi, A., Sattari, H., Quack, N., Jezzini, M., Su Lee, J., Kumar Malik, A., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K. B. & Niklaus, F
Publié dans: WaferBond’22 Conference, 2022
Éditeur: WaferBond’22 Conference

Nanoelectromechanical analog-to-digital converter for low power and harsh environments

Auteurs: Elliott Worsey, Qi Tang, Manu Bala Krishnan, Mukesh Kumar Kulsreshath, I D B Pamunuwa
Publié dans: 2024 IEEE International Symposium on Circuits and Systems (ISCAS), 2024
Éditeur: IEEE
DOI: 10.1109/iscas58744.2024.10558630

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Auteurs: Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Y. Takabayashi, Hamed Sattari, Niels Quack, Moises A. Jezzini de Anda, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn B. Gylfason, Frank Niklaus
Publié dans: Silicon Photonics XVI, 2021, Page(s) 11, ISBN 9781510642188
Éditeur: SPIE
DOI: 10.1117/12.2582975

Fully Microelectromechanical Non-Volatile Memory Cell

Auteurs: Worsey, Elliott; Tang, Qi; Kulsreshath, Mukesh Kumar; Pamunuwa, I D B
Publié dans: Worsey , E , Tang , Q , Kulsreshath , M K & Pamunuwa , I D B 2023 , Fully Microelectromechanical Non-Volatile Memory Cell . in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 . Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , vol. 2023-January , Institute of Electrical and Electronics Engineers (IEEE) , pp. 507-510, Numéro 1, 2023
Éditeur: IEEE
DOI: 10.1109/mems49605.2023.10052290

Design and Fabrication of a 4-Terminal In-Plane Nanoelectromechanical Relay

Auteurs: Yingying Li, Simon J. Bleiker, Pierre Edinger, Elliott Worsey, Mukesh Kumar Kulsreshath, Qi Tang, Alain Yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn B. Gylfason, Dinesh Pamunuwa and Frank Niklaus
Publié dans: IEEE Transducers 2023 Conference on Solid-State Sensors, Actuators and Microsystems, 2023
Éditeur: IEEE

Peer reviewed articles (6)

AFM‐Based Hamaker Constant Determination with Blind Tip Reconstruction

Auteurs: Ku, B., van de Wetering, F., Bolten, J., Stel, B., van de Kerkhof, M. A. & Lemme, M. C.
Publié dans: Advanced Materials Technologies, 2022, ISSN 2365-709X
Éditeur: Wiley
DOI: 10.1002/admt.202200411

Single‐Contact, Four‐Terminal Microelectromechanical Relay for Efficient Digital Logic

Auteurs: Reynolds, J. D., Rana, S., Worsey, E., Tang, Q., Kulsreshath, M. K., Chong, H. M. H. & Pamunuwa, D.
Publié dans: Advanced Electronic Materials, 2022, ISSN 2199-160X
Éditeur: Wiley
DOI: 10.1002/aelm.202200584

Integrated 4-terminal single-contact nanoelectromechanical relays implemented in a silicon-on-insulator foundry process

Auteurs: Yingying Li, Elliott Worsey, Simon j. Bleiker, Pierre Edinger, Mukesh kumar Kulsreshath, Qi Tang, Alain yuji Takabayashi, Niels Quack, Peter Verheyen, Wim Bogaerts, Kristinn b. Gylfason, Dinesh Pamunuwa, Frank Niklaus
Publié dans: Nanoscale, 2023, ISSN 2040-3364
Éditeur: Royal Society of Chemistry
DOI: 10.1039/d3nr03429a

Theory, Design, and Characterization of Nanoelectromechanical Relays for Stiction-Based Non-Volatile Memory

Auteurs: Dinesh Pamunuwa, Elliott Worsey, Jamie D Reynolds, Derek Seward, Harold M H Chong, Sunil Rana
Publié dans: IEEE Journal of Microelectromechanical Systems, 2022, ISSN 1941-0158
Éditeur: IEEE
DOI: 10.1109/jmems.2021.3138022

Digital Nanoelectromechanical Non-Volatile Memory Cell

Auteurs: Mukesh Kumar Kulsreshath, Qi Tang, Elliott Worsey, Manu Bala Krishnan, Yingying Li, Simon Bleiker, Frank Niklaus, I D B Pamunuwa
Publié dans: IEEE Electron Device Lett., 2024, ISSN 0741-3106
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2024.3362956

Wafer-level hermetically sealed silicon photonic MEMS

Auteurs: Gaehun Jo, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Jun Su Lee, Peter Verheyen, Iman Zand, Umar Khan, Wim Bogaerts, Göran Stemme, Kristinn B. Gylfason, and Frank Niklaus
Publié dans: Photonics Research, 2022, ISSN 2327-9125
Éditeur: Optica Publishing Group and Chinese Laser Press (CLP)
DOI: 10.1364/prj.441215

Droits de propriété intellectuelle

Patent (2)

MICRO ELECTROMECHANICAL RELAY

Numéro de demande/publication: 20 1816954040
Date: 2018-12-20
Demandeur(s): UNIVERSITY OF BRISTOL

MICRO ELECTROMECHANICAL RELAY

Numéro de demande/publication: 20 1816954040
Date: 2018-12-20
Demandeur(s): UNIVERSITY OF BRISTOL