CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.
Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .
Livrables
Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Open Call Package of Documents 5Documents related to each Open Call delivered the month before launching the Open Call
First Periodic Report on Dissemination and Communication ActivitiesAll dissemination and communication activities and results will be summarized and compared against the designed KPIs
Second Periodic Report on Smart4ALL Ecosystem ActivitiesDetailed information about the activities performed to buildup and engage SMART4ALL ecosystem community the current status of the ecosystem and the results achieved
Second Version of Data Management Plan (DMP)Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
First Version of SMART4ALL Technology Services HandbookDetailed description of all the services offered by the SMART4ALL Marketplace
Final Periodic Report on Dissemination and Communication ActivitiesAll dissemination and communication activities and results will be summarized and compared against the designed KPIs
Open Call Package of Documents 9Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner S&CReport of Pathfinder Application Experiment by Partner SEEU
Open Call Package of Documents 7
Documents related to each Open Call delivered the month before launching the Open Call
Second Version of SMART4ALL DIHs Business PlanDocument that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Second Version of Business Plan of the SMART4ALL Thematic AreasDocument that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional national and European level
Ethics RequirementsReport describing the ethics requirements that the project must comply with. The report will be distributed to all SMART4ALL
Open Call Package of Documents 2Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner BTU CSSMART4ALL Project Management Handbook
Document summarising the administration and processes for SMART4ALL including data management plan, risk management, document storage and access, tendering, meetings and reporting
Report of Pathfinder Application Experiment by Partner UoPFinal Version of SMART4ALL DIHs Business Plan
Document that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Report of Pathfinder Application Experiment by Partner Red Pitaya d.d.First Version of Data Management Plan (DMP)
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
Report of Pathfinder Application Experiment by Partner UPVOpen Call Evaluation Reports 1
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner MarsecoOpen Call Package of Documents 4
Documents related to each Open Call delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner TU DelftReport of Pathfinder Application Experiment by Partner UPZ
Second Periodic Report on Dissemination and Communication Activities
All dissemination and communication activities and results will be summarized and compared against the designed KPIs
Report of Pathfinder Application Experiment by Partner MTUFinal Version of SMART4ALL Technology Services Handbook
Detailed description of all the services offered by the SMART4ALL Marketplace
Open Call Evaluation Reports 2Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner BMEFinal Periodic Report on Smart4ALL Ecosystem Activities
Detailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Open Call Evaluation Reports 3Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
First Version of Business Plan of the SMART4ALL Thematic AreasDocument that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Evaluation Reports 4Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Second Version of SMART4ALL Technology Services HandbookDetailed description of all the services offered by the SMART4ALL Marketplace
Project CollateralsPreparation of the printable materials of the project like press releases, posters, leaflets and slide deck for general presentations
Report of Pathfinder Application Experiment by Partner FTNOpen Call Evaluation Reports 8
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner TalTechReport of Pathfinder Application Experiment by Partner DLR
SMART4ALL website
Setup and maintenance of a SMART4ALL website to promote the project, the Open Calls, the third party PAE, the events etc.
Open Call Evaluation Reports 5Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Third Version of Data Management Plan (DMP)Report describing management of all datasets collected and generated in the project This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the nonEU partners of the project
First Periodic Report on Smart4ALL Ecosystem ActivitiesDetailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Report of Pathfinder Application Experiment by Partner MECOnetReport of Pathfinder Application Experiment by Partner PUT
Report of Pathfinder Application Experiment by Partner ATB
Final Version of Business Plan of the SMART4ALL Thematic Areas
Document that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Package of Documents 1Documents related to each Open Call, delivered the month before launching the Open Call
SMART4ALL Final Achievements and Lesson LearnedSummary of all major SMART4ALL results, achievements, and lessons-learned
Report of Pathfinder Application Experiment by Partner PSPReport of Pathfinder Application Experiment by Partner REZOS BRANDS
Report of Pathfinder Application Experiment by Partner ANV
Report of Pathfinder Application Experiment by Partner DPN
Open Call Package of Documents 6
Documents related to each Open Call delivered the month before launching the Open Call
Open Call Package of Documents 8Documents related to each Open Call delivered the month before launching the Open Call
First Version of SMART4ALL DIHs Business PlanDocument that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
SMART4ALL Sustainability PlanDocument that will describe the post-project operational processes of SMART4ALL DIH and the strategy for future expansion
Open Call Package of Documents 3Documents related to each Open Call, delivered the month before launching the Open Call
Open Call Evaluation Reports 7Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Open Call Evaluation Reports 9Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project.
The technology portal will be delivered. The design of the portal will be based on open-source technologies
Publications
Auteurs:
Julian Balcerek, Paweł Pawłowski, Grzegorz Blajer, Jakub Filipkiewicz, Kamil Koćwin
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.57
Auteurs:
Paweł Pawłowski, Karol Piniarski, Adam Dąbrowski
Publié dans:
Sensors, Numéro 21(2), 653, 2021, ISSN 1424-8220
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s21020653
Auteurs:
Julian Balcerek ,Adam Konieczka ,Paweł Pawłowski ,Cyprian Dankowski ,Mateusz Firlej ,Piotr Fulara
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.47
Auteurs:
Michał Janeda, Paweł Pawłowski & Mariusz Ślachciński
Publié dans:
Journal of Analytical Chemistry, 2024, ISSN 1061-9348
Éditeur:
Springer Verlag
DOI:
10.1134/s1061934823120079
Auteurs:
Jakub SUDER , Tomasz MARCINIAK
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 2449-9544
Éditeur:
Czasopismo Stowarzyszenia Elektryków Polskich (SEP)
DOI:
10.15199/48.2023.11.47
Auteurs:
Jakub Suder, Kacper Podbucki, Tomasz Marciniak
Publié dans:
MDPI,Energies, 2023, ISSN 1996-1073
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/en16186677
Auteurs:
Kacper Podbuckia* , Jakub Sudera , Tomasz Marciniaka , Wojciech Mańczakb , Adam Dąbrowski
Publié dans:
Opto-Electronics Review, 2022, ISSN 1896-3757
Éditeur:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2022.143396
Auteurs:
Julian BALCEREK, Paweł PAWŁOWSKI, Błażej TRZCIŃSKI
Publié dans:
Przegląd Elektrotechniczny., 2023, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.58
Auteurs:
Piotr Góral,Paweł Pawłowski,Karol Piniarski, Adam Dąbrowski
Publié dans:
MDPI, Electronics, 2024, ISSN 2079-9292
Éditeur:
MDPI
DOI:
10.3390/electronics13030494
Auteurs:
Isak Shabani; Tonit Biba; Betim Çiço
Publié dans:
Computers; Volume 11; Numéro 5; Pages: 79, Numéro 17, 2022, Page(s) 1-8, ISSN 2073-431X
Éditeur:
MDPI
DOI:
10.3390/computers11050079
Auteurs:
Zain Ul Abideen; Rui Wang; Tiago Diadami Perez; Geert-Jan Schrijen; Samuel Pagliarini
Publié dans:
IEEE Design & Test, Numéro 18, 2024, Page(s) 14-20, ISSN 2168-2356
Éditeur:
IEEE Computer Society
DOI:
10.1109/mdat.2023.3322621
Auteurs:
Miodrag Mihaljević ; Milan Todorović; Milica Knežević
Publié dans:
Symmetry, Vol 15, Iss 4, p 924 (2023), Numéro 34, 2023, Page(s) 1-10, ISSN 2073-8994
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/sym15040924
Auteurs:
Radosavljević, Miloš; Brkljač, Branko; Lugonja, Predrag; Crnojević, Vladimir; Trpovski, Željen; Xiong, Zixiang; Vukobratović, Dejan
Publié dans:
Remote Sensing, Vol 12, Iss 1590, p 1590 (2020), Numéro 34, 2020, Page(s) 1-10, ISSN 2072-4292
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/rs12101590
Auteurs:
Evanthia Faliagka; Vasileios Skarmintzos; Christos Panagiotou; Vasileios Syrimpeis; Christos P. Antonopoulos; Nikolaos Voros
Publié dans:
Electronics; Volume 12; Numéro 16; Pages: 3375, Numéro 10, 2023, Page(s) 1-8, ISSN 2079-9292
Éditeur:
mdpi
DOI:
10.20944/preprints202306.1530.v1
Auteurs:
Ardo Allik; Kristjan Pilt; Moonika Viigimäe; Ivo Fridolin; Gert Jervan
Publié dans:
Sensors, Vol 22, Iss 4, p 1680 (2022), Numéro 15, 2022, Page(s) 1-8, ISSN 1424-8220
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22041680
Auteurs:
Kacper PODBUCKI
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.40
Auteurs:
Matteo Antonio Scrugli; Bojan Blažica; Luigi Raffo; Paolo Meloni
Publié dans:
IEEE Access, Vol 11, Pp 70778-70794 (2023), Numéro 8, 2023, Page(s) 70778 - 70794, ISSN 2169-3536
Éditeur:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3294097
Auteurs:
Kacper Podbucki, Tomasz Marciniak, Jakub Suder
Publié dans:
MDPI Appl. Sci.,, 2023, ISSN 2076-3417
Éditeur:
MDPI
DOI:
10.3390/app132413242
Auteurs:
Liapis, Alexandros; Faliagka, Evanthia; Antonopoulos, Christos P.; Keramidas, Georgios; Voros, Nikolaos
Publié dans:
Electronics, Vol 10, Iss 13, p 1550 (2021), Numéro 31, 2021, Page(s) 1-20, ISSN 2079-9292
Éditeur:
MDPI
DOI:
10.3390/electronics10131550
Auteurs:
Karol Piniarski, Paweł Pawłowski, Adam Dąbrowski
Publié dans:
Sensors, Numéro 20/16, 2020, Page(s) 4363, ISSN 1424-8220
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s20164363
Auteurs:
Tomasz Marciniak ,Kacper Podbucki ,Jakub Suder
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.10.55
Auteurs:
Jakub Suder
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.50
Auteurs:
Lidija Krstanović; Branislav Popović; Marko Janev; Branko Brkljač
Publié dans:
Applied Sciences, Vol 12, Iss 7, p 3411 (2022), Numéro 34, 2022, Page(s) 1-10, ISSN 2076-3417
Éditeur:
MDPI
DOI:
10.3390/app12073411
Auteurs:
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Publié dans:
Electronics, Vol 10, Iss 1665, p 1665 (2021), Numéro 29, 2021, Page(s) 1-8, ISSN 2079-9292
Éditeur:
MDPI
DOI:
10.3390/electronics10141665
Auteurs:
Piotr GÓRAL ,Paweł PAWŁOWSKI ,Adam DĄBROWSKI
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.02.14
Auteurs:
Jakub SUDER
Publié dans:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.41
Auteurs:
Jakub Suder, Kacper Podbucki, Tomasz Marciniak, Adam Dąbrowski
Publié dans:
Opto-Electronics Review, Numéro 1896-3757, 2021, Page(s) vol. 29 | Numer: no. 4, ISSN 1896-3757
Éditeur:
The Polish Academy of Science
DOI:
10.24425/opelre.2021.139383
Auteurs:
Kacper Podbucki,Jakub Suder, Tomasz Marciniak, Adam Dąbrowski
Publié dans:
Electrotechnical Review, Numéro R. 97 | Numer: nr 2, 2021, Page(s) 47 - 51, ISSN 0033-2097
Éditeur:
Wydawnictwo SIGMA
DOI:
10.15199/48.2021.02.12
Auteurs:
Jakub Suder , Kacper Podbucki , Tomasz Marciniak
Publié dans:
Opto-Electronics Review, 2023, ISSN 1896-3757
Éditeur:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2023.147040
Auteurs:
Radovan Stojanovic
Publié dans:
2020
Éditeur:
WORKS in PROGRESS in EMBEDDED COMPUTING (WiPiEC)
DOI:
10.13140/rg.2.2.30583.98721
Auteurs:
N.Voros, M.Huebner, C.Antonopoulos, G.Keramidas
Publié dans:
HiPEAC info 61, Numéro 31/7/2020, 2020
Éditeur:
HiPEAC magazine
Auteurs:
Radovan Stojanovic
Publié dans:
2020
Éditeur:
MECOnet Podgorica
DOI:
10.13140/rg.2.2.32710.63040
Auteurs:
Lamir Shkurti, Mennan Selimi,Adrian Besimi
Publié dans:
CollaborateCom 2023, 2024, ISBN 978-3-031-54530-6
Éditeur:
Springer
DOI:
10.1007/978-3-031-54531-3_9
Auteurs:
András Wiesner; Tamás Kovácsházy
Publié dans:
2022 23rd International Carpathian Control Conference (ICCC), 2022, ISBN 978-1-6654-6636-3
Éditeur:
IEEE
DOI:
10.1109/iccc54292.2022.9805958
Auteurs:
Jakub Suder; Tomasz Marciniak; Kacper Podbucki; Adam Dąbrowski
Publié dans:
2022 International Symposium ELMAR, 2022
Éditeur:
IEEE
DOI:
10.1109/elmar55880.2022.9899807
Auteurs:
Alexandros Spournias; Panagiotis Bountas; Evanthia Faliagka; Dimitris Kontargiris; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Publié dans:
2021 10th Mediterranean Conference on Embedded Computing (MECO), Numéro 22, 2021, Page(s) 1-8, ISBN 978-1-6654-3912-1
Éditeur:
IEEE
DOI:
10.1109/meco52532.2021.9460154
Auteurs:
Paweł Pawłowski; Rafał Długosz; Marek Radkowski; Mateusz Wątły; Adam Dąbrowski
Publié dans:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Éditeur:
IEEE
DOI:
10.23919/spa59660.2023.10274431
Auteurs:
Andras Wiesner; Tamas Kovacshazy
Publié dans:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Numéro 3, 2021, Page(s) 1-5, ISBN 978-1-7281-6484-7
Éditeur:
IEEE
DOI:
10.1109/ispcs49990.2021.9615250
Auteurs:
Viktor Vozar; Tamas Kovacshazy
Publié dans:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Numéro 30, 2021, Page(s) 1-8, ISBN 978-1-7281-6484-7
Éditeur:
IEEE
DOI:
10.1109/ispcs49990.2021.9615306
Auteurs:
Evanthia Faliagka; Christos Panagiotou; Christos Antonopoulos; Georgios Keramidas; Nikolaos Voros
Publié dans:
2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2022, ISBN 978-1-6654-6605-9
Éditeur:
IEEE
DOI:
10.1109/isvlsi54635.2022.00080
Auteurs:
Georgios Keramidas
Publié dans:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Numéro 32, 2020, Page(s) 1-10, ISBN 978-83-62065-39-4
Éditeur:
IEEE
DOI:
10.23919/spa50552.2020.9241304
Auteurs:
Tjark Schütte, Karuna Koch, V. Dworak, Cornelia Weltzien
Publié dans:
80th International Conference on Agricultural Engineering LAND.TECHNIK AgEng 2023, 2023
Éditeur:
LAND.TECHNIK AgEng 2023
DOI:
10.51202/9783181024270-199
Auteurs:
Tamás Kovácsházy; Zoltan Fodor
Publié dans:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Éditeur:
IEEE
DOI:
10.1109/ispcs59528.2023.10296994
Auteurs:
R. Stojanović, A. Škraba and B. Lutovac
Publié dans:
2020, Page(s) 1-4
Éditeur:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134211.
Auteurs:
Piotr Góral; Pawel Pawłowski; Adam Dąbrowski
Publié dans:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Éditeur:
IEEE
DOI:
10.23919/spa53010.2022.9928022
Auteurs:
Jakub Suder,Tomasz Marciniak
Publié dans:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Éditeur:
IEEE
DOI:
10.23919/spa59660.2023.10274434
Auteurs:
Jozwiak Lech; Stojanovic Radovan
Publié dans:
2nd Summer School on Cyber-Physical Systems and Internet-of-Things (SS-CPSIoT2021), Numéro 9, 2021, Page(s) 1-100, ISBN 978-9940-8795-0-1
Éditeur:
Zenodo
DOI:
10.5281/zenodo.5086365
Auteurs:
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dabrowski
Publié dans:
2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2022
Éditeur:
IEEE
DOI:
10.23919/mixdes55591.2022.9838167
Auteurs:
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Publié dans:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Éditeur:
IEEE
DOI:
10.23919/spa53010.2022.9927908
Auteurs:
Konstantinos Antonopoulos; Dimitrios Ringas; Eleni Christopoulou; Georgios Keramidas; Christos Antonopoulos; Nikolaos Voros
Publié dans:
2022 IEEE International Mediterranean Conference on Communications and Networking (MeditCom), 2022, ISBN 978-1-6654-9825-8
Éditeur:
IEEE
DOI:
10.1109/meditcom55741.2022.9928767
Auteurs:
Tamás Kovácsházy
Publié dans:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Éditeur:
IEEE
DOI:
10.1109/ispcs59528.2023.10296941
Auteurs:
Octavian M. Machidon; Andraž Krašovec; Alina L. Machidon; Veljko Pejović; Daniele Latini; Sarathchandrakumar T. Sasidharan; Fabio Del Frate
Publié dans:
NET4us '23: Proceedings of the 2nd Workshop on Networked Sensing Systems for a Sustainable Society, Numéro 16, 2023, Page(s) 193-200, ISBN 9798400703652
Éditeur:
ACM
DOI:
10.1145/3615991.3616405
Auteurs:
Alexandros Spournias; Evanthia Faliagka; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Publié dans:
2021 IEEE International Conference on Smart Internet of Things (SmartIoT), Numéro 17, 2021, Page(s) 1-8, ISBN 978-1-6654-4511-5
Éditeur:
IEEE
DOI:
10.1109/smartiot52359.2021.00071
Auteurs:
Panagiotis Mousouliotis, Topi Leppänen, Pekka Jääskeläinen, Nikos Petrellis, Panagiotis Christakos, Georgios Keramidas, Christos Antonopoulos & Nikolaos Voros
Publié dans:
Applied Reconfigurable Computing. Architectures, Tools, and Applications (ARC 2023), 2023, ISBN 978-3-031-42920-0
Éditeur:
Springer
DOI:
10.1007/978-3-031-42921-7_4
Auteurs:
Antonio Montalvo
Publié dans:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Numéro 31, 2020, Page(s) 1-10, ISBN 978-83-62065-39-4
Éditeur:
IEEE
DOI:
10.23919/spa50552.2020.9241258
Auteurs:
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dąbrowski
Publié dans:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Éditeur:
IEEE
DOI:
10.23919/spa59660.2023.10274440
Auteurs:
A. Spournias, C. Antonopoulos, G. Keramidas, N. Voros and R. Stojanović
Publié dans:
2020
Éditeur:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134108.
Auteurs:
Radovan Stojanovic; Andrej Škraba
Publié dans:
MECO, Numéro 11, 2021, Page(s) 1-5, ISBN 978-1-6654-3912-1
Éditeur:
ΙΕΕΕ
DOI:
10.1109/meco52532.2021.9460178
Auteurs:
Alexandros Spournias; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros; Radovan Stojanovic
Publié dans:
MECO, Numéro 11, 2020, Page(s) 1-5, ISBN 978-1-7281-6949-1
Éditeur:
ΙΕΕΕ
DOI:
10.1109/meco49872.2020.9134108
Auteurs:
R. Stojanović, A. Škraba and B. Lutovac
Publié dans:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Numéro 26, 2020, Page(s) 1-8, ISBN 978-1-7281-6949-1
Éditeur:
IEEE
DOI:
10.1109/meco49872.2020.9134211
Auteurs:
Nikolaos S. Voros
Publié dans:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Numéro 22, 2020, Page(s) 1-8, ISBN 978-1-7281-6949-1
Éditeur:
IEEE
DOI:
10.1109/meco49872.2020.9134065
Auteurs:
Tamas Kovacshazy; Gabor Fekete
Publié dans:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Numéro 28, 2022, Page(s) 1-8, ISBN 978-1-6654-6828-2
Éditeur:
IEEE
DOI:
10.1109/meco55406.2022.9797123
Auteurs:
Julian Balcerek,Paweł Pawłowski
Publié dans:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Éditeur:
IEEE
DOI:
10.23919/spa59660.2023.10274452
Auteurs:
Kacper Podbucki; Tomasz Marciniak
Publié dans:
Proceedings of the 17th Conference on Computer Science and Intelligence Systems, Numéro 14, 2022, Page(s) 117-120
Éditeur:
FedCSIS
DOI:
10.15439/2022f89
Auteurs:
Radovan Stojanovic; Andrej Skraba; Jovan Djurkovic; Budimir Lutovac
Publié dans:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Numéro 33, 2022, Page(s) 1-10, ISBN 978-1-6654-6828-2
Éditeur:
IEEE
DOI:
10.1109/meco55406.2022.9797085
Auteurs:
Evanthia Faliagka; Alexandros Spournias; Christos Antonopoulos; Nikolaos Voros
Publié dans:
2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2023, ISBN 978-83-63578-24-4
Éditeur:
IEEE
DOI:
10.23919/mixdes58562.2023.10203211
Auteurs:
Angelos S. Voros; Christos Panagiotou; Stavros Zogas; Georgios Keramidas; Christos P. Antonopoulos; Michael Hubner; Nikolaos S. Voros
Publié dans:
2021 31st International Conference on Field-Programmable Logic and Applications (FPL), Numéro 23, 2021, Page(s) 1-8, ISBN 978-1-6654-3759-2
Éditeur:
IEEE
DOI:
10.1109/fpl53798.2021.00076
Auteurs:
Christos P. Antonopoulos, Georgios Keramidas, Vassilis D. Tsakanikas, Evi Faliagka,
Christos Panagiotou, Nikolaos Voros
Publié dans:
2020 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Numéro 6-8 July 2020, 2020, ISBN 978-1-7281-5776-4
Éditeur:
IEEE Computer Society
DOI:
10.1109/isvlsi49217.2020.00-13
Auteurs:
Anna K. Lopez-Hernandez, J. Francisco Blanes Noguera
Publié dans:
Boosting Collaborative Networks 4.0 - 21st IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2020, Valencia, Spain, November 23–25, 2020, Proceedings, Numéro 598, 2020, Page(s) 608-620, ISBN 978-3-030-62411-8
Éditeur:
Springer International Publishing
DOI:
10.1007/978-3-030-62412-5_50
Auteurs:
Jóźwiak, Lech; Stojanovic, Radovan; Antonopoulos, Christos
Publié dans:
Proceedings of the 4th Summer School on Cyber-Physical Systems and Internet-of-Things, Vol. IV, 2023, Numéro 34, 2023, Page(s) 1-100
Éditeur:
Zenodo
DOI:
10.5281/zenodo.8113313
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