CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.
I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .
Risultati finali
Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Open Call Package of Documents 5Documents related to each Open Call delivered the month before launching the Open Call
First Periodic Report on Dissemination and Communication ActivitiesAll dissemination and communication activities and results will be summarized and compared against the designed KPIs
Second Periodic Report on Smart4ALL Ecosystem ActivitiesDetailed information about the activities performed to buildup and engage SMART4ALL ecosystem community the current status of the ecosystem and the results achieved
Second Version of Data Management Plan (DMP)Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
First Version of SMART4ALL Technology Services HandbookDetailed description of all the services offered by the SMART4ALL Marketplace
Final Periodic Report on Dissemination and Communication ActivitiesAll dissemination and communication activities and results will be summarized and compared against the designed KPIs
Open Call Package of Documents 9Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner S&CReport of Pathfinder Application Experiment by Partner SEEU
Open Call Package of Documents 7
Documents related to each Open Call delivered the month before launching the Open Call
Second Version of SMART4ALL DIHs Business PlanDocument that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Second Version of Business Plan of the SMART4ALL Thematic AreasDocument that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional national and European level
Ethics RequirementsReport describing the ethics requirements that the project must comply with. The report will be distributed to all SMART4ALL
Open Call Package of Documents 2Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner BTU CSSMART4ALL Project Management Handbook
Document summarising the administration and processes for SMART4ALL including data management plan, risk management, document storage and access, tendering, meetings and reporting
Report of Pathfinder Application Experiment by Partner UoPFinal Version of SMART4ALL DIHs Business Plan
Document that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Report of Pathfinder Application Experiment by Partner Red Pitaya d.d.First Version of Data Management Plan (DMP)
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
Report of Pathfinder Application Experiment by Partner UPVOpen Call Evaluation Reports 1
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner MarsecoOpen Call Package of Documents 4
Documents related to each Open Call delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner TU DelftReport of Pathfinder Application Experiment by Partner UPZ
Second Periodic Report on Dissemination and Communication Activities
All dissemination and communication activities and results will be summarized and compared against the designed KPIs
Report of Pathfinder Application Experiment by Partner MTUFinal Version of SMART4ALL Technology Services Handbook
Detailed description of all the services offered by the SMART4ALL Marketplace
Open Call Evaluation Reports 2Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner BMEFinal Periodic Report on Smart4ALL Ecosystem Activities
Detailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Open Call Evaluation Reports 3Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
First Version of Business Plan of the SMART4ALL Thematic AreasDocument that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Evaluation Reports 4Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Second Version of SMART4ALL Technology Services HandbookDetailed description of all the services offered by the SMART4ALL Marketplace
Project CollateralsPreparation of the printable materials of the project like press releases, posters, leaflets and slide deck for general presentations
Report of Pathfinder Application Experiment by Partner FTNOpen Call Evaluation Reports 8
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner TalTechReport of Pathfinder Application Experiment by Partner DLR
SMART4ALL website
Setup and maintenance of a SMART4ALL website to promote the project, the Open Calls, the third party PAE, the events etc.
Open Call Evaluation Reports 5Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Third Version of Data Management Plan (DMP)Report describing management of all datasets collected and generated in the project This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the nonEU partners of the project
First Periodic Report on Smart4ALL Ecosystem ActivitiesDetailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Report of Pathfinder Application Experiment by Partner MECOnetReport of Pathfinder Application Experiment by Partner PUT
Report of Pathfinder Application Experiment by Partner ATB
Final Version of Business Plan of the SMART4ALL Thematic Areas
Document that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Package of Documents 1Documents related to each Open Call, delivered the month before launching the Open Call
SMART4ALL Final Achievements and Lesson LearnedSummary of all major SMART4ALL results, achievements, and lessons-learned
Report of Pathfinder Application Experiment by Partner PSPReport of Pathfinder Application Experiment by Partner REZOS BRANDS
Report of Pathfinder Application Experiment by Partner ANV
Report of Pathfinder Application Experiment by Partner DPN
Open Call Package of Documents 6
Documents related to each Open Call delivered the month before launching the Open Call
Open Call Package of Documents 8Documents related to each Open Call delivered the month before launching the Open Call
First Version of SMART4ALL DIHs Business PlanDocument that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
SMART4ALL Sustainability PlanDocument that will describe the post-project operational processes of SMART4ALL DIH and the strategy for future expansion
Open Call Package of Documents 3Documents related to each Open Call, delivered the month before launching the Open Call
Open Call Evaluation Reports 7Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Open Call Evaluation Reports 9Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project.
The technology portal will be delivered. The design of the portal will be based on open-source technologies
Pubblicazioni
Autori:
Julian Balcerek, Paweł Pawłowski, Grzegorz Blajer, Jakub Filipkiewicz, Kamil Koćwin
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.57
Autori:
Paweł Pawłowski, Karol Piniarski, Adam Dąbrowski
Pubblicato in:
Sensors, Numero 21(2), 653, 2021, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s21020653
Autori:
Julian Balcerek ,Adam Konieczka ,Paweł Pawłowski ,Cyprian Dankowski ,Mateusz Firlej ,Piotr Fulara
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.47
Autori:
Michał Janeda, Paweł Pawłowski & Mariusz Ślachciński
Pubblicato in:
Journal of Analytical Chemistry, 2024, ISSN 1061-9348
Editore:
Springer Verlag
DOI:
10.1134/s1061934823120079
Autori:
Jakub SUDER , Tomasz MARCINIAK
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 2449-9544
Editore:
Czasopismo Stowarzyszenia Elektryków Polskich (SEP)
DOI:
10.15199/48.2023.11.47
Autori:
Jakub Suder, Kacper Podbucki, Tomasz Marciniak
Pubblicato in:
MDPI,Energies, 2023, ISSN 1996-1073
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/en16186677
Autori:
Kacper Podbuckia* , Jakub Sudera , Tomasz Marciniaka , Wojciech Mańczakb , Adam Dąbrowski
Pubblicato in:
Opto-Electronics Review, 2022, ISSN 1896-3757
Editore:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2022.143396
Autori:
Julian BALCEREK, Paweł PAWŁOWSKI, Błażej TRZCIŃSKI
Pubblicato in:
Przegląd Elektrotechniczny., 2023, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.58
Autori:
Piotr Góral,Paweł Pawłowski,Karol Piniarski, Adam Dąbrowski
Pubblicato in:
MDPI, Electronics, 2024, ISSN 2079-9292
Editore:
MDPI
DOI:
10.3390/electronics13030494
Autori:
Isak Shabani; Tonit Biba; Betim Çiço
Pubblicato in:
Computers; Volume 11; Numero 5; Pages: 79, Numero 17, 2022, Pagina/e 1-8, ISSN 2073-431X
Editore:
MDPI
DOI:
10.3390/computers11050079
Autori:
Zain Ul Abideen; Rui Wang; Tiago Diadami Perez; Geert-Jan Schrijen; Samuel Pagliarini
Pubblicato in:
IEEE Design & Test, Numero 18, 2024, Pagina/e 14-20, ISSN 2168-2356
Editore:
IEEE Computer Society
DOI:
10.1109/mdat.2023.3322621
Autori:
Miodrag Mihaljević ; Milan Todorović; Milica Knežević
Pubblicato in:
Symmetry, Vol 15, Iss 4, p 924 (2023), Numero 34, 2023, Pagina/e 1-10, ISSN 2073-8994
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/sym15040924
Autori:
Radosavljević, Miloš; Brkljač, Branko; Lugonja, Predrag; Crnojević, Vladimir; Trpovski, Željen; Xiong, Zixiang; Vukobratović, Dejan
Pubblicato in:
Remote Sensing, Vol 12, Iss 1590, p 1590 (2020), Numero 34, 2020, Pagina/e 1-10, ISSN 2072-4292
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/rs12101590
Autori:
Evanthia Faliagka; Vasileios Skarmintzos; Christos Panagiotou; Vasileios Syrimpeis; Christos P. Antonopoulos; Nikolaos Voros
Pubblicato in:
Electronics; Volume 12; Numero 16; Pages: 3375, Numero 10, 2023, Pagina/e 1-8, ISSN 2079-9292
Editore:
mdpi
DOI:
10.20944/preprints202306.1530.v1
Autori:
Ardo Allik; Kristjan Pilt; Moonika Viigimäe; Ivo Fridolin; Gert Jervan
Pubblicato in:
Sensors, Vol 22, Iss 4, p 1680 (2022), Numero 15, 2022, Pagina/e 1-8, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22041680
Autori:
Kacper PODBUCKI
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.40
Autori:
Matteo Antonio Scrugli; Bojan Blažica; Luigi Raffo; Paolo Meloni
Pubblicato in:
IEEE Access, Vol 11, Pp 70778-70794 (2023), Numero 8, 2023, Pagina/e 70778 - 70794, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3294097
Autori:
Kacper Podbucki, Tomasz Marciniak, Jakub Suder
Pubblicato in:
MDPI Appl. Sci.,, 2023, ISSN 2076-3417
Editore:
MDPI
DOI:
10.3390/app132413242
Autori:
Liapis, Alexandros; Faliagka, Evanthia; Antonopoulos, Christos P.; Keramidas, Georgios; Voros, Nikolaos
Pubblicato in:
Electronics, Vol 10, Iss 13, p 1550 (2021), Numero 31, 2021, Pagina/e 1-20, ISSN 2079-9292
Editore:
MDPI
DOI:
10.3390/electronics10131550
Autori:
Karol Piniarski, Paweł Pawłowski, Adam Dąbrowski
Pubblicato in:
Sensors, Numero 20/16, 2020, Pagina/e 4363, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s20164363
Autori:
Tomasz Marciniak ,Kacper Podbucki ,Jakub Suder
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.10.55
Autori:
Jakub Suder
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.50
Autori:
Lidija Krstanović; Branislav Popović; Marko Janev; Branko Brkljač
Pubblicato in:
Applied Sciences, Vol 12, Iss 7, p 3411 (2022), Numero 34, 2022, Pagina/e 1-10, ISSN 2076-3417
Editore:
MDPI
DOI:
10.3390/app12073411
Autori:
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Pubblicato in:
Electronics, Vol 10, Iss 1665, p 1665 (2021), Numero 29, 2021, Pagina/e 1-8, ISSN 2079-9292
Editore:
MDPI
DOI:
10.3390/electronics10141665
Autori:
Piotr GÓRAL ,Paweł PAWŁOWSKI ,Adam DĄBROWSKI
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.02.14
Autori:
Jakub SUDER
Pubblicato in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.41
Autori:
Jakub Suder, Kacper Podbucki, Tomasz Marciniak, Adam Dąbrowski
Pubblicato in:
Opto-Electronics Review, Numero 1896-3757, 2021, Pagina/e vol. 29 | Numer: no. 4, ISSN 1896-3757
Editore:
The Polish Academy of Science
DOI:
10.24425/opelre.2021.139383
Autori:
Kacper Podbucki,Jakub Suder, Tomasz Marciniak, Adam Dąbrowski
Pubblicato in:
Electrotechnical Review, Numero R. 97 | Numer: nr 2, 2021, Pagina/e 47 - 51, ISSN 0033-2097
Editore:
Wydawnictwo SIGMA
DOI:
10.15199/48.2021.02.12
Autori:
Jakub Suder , Kacper Podbucki , Tomasz Marciniak
Pubblicato in:
Opto-Electronics Review, 2023, ISSN 1896-3757
Editore:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2023.147040
Autori:
Radovan Stojanovic
Pubblicato in:
2020
Editore:
WORKS in PROGRESS in EMBEDDED COMPUTING (WiPiEC)
DOI:
10.13140/rg.2.2.30583.98721
Autori:
N.Voros, M.Huebner, C.Antonopoulos, G.Keramidas
Pubblicato in:
HiPEAC info 61, Numero 31/7/2020, 2020
Editore:
HiPEAC magazine
Autori:
Radovan Stojanovic
Pubblicato in:
2020
Editore:
MECOnet Podgorica
DOI:
10.13140/rg.2.2.32710.63040
Autori:
Lamir Shkurti, Mennan Selimi,Adrian Besimi
Pubblicato in:
CollaborateCom 2023, 2024, ISBN 978-3-031-54530-6
Editore:
Springer
DOI:
10.1007/978-3-031-54531-3_9
Autori:
András Wiesner; Tamás Kovácsházy
Pubblicato in:
2022 23rd International Carpathian Control Conference (ICCC), 2022, ISBN 978-1-6654-6636-3
Editore:
IEEE
DOI:
10.1109/iccc54292.2022.9805958
Autori:
Jakub Suder; Tomasz Marciniak; Kacper Podbucki; Adam Dąbrowski
Pubblicato in:
2022 International Symposium ELMAR, 2022
Editore:
IEEE
DOI:
10.1109/elmar55880.2022.9899807
Autori:
Alexandros Spournias; Panagiotis Bountas; Evanthia Faliagka; Dimitris Kontargiris; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Pubblicato in:
2021 10th Mediterranean Conference on Embedded Computing (MECO), Numero 22, 2021, Pagina/e 1-8, ISBN 978-1-6654-3912-1
Editore:
IEEE
DOI:
10.1109/meco52532.2021.9460154
Autori:
Paweł Pawłowski; Rafał Długosz; Marek Radkowski; Mateusz Wątły; Adam Dąbrowski
Pubblicato in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Editore:
IEEE
DOI:
10.23919/spa59660.2023.10274431
Autori:
Andras Wiesner; Tamas Kovacshazy
Pubblicato in:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Numero 3, 2021, Pagina/e 1-5, ISBN 978-1-7281-6484-7
Editore:
IEEE
DOI:
10.1109/ispcs49990.2021.9615250
Autori:
Viktor Vozar; Tamas Kovacshazy
Pubblicato in:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Numero 30, 2021, Pagina/e 1-8, ISBN 978-1-7281-6484-7
Editore:
IEEE
DOI:
10.1109/ispcs49990.2021.9615306
Autori:
Evanthia Faliagka; Christos Panagiotou; Christos Antonopoulos; Georgios Keramidas; Nikolaos Voros
Pubblicato in:
2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2022, ISBN 978-1-6654-6605-9
Editore:
IEEE
DOI:
10.1109/isvlsi54635.2022.00080
Autori:
Georgios Keramidas
Pubblicato in:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Numero 32, 2020, Pagina/e 1-10, ISBN 978-83-62065-39-4
Editore:
IEEE
DOI:
10.23919/spa50552.2020.9241304
Autori:
Tjark Schütte, Karuna Koch, V. Dworak, Cornelia Weltzien
Pubblicato in:
80th International Conference on Agricultural Engineering LAND.TECHNIK AgEng 2023, 2023
Editore:
LAND.TECHNIK AgEng 2023
DOI:
10.51202/9783181024270-199
Autori:
Tamás Kovácsházy; Zoltan Fodor
Pubblicato in:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Editore:
IEEE
DOI:
10.1109/ispcs59528.2023.10296994
Autori:
R. Stojanović, A. Škraba and B. Lutovac
Pubblicato in:
2020, Pagina/e 1-4
Editore:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134211.
Autori:
Piotr Góral; Pawel Pawłowski; Adam Dąbrowski
Pubblicato in:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Editore:
IEEE
DOI:
10.23919/spa53010.2022.9928022
Autori:
Jakub Suder,Tomasz Marciniak
Pubblicato in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Editore:
IEEE
DOI:
10.23919/spa59660.2023.10274434
Autori:
Jozwiak Lech; Stojanovic Radovan
Pubblicato in:
2nd Summer School on Cyber-Physical Systems and Internet-of-Things (SS-CPSIoT2021), Numero 9, 2021, Pagina/e 1-100, ISBN 978-9940-8795-0-1
Editore:
Zenodo
DOI:
10.5281/zenodo.5086365
Autori:
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dabrowski
Pubblicato in:
2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2022
Editore:
IEEE
DOI:
10.23919/mixdes55591.2022.9838167
Autori:
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Pubblicato in:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Editore:
IEEE
DOI:
10.23919/spa53010.2022.9927908
Autori:
Konstantinos Antonopoulos; Dimitrios Ringas; Eleni Christopoulou; Georgios Keramidas; Christos Antonopoulos; Nikolaos Voros
Pubblicato in:
2022 IEEE International Mediterranean Conference on Communications and Networking (MeditCom), 2022, ISBN 978-1-6654-9825-8
Editore:
IEEE
DOI:
10.1109/meditcom55741.2022.9928767
Autori:
Tamás Kovácsházy
Pubblicato in:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Editore:
IEEE
DOI:
10.1109/ispcs59528.2023.10296941
Autori:
Octavian M. Machidon; Andraž Krašovec; Alina L. Machidon; Veljko Pejović; Daniele Latini; Sarathchandrakumar T. Sasidharan; Fabio Del Frate
Pubblicato in:
NET4us '23: Proceedings of the 2nd Workshop on Networked Sensing Systems for a Sustainable Society, Numero 16, 2023, Pagina/e 193-200, ISBN 9798400703652
Editore:
ACM
DOI:
10.1145/3615991.3616405
Autori:
Alexandros Spournias; Evanthia Faliagka; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Pubblicato in:
2021 IEEE International Conference on Smart Internet of Things (SmartIoT), Numero 17, 2021, Pagina/e 1-8, ISBN 978-1-6654-4511-5
Editore:
IEEE
DOI:
10.1109/smartiot52359.2021.00071
Autori:
Panagiotis Mousouliotis, Topi Leppänen, Pekka Jääskeläinen, Nikos Petrellis, Panagiotis Christakos, Georgios Keramidas, Christos Antonopoulos & Nikolaos Voros
Pubblicato in:
Applied Reconfigurable Computing. Architectures, Tools, and Applications (ARC 2023), 2023, ISBN 978-3-031-42920-0
Editore:
Springer
DOI:
10.1007/978-3-031-42921-7_4
Autori:
Antonio Montalvo
Pubblicato in:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Numero 31, 2020, Pagina/e 1-10, ISBN 978-83-62065-39-4
Editore:
IEEE
DOI:
10.23919/spa50552.2020.9241258
Autori:
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dąbrowski
Pubblicato in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Editore:
IEEE
DOI:
10.23919/spa59660.2023.10274440
Autori:
A. Spournias, C. Antonopoulos, G. Keramidas, N. Voros and R. Stojanović
Pubblicato in:
2020
Editore:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134108.
Autori:
Radovan Stojanovic; Andrej Škraba
Pubblicato in:
MECO, Numero 11, 2021, Pagina/e 1-5, ISBN 978-1-6654-3912-1
Editore:
ΙΕΕΕ
DOI:
10.1109/meco52532.2021.9460178
Autori:
Alexandros Spournias; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros; Radovan Stojanovic
Pubblicato in:
MECO, Numero 11, 2020, Pagina/e 1-5, ISBN 978-1-7281-6949-1
Editore:
ΙΕΕΕ
DOI:
10.1109/meco49872.2020.9134108
Autori:
R. Stojanović, A. Škraba and B. Lutovac
Pubblicato in:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Numero 26, 2020, Pagina/e 1-8, ISBN 978-1-7281-6949-1
Editore:
IEEE
DOI:
10.1109/meco49872.2020.9134211
Autori:
Nikolaos S. Voros
Pubblicato in:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Numero 22, 2020, Pagina/e 1-8, ISBN 978-1-7281-6949-1
Editore:
IEEE
DOI:
10.1109/meco49872.2020.9134065
Autori:
Tamas Kovacshazy; Gabor Fekete
Pubblicato in:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Numero 28, 2022, Pagina/e 1-8, ISBN 978-1-6654-6828-2
Editore:
IEEE
DOI:
10.1109/meco55406.2022.9797123
Autori:
Julian Balcerek,Paweł Pawłowski
Pubblicato in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Editore:
IEEE
DOI:
10.23919/spa59660.2023.10274452
Autori:
Kacper Podbucki; Tomasz Marciniak
Pubblicato in:
Proceedings of the 17th Conference on Computer Science and Intelligence Systems, Numero 14, 2022, Pagina/e 117-120
Editore:
FedCSIS
DOI:
10.15439/2022f89
Autori:
Radovan Stojanovic; Andrej Skraba; Jovan Djurkovic; Budimir Lutovac
Pubblicato in:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Numero 33, 2022, Pagina/e 1-10, ISBN 978-1-6654-6828-2
Editore:
IEEE
DOI:
10.1109/meco55406.2022.9797085
Autori:
Evanthia Faliagka; Alexandros Spournias; Christos Antonopoulos; Nikolaos Voros
Pubblicato in:
2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2023, ISBN 978-83-63578-24-4
Editore:
IEEE
DOI:
10.23919/mixdes58562.2023.10203211
Autori:
Angelos S. Voros; Christos Panagiotou; Stavros Zogas; Georgios Keramidas; Christos P. Antonopoulos; Michael Hubner; Nikolaos S. Voros
Pubblicato in:
2021 31st International Conference on Field-Programmable Logic and Applications (FPL), Numero 23, 2021, Pagina/e 1-8, ISBN 978-1-6654-3759-2
Editore:
IEEE
DOI:
10.1109/fpl53798.2021.00076
Autori:
Christos P. Antonopoulos, Georgios Keramidas, Vassilis D. Tsakanikas, Evi Faliagka,
Christos Panagiotou, Nikolaos Voros
Pubblicato in:
2020 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Numero 6-8 July 2020, 2020, ISBN 978-1-7281-5776-4
Editore:
IEEE Computer Society
DOI:
10.1109/isvlsi49217.2020.00-13
Autori:
Anna K. Lopez-Hernandez, J. Francisco Blanes Noguera
Pubblicato in:
Boosting Collaborative Networks 4.0 - 21st IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2020, Valencia, Spain, November 23–25, 2020, Proceedings, Numero 598, 2020, Pagina/e 608-620, ISBN 978-3-030-62411-8
Editore:
Springer International Publishing
DOI:
10.1007/978-3-030-62412-5_50
Autori:
Jóźwiak, Lech; Stojanovic, Radovan; Antonopoulos, Christos
Pubblicato in:
Proceedings of the 4th Summer School on Cyber-Physical Systems and Internet-of-Things, Vol. IV, 2023, Numero 34, 2023, Pagina/e 1-100
Editore:
Zenodo
DOI:
10.5281/zenodo.8113313
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