CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Open Call Package of Documents 5 (opens in new window)Documents related to each Open Call delivered the month before launching the Open Call
First Periodic Report on Dissemination and Communication Activities (opens in new window)All dissemination and communication activities and results will be summarized and compared against the designed KPIs
Second Periodic Report on Smart4ALL Ecosystem Activities (opens in new window)Detailed information about the activities performed to buildup and engage SMART4ALL ecosystem community the current status of the ecosystem and the results achieved
Second Version of Data Management Plan (DMP) (opens in new window)Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
First Version of SMART4ALL Technology Services Handbook (opens in new window)Detailed description of all the services offered by the SMART4ALL Marketplace
Final Periodic Report on Dissemination and Communication Activities (opens in new window)All dissemination and communication activities and results will be summarized and compared against the designed KPIs
Open Call Package of Documents 9 (opens in new window)Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner S&C (opens in new window)Report of Pathfinder Application Experiment by Partner SEEU (opens in new window)
Open Call Package of Documents 7 (opens in new window)
Documents related to each Open Call delivered the month before launching the Open Call
Second Version of SMART4ALL DIHs Business Plan (opens in new window)Document that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Second Version of Business Plan of the SMART4ALL Thematic Areas (opens in new window)Document that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional national and European level
Ethics Requirements (opens in new window)Report describing the ethics requirements that the project must comply with. The report will be distributed to all SMART4ALL
Open Call Package of Documents 2 (opens in new window)Documents related to each Open Call, delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner BTU CS (opens in new window)SMART4ALL Project Management Handbook (opens in new window)
Document summarising the administration and processes for SMART4ALL including data management plan, risk management, document storage and access, tendering, meetings and reporting
Report of Pathfinder Application Experiment by Partner UoP (opens in new window)Final Version of SMART4ALL DIHs Business Plan (opens in new window)
Document that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
Report of Pathfinder Application Experiment by Partner Red Pitaya d.d. (opens in new window)First Version of Data Management Plan (DMP) (opens in new window)
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project
Report of Pathfinder Application Experiment by Partner UPV (opens in new window)Open Call Evaluation Reports 1 (opens in new window)
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner Marseco (opens in new window)Open Call Package of Documents 4 (opens in new window)
Documents related to each Open Call delivered the month before launching the Open Call
Report of Pathfinder Application Experiment by Partner TU Delft (opens in new window)Report of Pathfinder Application Experiment by Partner UPZ (opens in new window)
Second Periodic Report on Dissemination and Communication Activities (opens in new window)
All dissemination and communication activities and results will be summarized and compared against the designed KPIs
Report of Pathfinder Application Experiment by Partner MTU (opens in new window)Final Version of SMART4ALL Technology Services Handbook (opens in new window)
Detailed description of all the services offered by the SMART4ALL Marketplace
Open Call Evaluation Reports 2 (opens in new window)Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner BME (opens in new window)Final Periodic Report on Smart4ALL Ecosystem Activities (opens in new window)
Detailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Open Call Evaluation Reports 3 (opens in new window)Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
First Version of Business Plan of the SMART4ALL Thematic Areas (opens in new window)Document that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Evaluation Reports 4 (opens in new window)Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Second Version of SMART4ALL Technology Services Handbook (opens in new window)Detailed description of all the services offered by the SMART4ALL Marketplace
Project Collaterals (opens in new window)Preparation of the printable materials of the project like press releases, posters, leaflets and slide deck for general presentations
Report of Pathfinder Application Experiment by Partner FTN (opens in new window)Open Call Evaluation Reports 8 (opens in new window)
Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report of Pathfinder Application Experiment by Partner TalTech (opens in new window)Report of Pathfinder Application Experiment by Partner DLR (opens in new window)
SMART4ALL website (opens in new window)
Setup and maintenance of a SMART4ALL website to promote the project, the Open Calls, the third party PAE, the events etc.
Open Call Evaluation Reports 5 (opens in new window)Report including a summary of the OC management and evaluation process delivered the month after the FSTP Agreement signature
Third Version of Data Management Plan (DMP) (opens in new window)Report describing management of all datasets collected and generated in the project This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the nonEU partners of the project
First Periodic Report on Smart4ALL Ecosystem Activities (opens in new window)Detailed information about the activities performed to build-up and engage SMART4ALL ecosystem community, the current status of the ecosystem, and the results achieved
Report of Pathfinder Application Experiment by Partner MECOnet (opens in new window)Report of Pathfinder Application Experiment by Partner PUT (opens in new window)
Report of Pathfinder Application Experiment by Partner ATB (opens in new window)
Final Version of Business Plan of the SMART4ALL Thematic Areas (opens in new window)
Document that will describe the Business plans of the four SMART4ALL thematic areas including financial opportunities at the regional, national, and European level
Open Call Package of Documents 1 (opens in new window)Documents related to each Open Call, delivered the month before launching the Open Call
SMART4ALL Final Achievements and Lesson Learned (opens in new window)Summary of all major SMART4ALL results, achievements, and lessons-learned
Report of Pathfinder Application Experiment by Partner PSP (opens in new window)Report of Pathfinder Application Experiment by Partner REZOS BRANDS (opens in new window)
Report of Pathfinder Application Experiment by Partner ANV (opens in new window)
Report of Pathfinder Application Experiment by Partner DPN (opens in new window)
Open Call Package of Documents 6 (opens in new window)
Documents related to each Open Call delivered the month before launching the Open Call
Open Call Package of Documents 8 (opens in new window)Documents related to each Open Call delivered the month before launching the Open Call
First Version of SMART4ALL DIHs Business Plan (opens in new window)Document that will describe the SMART4ALL Business plan including financial opportunities for SMART4ALL DIHs
SMART4ALL Sustainability Plan (opens in new window)Document that will describe the post-project operational processes of SMART4ALL DIH and the strategy for future expansion
Open Call Package of Documents 3 (opens in new window)Documents related to each Open Call, delivered the month before launching the Open Call
Open Call Evaluation Reports 7 (opens in new window)Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Open Call Evaluation Reports 9 (opens in new window)Report including a summary of the OC management and evaluation process, delivered the month after the FSTP Agreement signature
Report describing management of all datasets collected and generated in the project. This report will also include a session to clearly identify the material and exported from the SMART4ALL project to the non-EU partners of the project.
The technology portal will be delivered. The design of the portal will be based on open-source technologies
Publications
Author(s):
Julian Balcerek, Paweł Pawłowski, Grzegorz Blajer, Jakub Filipkiewicz, Kamil Koćwin
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.57
Author(s):
Paweł Pawłowski, Karol Piniarski, Adam Dąbrowski
Published in:
Sensors, Issue 21(2), 653, 2021, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s21020653
Author(s):
Julian Balcerek ,Adam Konieczka ,Paweł Pawłowski ,Cyprian Dankowski ,Mateusz Firlej ,Piotr Fulara
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.47
Author(s):
Michał Janeda, Paweł Pawłowski & Mariusz Ślachciński
Published in:
Journal of Analytical Chemistry, 2024, ISSN 1061-9348
Publisher:
Springer Verlag
DOI:
10.1134/s1061934823120079
Author(s):
Jakub SUDER , Tomasz MARCINIAK
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2023, ISSN 2449-9544
Publisher:
Czasopismo Stowarzyszenia Elektryków Polskich (SEP)
DOI:
10.15199/48.2023.11.47
Author(s):
Jakub Suder, Kacper Podbucki, Tomasz Marciniak
Published in:
MDPI,Energies, 2023, ISSN 1996-1073
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/en16186677
Author(s):
Kacper Podbuckia* , Jakub Sudera , Tomasz Marciniaka , Wojciech Mańczakb , Adam Dąbrowski
Published in:
Opto-Electronics Review, 2022, ISSN 1896-3757
Publisher:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2022.143396
Author(s):
Julian BALCEREK, Paweł PAWŁOWSKI, Błażej TRZCIŃSKI
Published in:
Przegląd Elektrotechniczny., 2023, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2023.10.58
Author(s):
Piotr Góral,Paweł Pawłowski,Karol Piniarski, Adam Dąbrowski
Published in:
MDPI, Electronics, 2024, ISSN 2079-9292
Publisher:
MDPI
DOI:
10.3390/electronics13030494
Author(s):
Isak Shabani; Tonit Biba; Betim Çiço
Published in:
Computers; Volume 11; Issue 5; Pages: 79, Issue 17, 2022, Page(s) 1-8, ISSN 2073-431X
Publisher:
MDPI
DOI:
10.3390/computers11050079
Author(s):
Zain Ul Abideen; Rui Wang; Tiago Diadami Perez; Geert-Jan Schrijen; Samuel Pagliarini
Published in:
IEEE Design & Test, Issue 18, 2024, Page(s) 14-20, ISSN 2168-2356
Publisher:
IEEE Computer Society
DOI:
10.1109/mdat.2023.3322621
Author(s):
Miodrag Mihaljević ; Milan Todorović; Milica Knežević
Published in:
Symmetry, Vol 15, Iss 4, p 924 (2023), Issue 34, 2023, Page(s) 1-10, ISSN 2073-8994
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/sym15040924
Author(s):
Radosavljević, Miloš; Brkljač, Branko; Lugonja, Predrag; Crnojević, Vladimir; Trpovski, Željen; Xiong, Zixiang; Vukobratović, Dejan
Published in:
Remote Sensing, Vol 12, Iss 1590, p 1590 (2020), Issue 34, 2020, Page(s) 1-10, ISSN 2072-4292
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/rs12101590
Author(s):
Evanthia Faliagka; Vasileios Skarmintzos; Christos Panagiotou; Vasileios Syrimpeis; Christos P. Antonopoulos; Nikolaos Voros
Published in:
Electronics; Volume 12; Issue 16; Pages: 3375, Issue 10, 2023, Page(s) 1-8, ISSN 2079-9292
Publisher:
mdpi
DOI:
10.20944/preprints202306.1530.v1
Author(s):
Ardo Allik; Kristjan Pilt; Moonika Viigimäe; Ivo Fridolin; Gert Jervan
Published in:
Sensors, Vol 22, Iss 4, p 1680 (2022), Issue 15, 2022, Page(s) 1-8, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22041680
Author(s):
Kacper PODBUCKI
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.40
Author(s):
Matteo Antonio Scrugli; Bojan Blažica; Luigi Raffo; Paolo Meloni
Published in:
IEEE Access, Vol 11, Pp 70778-70794 (2023), Issue 8, 2023, Page(s) 70778 - 70794, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3294097
Author(s):
Kacper Podbucki, Tomasz Marciniak, Jakub Suder
Published in:
MDPI Appl. Sci.,, 2023, ISSN 2076-3417
Publisher:
MDPI
DOI:
10.3390/app132413242
Author(s):
Liapis, Alexandros; Faliagka, Evanthia; Antonopoulos, Christos P.; Keramidas, Georgios; Voros, Nikolaos
Published in:
Electronics, Vol 10, Iss 13, p 1550 (2021), Issue 31, 2021, Page(s) 1-20, ISSN 2079-9292
Publisher:
MDPI
DOI:
10.3390/electronics10131550
Author(s):
Karol Piniarski, Paweł Pawłowski, Adam Dąbrowski
Published in:
Sensors, Issue 20/16, 2020, Page(s) 4363, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s20164363
Author(s):
Tomasz Marciniak ,Kacper Podbucki ,Jakub Suder
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.10.55
Author(s):
Jakub Suder
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.09.50
Author(s):
Lidija Krstanović; Branislav Popović; Marko Janev; Branko Brkljač
Published in:
Applied Sciences, Vol 12, Iss 7, p 3411 (2022), Issue 34, 2022, Page(s) 1-10, ISSN 2076-3417
Publisher:
MDPI
DOI:
10.3390/app12073411
Author(s):
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Published in:
Electronics, Vol 10, Iss 1665, p 1665 (2021), Issue 29, 2021, Page(s) 1-8, ISSN 2079-9292
Publisher:
MDPI
DOI:
10.3390/electronics10141665
Author(s):
Piotr GÓRAL ,Paweł PAWŁOWSKI ,Adam DĄBROWSKI
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.02.14
Author(s):
Jakub SUDER
Published in:
PRZEGLĄD ELEKTROTECHNICZNY, 2022, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2022.01.41
Author(s):
Jakub Suder, Kacper Podbucki, Tomasz Marciniak, Adam Dąbrowski
Published in:
Opto-Electronics Review, Issue 1896-3757, 2021, Page(s) vol. 29 | Numer: no. 4, ISSN 1896-3757
Publisher:
The Polish Academy of Science
DOI:
10.24425/opelre.2021.139383
Author(s):
Kacper Podbucki,Jakub Suder, Tomasz Marciniak, Adam Dąbrowski
Published in:
Electrotechnical Review, Issue R. 97 | Numer: nr 2, 2021, Page(s) 47 - 51, ISSN 0033-2097
Publisher:
Wydawnictwo SIGMA
DOI:
10.15199/48.2021.02.12
Author(s):
Jakub Suder , Kacper Podbucki , Tomasz Marciniak
Published in:
Opto-Electronics Review, 2023, ISSN 1896-3757
Publisher:
Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology
DOI:
10.24425/opelre.2023.147040
Author(s):
Radovan Stojanovic
Published in:
2020
Publisher:
WORKS in PROGRESS in EMBEDDED COMPUTING (WiPiEC)
DOI:
10.13140/rg.2.2.30583.98721
Author(s):
N.Voros, M.Huebner, C.Antonopoulos, G.Keramidas
Published in:
HiPEAC info 61, Issue 31/7/2020, 2020
Publisher:
HiPEAC magazine
Author(s):
Radovan Stojanovic
Published in:
2020
Publisher:
MECOnet Podgorica
DOI:
10.13140/rg.2.2.32710.63040
Author(s):
Lamir Shkurti, Mennan Selimi,Adrian Besimi
Published in:
CollaborateCom 2023, 2024, ISBN 978-3-031-54530-6
Publisher:
Springer
DOI:
10.1007/978-3-031-54531-3_9
Author(s):
András Wiesner; Tamás Kovácsházy
Published in:
2022 23rd International Carpathian Control Conference (ICCC), 2022, ISBN 978-1-6654-6636-3
Publisher:
IEEE
DOI:
10.1109/iccc54292.2022.9805958
Author(s):
Jakub Suder; Tomasz Marciniak; Kacper Podbucki; Adam Dąbrowski
Published in:
2022 International Symposium ELMAR, 2022
Publisher:
IEEE
DOI:
10.1109/elmar55880.2022.9899807
Author(s):
Alexandros Spournias; Panagiotis Bountas; Evanthia Faliagka; Dimitris Kontargiris; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Published in:
2021 10th Mediterranean Conference on Embedded Computing (MECO), Issue 22, 2021, Page(s) 1-8, ISBN 978-1-6654-3912-1
Publisher:
IEEE
DOI:
10.1109/meco52532.2021.9460154
Author(s):
Paweł Pawłowski; Rafał Długosz; Marek Radkowski; Mateusz Wątły; Adam Dąbrowski
Published in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Publisher:
IEEE
DOI:
10.23919/spa59660.2023.10274431
Author(s):
Andras Wiesner; Tamas Kovacshazy
Published in:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Issue 3, 2021, Page(s) 1-5, ISBN 978-1-7281-6484-7
Publisher:
IEEE
DOI:
10.1109/ispcs49990.2021.9615250
Author(s):
Viktor Vozar; Tamas Kovacshazy
Published in:
2021 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), Issue 30, 2021, Page(s) 1-8, ISBN 978-1-7281-6484-7
Publisher:
IEEE
DOI:
10.1109/ispcs49990.2021.9615306
Author(s):
Evanthia Faliagka; Christos Panagiotou; Christos Antonopoulos; Georgios Keramidas; Nikolaos Voros
Published in:
2022 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2022, ISBN 978-1-6654-6605-9
Publisher:
IEEE
DOI:
10.1109/isvlsi54635.2022.00080
Author(s):
Georgios Keramidas
Published in:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Issue 32, 2020, Page(s) 1-10, ISBN 978-83-62065-39-4
Publisher:
IEEE
DOI:
10.23919/spa50552.2020.9241304
Author(s):
Tjark Schütte, Karuna Koch, V. Dworak, Cornelia Weltzien
Published in:
80th International Conference on Agricultural Engineering LAND.TECHNIK AgEng 2023, 2023
Publisher:
LAND.TECHNIK AgEng 2023
DOI:
10.51202/9783181024270-199
Author(s):
Tamás Kovácsházy; Zoltan Fodor
Published in:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Publisher:
IEEE
DOI:
10.1109/ispcs59528.2023.10296994
Author(s):
R. Stojanović, A. Škraba and B. Lutovac
Published in:
2020, Page(s) 1-4
Publisher:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134211.
Author(s):
Piotr Góral; Pawel Pawłowski; Adam Dąbrowski
Published in:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Publisher:
IEEE
DOI:
10.23919/spa53010.2022.9928022
Author(s):
Jakub Suder,Tomasz Marciniak
Published in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Publisher:
IEEE
DOI:
10.23919/spa59660.2023.10274434
Author(s):
Jozwiak Lech; Stojanovic Radovan
Published in:
2nd Summer School on Cyber-Physical Systems and Internet-of-Things (SS-CPSIoT2021), Issue 9, 2021, Page(s) 1-100, ISBN 978-9940-8795-0-1
Publisher:
Zenodo
DOI:
10.5281/zenodo.5086365
Author(s):
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dabrowski
Published in:
2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2022
Publisher:
IEEE
DOI:
10.23919/mixdes55591.2022.9838167
Author(s):
Jakub Suder; Kacper Podbucki; Tomasz Marciniak; Adam Dąbrowski
Published in:
2022 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2022
Publisher:
IEEE
DOI:
10.23919/spa53010.2022.9927908
Author(s):
Konstantinos Antonopoulos; Dimitrios Ringas; Eleni Christopoulou; Georgios Keramidas; Christos Antonopoulos; Nikolaos Voros
Published in:
2022 IEEE International Mediterranean Conference on Communications and Networking (MeditCom), 2022, ISBN 978-1-6654-9825-8
Publisher:
IEEE
DOI:
10.1109/meditcom55741.2022.9928767
Author(s):
Tamás Kovácsházy
Published in:
2023 IEEE International Symposium on Precision Clock Synchronization for Measurement, Control, and Communication (ISPCS), 2023, ISBN 979-8-3503-1358-1
Publisher:
IEEE
DOI:
10.1109/ispcs59528.2023.10296941
Author(s):
Octavian M. Machidon; Andraž Krašovec; Alina L. Machidon; Veljko Pejović; Daniele Latini; Sarathchandrakumar T. Sasidharan; Fabio Del Frate
Published in:
NET4us '23: Proceedings of the 2nd Workshop on Networked Sensing Systems for a Sustainable Society, Issue 16, 2023, Page(s) 193-200, ISBN 9798400703652
Publisher:
ACM
DOI:
10.1145/3615991.3616405
Author(s):
Alexandros Spournias; Evanthia Faliagka; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros
Published in:
2021 IEEE International Conference on Smart Internet of Things (SmartIoT), Issue 17, 2021, Page(s) 1-8, ISBN 978-1-6654-4511-5
Publisher:
IEEE
DOI:
10.1109/smartiot52359.2021.00071
Author(s):
Panagiotis Mousouliotis, Topi Leppänen, Pekka Jääskeläinen, Nikos Petrellis, Panagiotis Christakos, Georgios Keramidas, Christos Antonopoulos & Nikolaos Voros
Published in:
Applied Reconfigurable Computing. Architectures, Tools, and Applications (ARC 2023), 2023, ISBN 978-3-031-42920-0
Publisher:
Springer
DOI:
10.1007/978-3-031-42921-7_4
Author(s):
Antonio Montalvo
Published in:
2020 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), Issue 31, 2020, Page(s) 1-10, ISBN 978-83-62065-39-4
Publisher:
IEEE
DOI:
10.23919/spa50552.2020.9241258
Author(s):
Kacper Podbucki; Jakub Suder; Tomasz Marciniak; Adam Dąbrowski
Published in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Publisher:
IEEE
DOI:
10.23919/spa59660.2023.10274440
Author(s):
A. Spournias, C. Antonopoulos, G. Keramidas, N. Voros and R. Stojanović
Published in:
2020
Publisher:
9th Mediterranean Conference on Embedded Computing (MECO)
DOI:
10.1109/meco49872.2020.9134108.
Author(s):
Radovan Stojanovic; Andrej Škraba
Published in:
MECO, Issue 11, 2021, Page(s) 1-5, ISBN 978-1-6654-3912-1
Publisher:
ΙΕΕΕ
DOI:
10.1109/meco52532.2021.9460178
Author(s):
Alexandros Spournias; Christos P. Antonopoulos; Georgios Keramidas; Nikolaos S. Voros; Radovan Stojanovic
Published in:
MECO, Issue 11, 2020, Page(s) 1-5, ISBN 978-1-7281-6949-1
Publisher:
ΙΕΕΕ
DOI:
10.1109/meco49872.2020.9134108
Author(s):
R. Stojanović, A. Škraba and B. Lutovac
Published in:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Issue 26, 2020, Page(s) 1-8, ISBN 978-1-7281-6949-1
Publisher:
IEEE
DOI:
10.1109/meco49872.2020.9134211
Author(s):
Nikolaos S. Voros
Published in:
2020 9th Mediterranean Conference on Embedded Computing (MECO), Issue 22, 2020, Page(s) 1-8, ISBN 978-1-7281-6949-1
Publisher:
IEEE
DOI:
10.1109/meco49872.2020.9134065
Author(s):
Tamas Kovacshazy; Gabor Fekete
Published in:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Issue 28, 2022, Page(s) 1-8, ISBN 978-1-6654-6828-2
Publisher:
IEEE
DOI:
10.1109/meco55406.2022.9797123
Author(s):
Julian Balcerek,Paweł Pawłowski
Published in:
2023 Signal Processing: Algorithms, Architectures, Arrangements, and Applications (SPA), 2023
Publisher:
IEEE
DOI:
10.23919/spa59660.2023.10274452
Author(s):
Kacper Podbucki; Tomasz Marciniak
Published in:
Proceedings of the 17th Conference on Computer Science and Intelligence Systems, Issue 14, 2022, Page(s) 117-120
Publisher:
FedCSIS
DOI:
10.15439/2022f89
Author(s):
Radovan Stojanovic; Andrej Skraba; Jovan Djurkovic; Budimir Lutovac
Published in:
2022 11th Mediterranean Conference on Embedded Computing (MECO), Issue 33, 2022, Page(s) 1-10, ISBN 978-1-6654-6828-2
Publisher:
IEEE
DOI:
10.1109/meco55406.2022.9797085
Author(s):
Evanthia Faliagka; Alexandros Spournias; Christos Antonopoulos; Nikolaos Voros
Published in:
2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES), 2023, ISBN 978-83-63578-24-4
Publisher:
IEEE
DOI:
10.23919/mixdes58562.2023.10203211
Author(s):
Angelos S. Voros; Christos Panagiotou; Stavros Zogas; Georgios Keramidas; Christos P. Antonopoulos; Michael Hubner; Nikolaos S. Voros
Published in:
2021 31st International Conference on Field-Programmable Logic and Applications (FPL), Issue 23, 2021, Page(s) 1-8, ISBN 978-1-6654-3759-2
Publisher:
IEEE
DOI:
10.1109/fpl53798.2021.00076
Author(s):
Christos P. Antonopoulos, Georgios Keramidas, Vassilis D. Tsakanikas, Evi Faliagka,
Christos Panagiotou, Nikolaos Voros
Published in:
2020 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), Issue 6-8 July 2020, 2020, ISBN 978-1-7281-5776-4
Publisher:
IEEE Computer Society
DOI:
10.1109/isvlsi49217.2020.00-13
Author(s):
Anna K. Lopez-Hernandez, J. Francisco Blanes Noguera
Published in:
Boosting Collaborative Networks 4.0 - 21st IFIP WG 5.5 Working Conference on Virtual Enterprises, PRO-VE 2020, Valencia, Spain, November 23–25, 2020, Proceedings, Issue 598, 2020, Page(s) 608-620, ISBN 978-3-030-62411-8
Publisher:
Springer International Publishing
DOI:
10.1007/978-3-030-62412-5_50
Author(s):
Jóźwiak, Lech; Stojanovic, Radovan; Antonopoulos, Christos
Published in:
Proceedings of the 4th Summer School on Cyber-Physical Systems and Internet-of-Things, Vol. IV, 2023, Issue 34, 2023, Page(s) 1-100
Publisher:
Zenodo
DOI:
10.5281/zenodo.8113313
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