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The first technology enabling large-scale gallium nitride industrialisation for mainstream power electronics and RF applications

Project description

Gallium nitride – the new 'silicon'

Electronic components and systems (ECS) are essential for Europe’s industrial landscape. They underpin product and productivity innovation across the whole economy and play a critical role in addressing societal challenges. Currently, ECS are fully dependent on semiconductor materials with over 90 % of them being silicon-based. To modernise the energy grid and allow for sustainable energy production, new semiconductor technologies based on gallium nitride (GaN) are being explored. The EU-funded eleGaNt project will develop a newly patented method of growing GaN semiconductor layers of unprecedented quality on any substrate. This method introduces a new era of semiconductor wafer tech that could potentially replace silicon in the multi-billion power electronics industry.

Objective

As the world becomes digitalized, the need for more energy efficient, faster and better performing Electronic Components and Systems (ECS) becomes paramount. These ECS are fully dependent on the semiconductor materials within, currently over 90% silicon (Si)-based. Pure Si technology can no longer cater to the needs placed upon ECS for power electronics and RF applications and thus new semiconductor technologies based on gallium nitride (GaN) are being explored. GaN material properties make it the primary choice for future generations of energy-efficient, high performance power electronics devices, necessary to modernize the energy grid and allow for sustainable energy production and use. However, bulk GaN is prohibitively expensive and thus inaccessible to mainstream applications. The main approach to making the technology commercially viable, reducing its cost significantly, is growing GaN layers on other materials, such as Si. Today, this poses a major technical barrier: existing methods result in high defect densities in the GaN layers, offering a fraction of the efficiency of bulk GaN and therefore poor ECS performance. Switching to GaN-on-Si today thus offers very limited advantages. To harness the full potential of GaN in a commercially viable way, we, at Hexagem, have developed EleGaNt, a cutting-edge new method of growing GaN semiconductor layers of unprecedented quality on any substrate. EleGaNt is the first to deliver capabilities on par with bulk GaN at the cost of current market-available underperforming GaN-on-Si. Our patented EleGaNt growth method introduces a new era of semiconductor wafer tech for an energy efficient power and RF electronics market and has the potential to become the new silicon in the multi-billion power electronics industry, whilst also offering a route towards expanding the TAM for GaN tech. We will license our tech to ECS manufacturers for integration into their fabs, whilst we remain a cutting-edge tech development company.

Call for proposal

H2020-EIC-SMEInst-2018-2020

See other projects for this call

Sub call

H2020-SMEInst-2018-2020-2

Coordinator

HEXAGEM AB
Net EU contribution
€ 2 044 471,63
Address
IDEON ALFA 3 SCHEELEVAGEN 15
223 63 Lund
Sweden

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Södra Sverige Sydsverige Skåne län
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 2 920 673,75