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Ai for New Devices And Technologies at the Edge

Project description

Building the AI foundations for innovative hardware and software

Edge computing is creating new possibilities in Internet of Things (IoT) applications. To create the AI foundations for future products in the edge IoT domain, the EU-funded ANDANTE project aims to leverage innovative IC (integrated circuits) accelerators based on artificial and spiking neural networks in order to build strong hardware and software platforms for application developments. Moreover, the resulting IoT devices will combine extreme power efficiency with robust neuromorphic computing capabilities. By achieving efficient cross-fertilisation between major European foundries, chip designers, system houses, application companies and research partners, the project will build and expand the European ecosystem around the definition, development, production and application of neuromorphic ICs. The project’s work will promote innovative hardware and software deep-learning solutions for future IoT at the edge products that combine extreme power efficiency as well as robust and powerful cognitive computing capabilities.

Objective

The fundamental goal of the ANDANTE project is to leverage innovative hardware platforms to build strong hardware / software platforms for artificial neural networks (ANN) and spiking neural networks (SNN) as a basis for future products in the Edge IoT domain, combining extreme power efficiency with robust neuromorphic computing capabilities and demonstrate them in key application areas.
The main objective of ANDANTE is to build and expand the European eco-system around the definition, development, production and application of neuromorphic hardware through an efficient cross-fertilization between major European foundries, chip design, system houses, application companies and research partners, as presented by the European Leader Group (ELG).
The project brings together world class expertise to bring the world class expertise and infrastructures of Imec, CEA and FhG together with semiconductor companies, fabless, system houses, SMEs and application experts to explore and demonstrate the capabilities provided by the developed technologies. In the project, several applications will be assessed in key domains where Europe is strong (automotive, digital farming, digital industry, mobility and digital life). The aim is to reinforce and maintain strong leadership in these areas by bringing industry in contact with future memory technologies at a low TRL level (MRAM, OXRAM, FeFET). These cross-disciplinary efforts will lead to development of innovative hardware / software deep learning solutions, based on high TRL level RRAM/PCM and FeFET, to enable future products which combine extreme power efficiency with robust cognitive computing capabilities. This new kind of computing technology, combining ANN and SNN capabilities, will open new perspectives, for instance, environmental monitoring, and wearable electronics.

Keywords

Call for proposal

H2020-ECSEL-2019-2-RIA-two-stage

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Sub call

H2020-ECSEL-2019-2-RIA

Coordinator

STMICROELECTRONICS GRENOBLE 2 SAS
Net EU contribution
€ 742 186,56
Address
RUE JULES HOROWITZ 12
38000 Grenoble
France

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Region
Auvergne-Rhône-Alpes Rhône-Alpes Isère
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost
€ 2 968 746,25

Participants (30)