Project description DEENESFRITPL Thermal management in 3D stacked chip multiprocessors Given the stagnation in process technology scaling, new memory technologies are being investigated. Characterised by better scalability and lower static leakage, non-volatile memories (NVM) could replace conventional static random access memories. However, many of the proposed NVM technologies are sensitive to heat, which may compromise their reliability. To tackle this problem, the EU-funded TECTONIC project aims to manage on-chip temperature and eliminate hot spots in 3D stacked chip multiprocessors. It will achieve this by leveraging application-specific knowledge extracted at compile time, in combination with new hardware mechanisms for distributing computational work and memory accesses. This will result in even heat distribution while maintaining high performance. Show the project objective Hide the project objective Objective The goal of the TECTONIC project is to alleviate the challenging problem of hot-spots in 3D stacked chip-multiprocessors by employing a software-hardware based combined approach. With the stagnation in process technology scaling new emerging memory technologies are investigated. Promise of better scalability with reduced static leakage makes Non-volatile memories (NVM) as the potential candidates to replace conventional SRAM. However, many of the proposed NVM technologies are sensitive to heat, that raised up the issue of reliability. Considering heat dissipation as an exclusive issue of hardware will not be the appropriate approach towards finding out the solutions, as running-application has direct impacts on on-chip thermal imbalance. Hence, TECTONIC will manage the on-chip temperature and eliminate hot-spots by leveraging application specific knowledge extracted at compile time in combination with new hardware mechanisms for distributing computational work and memory accesses for even heat distribution while maintaining high performance. Fields of science natural sciencescomputer and information sciencesengineering and technology Keywords Compilers Computer Architecture Caches Multi-cores 3D-CMPs Energy and Thermal management Emerging Memory Technologies Programme(s) H2020-EU.1.3. - EXCELLENT SCIENCE - Marie Skłodowska-Curie Actions Main Programme H2020-EU.1.3.2. - Nurturing excellence by means of cross-border and cross-sector mobility Topic(s) MSCA-IF-2019 - Individual Fellowships Call for proposal H2020-MSCA-IF-2019 See other projects for this call Funding Scheme MSCA-IF - Marie Skłodowska-Curie Individual Fellowships (IF) Coordinator NORGES TEKNISK-NATURVITENSKAPELIGE UNIVERSITET NTNU Net EU contribution € 214 158,72 Address HOGSKOLERINGEN 1 7491 Trondheim Norway See on map Region Norge Trøndelag Trøndelag Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost € 214 158,72
