Periodic Reporting for period 2 - ATOPLOT (The atomic-layer 3D plotter)
Periodo di rendicontazione: 2021-05-01 al 2022-04-30
The overall aim of ATOPLOT project is to mature, extend capabilities and prove full functionality and benefits of the ATLANT3D Nanofabricator. ATOPLOT brings together a consortium of three SMEs (ATL, FEM, SEMPA) and two academic partners (FAU, SAS) – in unison representing a technical side specialized in nanofabrication, and a business side with experience in business development and B2B sales & marketing. The consortium expects a successful market introduction of the Nanofabricator within the next 3 years, tapping into a large business opportunity, from which the partners stand to capture more than 400M€ as profit and directly creating 165+ new jobs.
--- Design and fabrication of a gas delivery micronozzle that defines a microfluidic environment and thereby provides a microscale ALD reactor that is highly constrained laterally;
--- Design and assembly of a prototype that includes precursor management, gas delivery, sample motion, heating, and automation;
--- Development of deposition chemistry and characterization of process parameters for two oxide materials, TiO2 and ZnO, and a metal, Pt;
--- Characterization of the deposit's properties (chemical composition, morphology, geometric parameters, crystallinity, crystal orientation);
--- Design of functional demonstrator devices (temperature sensor, position sensor, pressure sensor) and their test procedures;
--- Functional characterization of the three sensors and comparison of ALAM-created sensors with counterparts generated with classical lithographic procedures and with industry standards;
--- Presentation of the technology principles and first results in more than 60 distinct public contexts (conferences, fairs, pitch events);
--- Publication of three peer-reviewed papers, completion of a patent and application for a further patent;
--- Market intelligence and business plan.
Overall, we have demonstrated in practice that single-step, direct-patterning multimaterial deposition is doable, fast, and versatile. It simplify processing vastly with respect to classical lithographic procedures and minimizes the consumption of materials, energy, and time. It can generate devices with performance parameters similar or even superior to those of industry standards or of lithographically processed microdevices.