Graphene Flagship 2D Experimental Pilot Line

Project Information

2D-EPL

Grant agreement ID: 952792

DOI

10.3030/952792

Project closed

EC signature date 28 October 2020

Start date 1 October 2020

End date 30 September 2024

Funded under

• EXCELLENT SCIENCE - Future and Emerging Technologies (FET)

Total cost

€ 20 000 000,00

EU contribution

€ 20 000 000,00

Coordinated by

CHALMERS TEKNISKA HOGSKOLA AB
Sweden

Periodic Reporting for period 2 - 2D-EPL (Graphene Flagship 2D Experimental Pilot Line)

Reporting period: 2022-10-01 to 2024-09-30

Summary of the context and overall objectives of the project

This report describes the progress at M48 of the 2D Experimental Pilot Line (2D-EPL) project, which is the project’s fourth and final year. After the close of the Core 3 Graphene Flagship project in September 2023, the 2D-EPL was integrated into the Graphene Flagship in Horizon Europe, connected via the GrapheneEU CSA.

During this period, we have progressed in our activities to meet the project’s overall objectives. We kept building on the foundations to realise a European ecosystem for prototype production of Graphene Related Materials (GRM) based electronics, sensors and photonics, and took steps to ensure a sustainable future of the project.

To reach this goal, tool vendors have fabricated the designed tools, which have been installed at IMEC to be used for GRM integration. Another tool is in preparation for shipment to the pilot line site IMEC and one more tool is being finalized for delivery to GSEMI. Recognised materials suppliers have continued to supply their standard materials and newly developed materials to mature the process further. The use of the new tools and materials are being tested, evaluated, and are undergoing continuous improvement within the framework of the project. These iterations for improvement allow us to further transition from lab to fab in accordance with semiconductor industry standards.

Wafer-level integration solutions are in continuous development and their progress is being mapped by wafer mapping protocols. The relevant new processes are embedded in the new prototyping service offerings. The 2D-EPL has offered tailored, designed GRM integration services and has delivered the fabricated chips from the first three multi project wafer (MPW) runs. Wafers from two other MPW runs are still in fabrication, and one MPW run remains open after the close of the project. Due to its success, two additional calls were launched in addition to the four planned at the project start.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

The results of the 2D-EPL project are described in the specific sections for the different work packages. Here, we will focus on the key results achieved from M25 to M48.

In WP1 the activities were conducted to set-up the reference process for the reliable and uniform growth of GRM using the new CCS® (Close Coupled Showerhead) Technology based MOCVD (designed and fabricated by AIX.S) reactor for the growth of GRM at 200 mm and 300 mm wafers.

WP2 has been working on the automation of the full wafer scale transfer of GRM. The first demonstration of a debonding of a WS2 layer from a 200 mm sapphire wafer has been demonstrated using the water-assisted concept installed in the LT300 module of the XBC300 GEN2 platform tool built by SUSS. The lab bonder tool build by AIX.L. is ready for shipment to IMEC and will be used for process demo purposes and small wafer qualification runs. Process concept demonstration is achieved for graphene grown on epitaxial templates. Note that both WP1 and WP2 are suppling all the GRM for integration in WP3 and WP4.

Development of the individual integration steps is handled in WP3. This WP is providing the essential building blocks used in WP4 to set-up the relevant modules for industry.
Essential here, is to establish the correct methods for quality control. An analysis of electrical characterisation has been applied resulting in wafer maps applied to dedicated wafers. Reference modules were characterised, and lot-to-lot variability data are available. Multi-Project Wafer (MPW) runs were fabricated and delivered to customers in a timely manner. In WP5, MPW runs have been monitored and customer surveys have been conducted to strengthen further offerings in the upcoming MPW offerings. At the project end, a consortium-wide SWOT analysis was conducted from which the results are reported in D5.9.

The project continues to make use of the different channels available (conferences, press, workshops, digital media, EUROPRACTICE) to ensure stakeholders are aware of the 2D-EPL’s progress and offerings. In particular, the innovation workshop, part of the 2D-EPL Symposium in Brussels, attracted various stakeholder allowing for in-depth informal discussions.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

The foundation for exploitation and dissemination activities was done from the start of the project by setting up a unique brand identity, a website, and a series of workshops to communicate the progress of the project and reach out potential customers. A webinar series hosted by EUROPRACTICE provided for the information regarding the upcoming MPW runs, allowing the project to reach an additional audience outside of the 2D materials community.


In total 135 applications were received to join MPW runs, resulting in 35 customers signing up with three pilot line sites. Interest is expressed by larger companies, research institutes, universities, and start-ups, reflecting the value of these offerings already at this early stage of ecosystem enablement. Having this insight also provides valuable feedback from the community which will be essential for future integration with dedicated semiconductor technologies. It is expected that systems will benefit from GRM co-integration with other technologies such as SiN- and Si-photonics, CMOS and analogue MOS.

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