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Verwertbare Ergebnisse
Increasing demand for truly mobile communications is placing more exacting requirements on existing technologies and system architectures. This project exploits the scientific and technology base in high temperature superconductivity (HTS) to demonstrate new approaches to component/sub-system designs as required for universal mobile telecommunication system (UMTS) third generation mobile telecommunication systems.
The four deliverables have been completed and issued. Deliverables one, 'System Requirements' and two, 'Dependencies' provided inputs to Deliverable three 'System Architecture and Preliminary Specification'. This major deliverable identified areas where the use of HTS is expected to provide significant techno-economic benefits. The system design for SUCOMS has been established and defined the preliminary specifications for the HTS and cooled electronic components. Deliverable four, 'Input and Output Connections' reviews the interrelationships between the electrical, mechanical and thermal requirements for the SUCOMS demonstrators. During the study phase of the programme, 'System Architecture and Preliminary Specification', SUCOMS has identified three key demonstrators. These are identified as Actions 1, 2 and 3. (Action 1, an HTS front end with six pre-select filters and cooled LNAs; Action 2, an extension of Action 1 with a down converter, incorporating a cooled low noise local oscillator using a high Q dielectric resonator with HTS endplates; Action 3, the full BTS radio frequency (rf) transceiver sub-system with multiple HTS components. A successful demonstrator requires the individual demands of the multiple disciplines involved to be reconciled. To meet the challenges collaborative investigations have been conducted for example,. to identify efficient LNAs to minimize the thermal dissipation, interconnects with low rf loss and low thermal conductivity, and an encapsulation design which exhibits good rf characteristics, minimizes thermal losses and is compatible with the vacuum engineering requirements. The design of the dewar and rf encapsulation is being accomplished interactively with inputs from the various disciplines and has reached an advanced stage.
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