Interconnection materials for environmentally compatible assembly technologies

Objective

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation

Call for proposal

Data not available

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW

Address

St. Pietersnieuwstraat 41
9000 Gent
Belgium

Links

Participants (8)

ALCATEL BELL NV

Belgium

Address

Bell Telefphonelaan 3
2440 Geel

Links

AMI SEMICONDUCTOR BELGIUM BVBA

Belgium

Address

Westerring 15
9700 Oudenaarde

Links

CENTRO RICERCHE FIAT S.C.P.A.

Italy

Address

Strada Torino 50
10043 Orbassano

Links

ELCOTEQ NETWORK CORPORATION

Finland

Address

Konalankuja 5
00391 Helsinki

Links

KSW MICROTEC GMBH

Germany

Address

63,gostritzer Strasse 63
01217 Weissig - Dresden

Links

TECDIS DISPLAYS IBERICA S.A.

Spain

Address

Parque Tecnologico De Boecillo
47151 Boecillo

Links

TECHNISCHE UNIVERSITAET BERLIN*

Germany

Address

25,gustav-meyer-allee 25
13355 Berlin

Links

W.C. HERAEUS GMBH & CO. KG

Germany

Address

Heraeusstrasse 12-14
63450 Hanau

Links