Objective
The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contracts
Coordinator
9000 Gent
Belgium
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Participants (8)
2440 Geel
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9700 Oudenaarde
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10043 Orbassano
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00391 Helsinki
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01217 Weissig - Dresden
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47151 Boecillo
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13355 Berlin
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63450 Hanau
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