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Interconnection materials for environmentally compatible assembly technologies

Objective

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Coordinator

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW
Address
St. Pietersnieuwstraat 41
9000 Gent
Belgium

Participants (8)

ALCATEL BELL NV
Belgium
Address
Bell Telefphonelaan 3
2440 Geel
AMI SEMICONDUCTOR BELGIUM BVBA
Belgium
Address
Westerring 15
9700 Oudenaarde
CENTRO RICERCHE FIAT S.C.P.A.
Italy
Address
Strada Torino 50
10043 Orbassano
ELCOTEQ NETWORK CORPORATION
Finland
Address
Konalankuja 5
00391 Helsinki
KSW MICROTEC GMBH
Germany
Address
63,Gostritzer Strasse 63
01217 Weissig - Dresden
TECDIS DISPLAYS IBERICA S.A.
Spain
Address
Parque Tecnologico De Boecillo
47151 Boecillo
TECHNISCHE UNIVERSITAET BERLIN*
Germany
Address
25,Gustav-meyer-allee 25
13355 Berlin
W.C. HERAEUS GMBH & CO. KG
Germany
Address
Heraeusstrasse 12-14
63450 Hanau