Skip to main content

Interconnection materials for environmentally compatible assembly technologies

Objective

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Call for proposal

Data not available

Coordinator

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW
Address
St. Pietersnieuwstraat 41
9000 Gent
Belgium

See on map

Links

Participants (8)

ALCATEL BELL NV
Belgium
Address
Bell Telefphonelaan 3
2440 Geel

See on map

Links
AMI SEMICONDUCTOR BELGIUM BVBA
Belgium
Address
Westerring 15
9700 Oudenaarde

See on map

Links
CENTRO RICERCHE FIAT S.C.P.A.
Italy
Address
Strada Torino 50
10043 Orbassano

See on map

Links
ELCOTEQ NETWORK CORPORATION
Finland
Address
Konalankuja 5
00391 Helsinki

See on map

Links
KSW MICROTEC GMBH
Germany
Address
63,gostritzer Strasse 63
01217 Weissig - Dresden

See on map

Links
TECDIS DISPLAYS IBERICA S.A.
Spain
Address
Parque Tecnologico De Boecillo
47151 Boecillo

See on map

Links
TECHNISCHE UNIVERSITAET BERLIN*
Germany
Address
25,gustav-meyer-allee 25
13355 Berlin

See on map

Links
W.C. HERAEUS GMBH & CO. KG
Germany
Address
Heraeusstrasse 12-14
63450 Hanau

See on map

Links