Interconnection materials for environmentally compatible assembly technologies

Ziel

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Programm/Programme

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Thema/Themen

• 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation

Aufforderung zur Vorschlagseinreichung

Data not available

Finanzierungsplan

CSC - Cost-sharing contracts

Koordinator

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW

Adresse

St. Pietersnieuwstraat 41
9000 Gent
Belgien

Beteiligte (8)

ALCATEL BELL NV

Belgien

Adresse

Bell Telefphonelaan 3
2440 Geel

AMI SEMICONDUCTOR BELGIUM BVBA

Belgien

Adresse

Westerring 15
9700 Oudenaarde

CENTRO RICERCHE FIAT S.C.P.A.

Italien

Adresse

Strada Torino 50
10043 Orbassano

ELCOTEQ NETWORK CORPORATION

Finnland

Adresse

Konalankuja 5
00391 Helsinki

KSW MICROTEC GMBH

Deutschland

Adresse

63,gostritzer Strasse 63
01217 Weissig - Dresden

TECDIS DISPLAYS IBERICA S.A.

Spanien

Adresse

Parque Tecnologico De Boecillo
47151 Boecillo

TECHNISCHE UNIVERSITAET BERLIN*

Deutschland

Adresse

25,gustav-meyer-allee 25
13355 Berlin

W.C. HERAEUS GMBH & CO. KG

Deutschland

Adresse

Heraeusstrasse 12-14
63450 Hanau