Objective The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states. Programme(s) FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002" Topic(s) 1.1.3.-1. - Key Action Innovative Products, Processes and Organisation Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW EU contribution No data Address St. Pietersnieuwstraat 41 9000 GENT Belgium See on map Total cost No data Participants (8) Sort alphabetically Sort by EU Contribution Expand all Collapse all ALCATEL BELL NV Belgium EU contribution No data Address Bell Telefphonelaan 3 2440 GEEL See on map Total cost No data AMI SEMICONDUCTOR BELGIUM BVBA Belgium EU contribution No data Address Westerring 15 9700 OUDENAARDE See on map Total cost No data CENTRO RICERCHE FIAT S.C.P.A. Italy EU contribution No data Address Strada Torino 50 10043 ORBASSANO See on map Total cost No data ELCOTEQ NETWORK CORPORATION Finland EU contribution No data Address Konalankuja 5 00391 HELSINKI See on map Total cost No data KSW MICROTEC GMBH Germany EU contribution No data Address 63,Gostritzer Strasse 63 01217 WEISSIG - DRESDEN See on map Total cost No data TECDIS DISPLAYS IBERICA S.A. Spain EU contribution No data Address Parque Tecnologico de Boecillo 47151 BOECILLO See on map Total cost No data TECHNISCHE UNIVERSITAET BERLIN* Germany EU contribution No data Address 25,Gustav-Meyer-Allee 25 13355 BERLIN See on map Total cost No data W.C. HERAEUS GMBH & CO. KG Germany EU contribution No data Address Heraeusstrasse 12-14 63450 HANAU See on map Total cost No data
