Skip to main content
European Commission logo print header

Interconnection materials for environmentally compatible assembly technologies

Objective

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Call for proposal

Data not available

Coordinator

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW
Address
St. pietersnieuwstraat 41
9000 Gent
Belgium

See on map

EU contribution
€ 0,00

Participants (8)