Ziel
RATIONAL UTILIZATION OF POOR KINDS OF WOOD
REDUCING THE APPARENT DENSITY OF BOARDS TO THAT OF SOLID WOOD
THE SAME STRENGTH CHARACTERISTICS AS KNOT-FREE SOLID WOOD
LOWER WATER INHIBITION AND GREATER DIMENSIONAL STABILITY OF THE PANELS
DEVELOPMENT OF NEW APPLICATIONS FOR STRUCTURAL CHIPBOARD, POSSIBLY AS A BASIC MATERIAL IN THE FORM OF BONDED WOODEN PANELS OR A STRUCTURAL ELEMENTS.
THE AIM OF THE RESEARCH IS TO TEST NEW BONDING SYSTEMS, GIVEN THE PRESENT STATE OF PRODUCTION TECHNOLOGY. IT IS PRIMARILY PLANNED TO USED MIXED-RESIN BONDINGS BASED ON PHENOL AND ISOCYANATE-MODIFIED AMINOPLASTIC MIXED-RESINS.
AN ATTEMPT IS ALSO TO BE MADE TO FILL THE CAVITIES IN THE CHIPS BY MEANS OF ADDITIONAL FOAMING OF THE ADHESIVES AND TO OBTAIN HIGHER STRENGTH CHARACTERISTICS AND LOWER WATER IMBIBITION VALUES BY MEANS OF IMPROVED WETTING.
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