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INNOVATIVE TRANSDUCERS FOR ADVANCED SIGNAL PROCESSING IN ULTRASONIC INSPECTIONS

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Verwertbare Ergebnisse

The main objective of the project was the development of new inspection techniques based on the use of PVDF probes in intelligent signal processing systems. The transducer probes produced were either single transducer, or linear and 2-dimensional transducer arrays, the latter being mechanically flexible. Improved imaging and defect characterization were pursued, enabling the inspection of curved and complex shaped surfaces. The new inspection techniques should decrease the costs of inspection, enhance its applicability and reliability, and shorten the inspection time. Extensive studies and experiments were effectively conducted and transducer specifications produced. Fabrication and testing of transducers, however, has been limited to single ones. The electronic interfacing of the transducers to standard equipment has been implemented. Pulse shaping (chirp signals) and signal processing (Walsh transform techniques) were successfully implemented. Broadband transducer material should be investigated further including the aspect of flexibility. The possibility of flexible composite material was also considered.

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