Obiettivo
A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.
Argomento(i)
Data not availableInvito a presentare proposte
Data not availableMeccanismo di finanziamento
CSC - Cost-sharing contractsCoordinatore
National Physical Laboratory (NPL)
Contributo UE
Nessun dato
Indirizzo
Queen's Road
TW11 0LW Teddington
Regno Unito
TW11 0LW Teddington
Regno Unito
Costo totale
Nessun dato