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Zawartość zarchiwizowana w dniu 2024-04-15

BASIC RESEARCH IN SOLDERING FOR SURFACE-MOUNTING TECHNOLOGY IN ELECTRONICS ASSEMBLY

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A new measurement instrument for the solderability of surface mounting electronic components was developed and is now being exploited commercially. In addition, a test procedure and guidance document have been written for submission to the relevant international CEN and IEC standards committees. A semi-quantitative predictive model of component solderability was produced. The effect of component solderability on solder fillet shape and hence on joint reliability was investigated. A set of solder joint fatigue data was produced for the different component types and different soldering processes.

Temat(-y)

Data not available

Zaproszenie do składania wniosków

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System finansowania

CSC - Cost-sharing contracts

Koordynator

National Physical Laboratory (NPL)
Wkład UE
Brak danych
Adres
Queen's Road
TW11 0LW Teddington
Zjednoczone Królestwo

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Koszt całkowity
Brak danych

Uczestnicy (3)