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Universal microwave photonics programmable processor for seamlessly interfacing wireless and optical ICT systems

Objective

Information and communication technology (ICT) systems are expanding at an awesome pace in terms of capacity demand, number of connected end-users and required infrastructure. To cope with these rapidly increasing growth rates there is a need for a flexible, scalable and future-proof solution for seamlessly interfacing the wireless and photonic segments of communication networks.
RF or Microwave photonics (MWP), is the best positioned technology to provide the required flexible, adaptive and future-proof physical layer with unrivalled characteristics. Its widespread use is however limited by the high-cost, non-compact and heavy nature of its systems. Integrated Microwave Photonics (IMWP) targets the incorporation of MWP functionalities in photonic chips to obtain cost-effective and reduced space, weight and power consumption systems. IMWP has demonstrated some functionalities in through application specific photonic circuits (ASPICs), yielding almost as many technologies as applications and preventing cost-effective industrial manufacturing processes. A radically different approach is based on a universal or general-purpose programmable photonic integrated circuit (PIC) capable of performing with the same hardware architecture the main required functionalities. The aim of this project is the design, implementation and validation of such processor based on the novel concept of photonic waveguide mesh optical core and its integration in a Silicon Photonics chip. Its three specific objectives are: (1) The architecture design and optimization of a technology-agnostic universal MWP programmable signal processor, (2) The chip mask design, fabrication and testing of the processor and (3) The experimental demonstration and validation of the processor. Targeting record values in bandwidth and footprint its potential impact will be very large by unlocking bandwidth bottlenecks and providing seamless interfacing of the fiber and wireless segments in future ICT systems.

Fields of science (EuroSciVoc)

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Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

ERC-ADG - Advanced Grant

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) ERC-2016-ADG

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Host institution

UNIVERSITAT POLITECNICA DE VALENCIA
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 494 444,00
Address
CAMINO DE VERA SN EDIFICIO 3A
46022 Valencia
Spain

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Region
Este Comunitat Valenciana Valencia/València
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 2 494 444,00

Beneficiaries (1)

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