Cel Information and communication technology (ICT) systems are expanding at an awesome pace in terms of capacity demand, number of connected end-users and required infrastructure. To cope with these rapidly increasing growth rates there is a need for a flexible, scalable and future-proof solution for seamlessly interfacing the wireless and photonic segments of communication networks. RF or Microwave photonics (MWP), is the best positioned technology to provide the required flexible, adaptive and future-proof physical layer with unrivalled characteristics. Its widespread use is however limited by the high-cost, non-compact and heavy nature of its systems. Integrated Microwave Photonics (IMWP) targets the incorporation of MWP functionalities in photonic chips to obtain cost-effective and reduced space, weight and power consumption systems. IMWP has demonstrated some functionalities in through application specific photonic circuits (ASPICs), yielding almost as many technologies as applications and preventing cost-effective industrial manufacturing processes. A radically different approach is based on a universal or general-purpose programmable photonic integrated circuit (PIC) capable of performing with the same hardware architecture the main required functionalities. The aim of this project is the design, implementation and validation of such processor based on the novel concept of photonic waveguide mesh optical core and its integration in a Silicon Photonics chip. Its three specific objectives are: (1) The architecture design and optimization of a technology-agnostic universal MWP programmable signal processor, (2) The chip mask design, fabrication and testing of the processor and (3) The experimental demonstration and validation of the processor. Targeting record values in bandwidth and footprint its potential impact will be very large by unlocking bandwidth bottlenecks and providing seamless interfacing of the fiber and wireless segments in future ICT systems. Dziedzina nauki engineering and technologymechanical engineeringmanufacturing engineeringengineering and technologymaterials engineeringfibersnatural scienceschemical sciencesinorganic chemistrymetalloidsengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technology Słowa kluczowe Integrated Optics Microwave Photonics Fiber-wireless systems optical microprocessors Program(-y) H2020-EU.1.1. - EXCELLENT SCIENCE - European Research Council (ERC) Main Programme Temat(-y) ERC-2016-ADG - ERC Advanced Grant Zaproszenie do składania wniosków ERC-2016-ADG Zobacz inne projekty w ramach tego zaproszenia System finansowania ERC-ADG - Advanced Grant Instytucja przyjmująca UNIVERSITAT POLITECNICA DE VALENCIA Wkład UE netto € 2 494 444,00 Adres CAMINO DE VERA SN EDIFICIO 3A 46022 Valencia Hiszpania Zobacz na mapie Region Este Comunitat Valenciana Valencia/València Rodzaj działalności Higher or Secondary Education Establishments Linki Kontakt z organizacją Opens in new window Strona internetowa Opens in new window Uczestnictwo w unijnych programach w zakresie badań i innowacji Opens in new window sieć współpracy HORIZON Opens in new window Koszt całkowity € 2 494 444,00 Beneficjenci (1) Sortuj alfabetycznie Sortuj według wkładu UE netto Rozwiń wszystko Zwiń wszystko UNIVERSITAT POLITECNICA DE VALENCIA Hiszpania Wkład UE netto € 2 494 444,00 Adres CAMINO DE VERA SN EDIFICIO 3A 46022 Valencia Zobacz na mapie Region Este Comunitat Valenciana Valencia/València Rodzaj działalności Higher or Secondary Education Establishments Linki Kontakt z organizacją Opens in new window Strona internetowa Opens in new window Uczestnictwo w unijnych programach w zakresie badań i innowacji Opens in new window sieć współpracy HORIZON Opens in new window Koszt całkowity € 2 494 444,00