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Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements

Project description

Improving power, performance, area and cost of 2 nm chip technology

It is estimated that in a few years, there will likely be over 100 billion connected devices globally. To accommodate the demand for increased chip performance and energy efficiency, the semiconductor industry must develop new breakthrough nanosheet technologies that keep Moore’s law going. With 5 nm node chips already in production and 3 nm node chips announced, these breakthroughs are needed for the subsequent 2 nm node. Building on the work of the IT2 project that explored advanced EUV lithography, novel 3D structures and new materials, the EU-funded ID2PPAC project will show how to achieve the expected performance, power, area and cost when migrating to the 2 nm node.

Objective

In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated with the objective to demonstrate that Performance Power Area and Cost (PPAC) requirements for this generation of leading edge logic technology can be achieved.

To continue the Moores law trajectory to the 2nm node, while meeting PPAC requirements, the combination of further advancements in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project pivots on the focused engagement of leading expert partners in these key interlocking areas and a shared pilot line.

The ID2PPAC project, is expected to enable IC-fabs to do EUV-based, single-print, High Volume Manufacturing for the 2nm node by 2025.

This technology evolution is driven by the growing demand for compute power which increases more than exponentially with time and has made the world migrate from 1 billion interconnected devices in the PC era to 10 billion in the Mobile + cloud era to the future Intelligence era in which there will be over 100 billion intelligent connected devices. To enable this growth, the semiconductor industry is continuously pursuing technology innovations to realize this progress as has been predicted by Moores Law and will continue to do so.

The project will also help to expand Europe's technological capacity to act in this field, which is crucial for digitization, (edge) AI and for solving national, European and global societal challenges and will strengthen the consortium of leading European companies and institutes active in this sector.

Fields of science (EuroSciVoc)

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This project's classification has been validated by the project's team.

Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

IA - Innovation action

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) H2020-ECSEL-2020-1-IA-two-stage

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Coordinator

ASML NETHERLANDS B.V.
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 713 200,00
Address
DE RUN 6501
5504DR Veldhoven
Netherlands

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Region
Zuid-Nederland Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 13 566 000,00

Participants (26)

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