European Commission logo
English English
CORDIS - EU research results
CORDIS

Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements

Project description

Improving power, performance, area and cost of 2 nm chip technology

It is estimated that in a few years, there will likely be over 100 billion connected devices globally. To accommodate the demand for increased chip performance and energy efficiency, the semiconductor industry must develop new breakthrough nanosheet technologies that keep Moore’s law going. With 5 nm node chips already in production and 3 nm node chips announced, these breakthroughs are needed for the subsequent 2 nm node. Building on the work of the IT2 project that explored advanced EUV lithography, novel 3D structures and new materials, the EU-funded ID2PPAC project will show how to achieve the expected performance, power, area and cost when migrating to the 2 nm node.

Objective

In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated with the objective to demonstrate that Performance Power Area and Cost (PPAC) requirements for this generation of leading edge logic technology can be achieved.

To continue the Moore’s law trajectory to the 2nm node, while meeting PPAC requirements, the combination of further advancements in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project pivots on the focused engagement of leading expert partners in these key interlocking areas and a shared pilot line.

The ID2PPAC project, is expected to enable IC-fabs to do EUV-based, single-print, High Volume Manufacturing for the 2nm node by 2025.

This technology evolution is driven by the growing demand for compute power which increases more than exponentially with time and has made the world migrate from 1 billion interconnected devices in the “PC era” to 10 billion in the “Mobile + cloud era” to the future “Intelligence era” in which there will be over 100 billion intelligent connected devices. To enable this growth, the semiconductor industry is continuously pursuing technology innovations to realize this progress as has been predicted by Moore’s Law and will continue to do so.

The project will also help to expand Europe's technological capacity to act in this field, which is crucial for digitization, (edge) AI and for solving national, European and global societal challenges and will strengthen the consortium of leading European companies and institutes active in this sector.

Coordinator

ASML NETHERLANDS B.V.
Net EU contribution
€ 2 614 400,00
Address
DE RUN 6501
5504DR Veldhoven
Netherlands

See on map

Region
Zuid-Nederland Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 13 072 000,00

Participants (26)