Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements

Project Information

ID2PPAC

Grant agreement ID: 101007254

DOI

10.3030/101007254

Project closed

EC signature date 12 May 2021

Start date 1 June 2021

End date 31 December 2024

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost

€ 107 694 846,37

EU contribution

€ 24 855 319,13

Coordinated by

ASML NETHERLANDS B.V.
Netherlands

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Conference proceedings (13)

High NA EUV: progress update and mask impact

Author(s): Jan van Schoot
Published in: Photomask Japan, Issue 2023, 2023
Publisher: SPIE
DOI: 10.1117/12.3012436

High NA EUV enabling cost efficient scaling for N+1 technology nodes

Author(s): Greet Storms, Sjoerd Lok, Rob van Ballegoij, Jan van Schoot, Rudy Peeters, Diederik de Bruin, Kars Troost, Teun van Gogh
Published in: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States, 2022
Publisher: SPIE
DOI: 10.1117/12.2617240

Status and outlook of EUV optics at ZEISS

Author(s): Jörg Zimmermann, Jens Timo Neumann, Dirk Jürgens, Paul Gräupner
Published in: International Conference on Extreme Ultraviolet Lithography 2023, 2023, Page(s) 47
Publisher: SPIE
DOI: 10.1117/12.2687658

EUV optics at ZEISS: status, outlook, and future

Author(s): Joachim Kalden, Jens Timo Neumann, Dirk Juergens, Paul Gräupner, Wolfgang Seitz, Peter Kuerz
Published in: Optical and EUV Nanolithography XXXVII, 2024, Page(s) 36
Publisher: SPIE
DOI: 10.1117/12.3010847

High NA EUV: development towards introduction at the customer

Author(s): Rudy Peeters
Published in: SPIE Advanced Lithography + Patterning, Issue 23 April 2023, 2023
Publisher: SPIE
DOI: 10.1117/12.2658381

High-NA EUVL exposure tool: program progress and mask interaction

Author(s): Jan van Schoot
Published in: Photomask Japan 2022, 2022, Online Only, 2022
Publisher: SPIE
DOI: 10.1117/12.2656140

Unveiling the individual impact of hydrogen radicals and vacuum EUV photons on pellicle-like materials under varying thermal conditions

Author(s): Görsel Yetik, Herman Bekman, Jacqueline van Veldhoven, Shriparna Mukherjee, Karima Tabakkouht, and Henk Lensen
Published in: International Conference on Extreme Ultraviolet Lithography 2024, Issue Proc. SPIE PC13215,, 2024
Publisher: SPIE

A novel way of modelling plasma induced hydrogen permeation in metals

Author(s): Cederik Meekes, Dagmar A. Wismeijer, Jurjen Emmelkamp, Henk A. Lensen
Published in: SPIE Photomask Technology + EUV Lithography 2023, Issue Proceedings Volume PC12750, 2023
Publisher: SPIE Photomask Technology + EUV Lithography
DOI: 10.1117/12.2686732

Advancing EUV lithography optics supporting current roadmap and beyond

Author(s): Olaf Conradi et al.
Published in: SPIE International Conference on Extreme Ultraviolet Lithography 2024, 2024
Publisher: SPIE
DOI: 10.1117/12.3034698

Enabling the next step for on-product performance with High NA EUV system

Author(s): Kaustuve Bhattacharyya, Diederik de Bruin, Rudy Peeters, Jara Garcia Santaclara, Herman Heijmerikx, Rob van Ballegoij, Eelco van Setten, Jan van Schoot, Sjoerd Lok, Greet Storms, Peter Vanoppen
Published in: EUVL Conference 2023, 2023
Publisher: SPIE

Enhanced Critical Defect Detection Using Machine Learning Based Guided Electron Beam Review Strategy

Author(s): Naor Alfassi, Einat Hauzer, Nina Zeng, Dolev Raiz, Gilad Reut
Published in: SEMICON WEST 2024, Issue July 2024, 2024
Publisher: SEMICON WEST 2024

Exploring interactions between hydrogen plasma and construction materials

Author(s): Kleopatra Papamichou, Thomas Mechielsen, Aneta Stodólna, Erik Schuring, Henk Lensen
Published in: SPIE Photomask Technology + EUV Lithography 2023, Issue Proceedings Volume PC12750, 2023
Publisher: SPIE Photomask Technology + EUV Lithography
DOI: 10.1117/12.2686862

High NA EUV towards introduction at the customer

Author(s): Jara Garcia Santaclara
Published in: SPIE Photomask Technology + EUV Lithography, 2023
Publisher: SPIE

Other (12)

EUV Optics at ZEISS

Author(s): Heiko Feldmann
Published in: Semicon Korea, 2023
Publisher: Semicon Korea

Mask3D effects in EUV lithography and their impact on resolution enhancements

Author(s): A. Erdmann
Published in: Keynote Talk EUVL Symposium, 2023
Publisher: EUVL Symposium

The challenges of heating a sample in vacuum

Author(s): Molkenboer, F.T. Kerkhof, P.J. Burema, A. Haasnoot, H. Velthuis, J.F.M. Hooftman, T. Kerkhof, P.J. Lensen, H.A
Published in: IVC22, 2022
Publisher: IVC22, 22nd International Vacuum Congress (https://ivc22.org/)

Modeling of multilayer degradation and impact on lithographic imaging metrics

Author(s): H. Mesilhy, P. Evanschitzky, A. Erdmann
Published in: Fraunhofer IISB Lithography Simulation Workshop, 2023
Publisher: Fraunhofer IISB Lithography Simulation Workshop

Carl ZEISS AG: General presentation and Metrologies at ZEISS

Author(s): Richard Quintanilha
Published in: IMEKO TC 10 Conference, 2023
Publisher: IMEKO

Imaging performance of low-n absorbers at the optical resolution limits of high NA EUV systems

Author(s): A. Erdmann, H. Mesilhy, P. Evanschitzky, G. Bottiglieri, T. Brunner, E. van Setten, C. van Lare, M- van de Kerkhof
Published in: Photomask Japan, 2023
Publisher: Photomask Japan

Status and outlook of EUV optics at ZEISS

Author(s): Martin Kaumanns
Published in: 2024 EUVL Wokrshop and Supplier Showcase, 2024
Publisher: EUV Litho Inc.

Optics for EUV-Lithography with High-NA

Author(s): Hartmut Enkisch
Published in: 322. PTB Seminar 2023 VUV and EUV Metrology, 2023
Publisher: PTB

High-NA EUV – breakthrough in resolution and precision

Author(s): Alexey Ponomarev
Published in: 21st Workshop Beams & More IMS Stuttgart, 2024
Publisher: IMS Chips Stuttbart

The Challenges of Heating a Sample

Author(s): Han Velthuis
Published in: AVS 68, Issue Paper Id: 74843; Session: VT TuM : Vac Technology for Large Vac Systems, 2022
Publisher: AVS 68th International Symposium & Exhibition

High NA EUV: the future that is already here

Author(s): Philip Mueller et al.
Published in: 20th Workshop Beams & More Institut für Mikroelektronik Stuttgart, 2023
Publisher: IMS Chips Stuttgart

Pathfinding the perfect EUV mask: Mask imperfections and its impact on the imaging

Author(s): H. Mesilhy, Z. Belete, P. Evanschitzky, A. Erdmann
Published in: EMLC Conference, 2023
Publisher: EMLC Conference

Peer reviewed articles (4)

Crystallinity and composition of Sc1−x(−y)Six(Py) silicides in annealed TiN/Sc/Si:P stacks for advanced contact applications

Author(s): Bert Pollefliet, Clement Porret, Jean-Luc Everaert, Kiroubanand Sankaran, Xiaoyu Piao, Erik Rosseel, Thierry Conard, Andrea Impagnatiello, Yosuke Shimura, Naoto Horiguchi, Roger Loo, André Vantomme and Clement Merckling
Published in: JAPANESE JOURNAL OF APPLIED PHYSICS, Issue 63, 2024, Page(s) 02SP97, ISSN 0021-4922
Publisher: The Japan Society of Applied Physics
DOI: 10.35848/1347-4065/ad1f0d

Stitching insights towards high numerical aperture extreme ultraviolet lithography: an experimental study

Author(s): Vincent Wiaux, Natalia Davydova, Lieve Van Look, Nick Pellens, Ataklti Weldeslassie, Guillaume Libeert, Tatiana Kovalevich, Joost Bekaert, Frank Timmermans, Cyrus Tabery, Laura Huddleston
Published in: Journal of Micro/Nanopatterning, Materials, and Metrology, Issue 24, 2025, ISSN 2708-8340
Publisher: SPIE
DOI: 10.1117/1.jmm.24.1.011012

EUV-induced hydrogen plasma and particle release

Author(s): Mark van de Kerkhof, Andrei M. Yakunin, Vladimir Kvon, Andrey Nikipelov, Dmitry Astakhov, Pavel Krainov, Vadim Banine
Published in: Radiation Effects and Defects in Solids, Issue 177, 2022, Page(s) 486-512, ISSN 1042-0150
Publisher: Taylor & Francis
DOI: 10.1080/10420150.2022.2048657

Epitaxial Si/SiGe Multi-Stacks: From Stacked Nano-Sheet to Fork-Sheet and CFET Devices

Author(s): R. Loo, A. Akula, Y. Shimura, C. Porret, E. Rosseel, T. Dursap, A. Y. Hikavyy, M. Beggiato, J. Bogdanowicz, A. Merkulov, M. Ayyad, H. Han, O. Richard, A. Impagnatiello, D. Wang, K. Yamamoto, T. Sipőcz, Á. Kerekes, H. Mertens, N. Horiguchi, R. Langer
Published in: ECS Journal of Solid State Science and Technology, Issue 14, 2025, Page(s) 015003, ISSN 2162-8769
Publisher: Electrochemical Society, Inc.
DOI: 10.1149/2162-8777/ada79f

Non-peer reviewed articles (5)

The Evolvement of Lithography Optics Towards Advanced EUV Lithography: Enabling the Continuation of Moore’s Law for Six Decades

Author(s): Winfried Kaiser
Published in: IEEE Electron Devices Magazine, Issue 2, 2024, Page(s) 23-34, ISSN 2832-7691
Publisher: IEEE
DOI: 10.1109/med.2023.3343627

Data Processing Unit for Energy Saving in Computer Vision: Weapon Detection Use Case

Author(s): Marina Perea-Trigo, Enrique J. López-Ortiz, Jose L. Salazar-González, Juan A. Álvarez-García, J. J. Vegas Olmos
Published in: Electronics, Issue 12, 2024, Page(s) 146, ISSN 2079-9292
Publisher: Multidisciplinary Digital Publishing Institute
DOI: 10.3390/electronics12010146

P4 Telemetry collector

Author(s): Faris Alhamed, Davide Scano, Piero Castoldi, Juan Jose Vegas Olmos, Ilya Vershkov, Francesco Paolucci, Filippo Cugini
Published in: Computer Networks, Issue 227, 2023, Page(s) 109727, ISSN 1389-1286
Publisher: Elsevier BV
DOI: 10.1016/j.comnet.2023.109727

Energy-Efficient Edge and Cloud Image Classification with Multi-Reservoir Echo State Network and Data Processing Units

Author(s): E. J. López-Ortiz, M. Perea-Trigo, L. M. Soria-Morillo, J. A. Álvarez-García, J. J. Vegas-Olmos
Published in: Sensors, Issue 24, 2024, Page(s) 3640, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s24113640

Exploring deep echo state networks for image classification: a multi-reservoir approach

Author(s): E. J. López-Ortiz, M. Perea-Trigo, L. M. Soria-Morillo, F. Sancho-Caparrini, J. J. Vegas-Olmos
Published in: Neural Computing and Applications, Issue 36, 2024, Page(s) 11901-11918, ISSN 0941-0643
Publisher: Springer Verlag
DOI: 10.1007/s00521-024-09656-4