Next-generation aeronautical on-board electronics
As avionics functions such as flight management and flight control grew over time, so did the size and complexity of their dedicated software and hardware. This resulted in high maintenance costs, the need to store a wide range of spare parts and costly functional upgrades. Although the packaging solutions of these federated architectures have supported the complexity growth in avionics solutions, the time has come to find an alternative to this packaging to cope with the challenge of housing new technological and architectural innovations. The EU-funded PRIMAE (Packaging of future integrated modular electronics) project set out to develop flexible, robust and open packaging for the next generation of aeronautical electronics. Project partners worked to reduce the volume and weight of electronics packaging, cut costs and boost reliability. They defined and refined the specifications for cooling and packaging standards, and also worked on three candidate pre-designs. The team conducted a series of advanced technology studies related to airworthiness regulations, namely cooling, lightweight composite materials, electromagnetic interferences, power supply and connectivity. Several state-of-the-art technologies were successfully implemented. They include new cooling technologies, direct aircraft connectivity, modular versatile connectors and composite lightweight structures. After harmonising the concept, the PRIMAE team proposed it as a standard for the packaging of future generations of electronics for the large and regional aircraft and helicopters of tomorrow. Thanks to PRIMAE, the new packaging concept will bolster market competitiveness and support the efforts by industrial avionics suppliers to improve costs and environmental impact.
Keywords
Aeronautical, on-board electronics, aircraft, avionics, modular electronics, electronics packaging
