Objective
Beyond the 65 nm half pitch node in semiconductor manufacture, advanced resolution-enhancement techniques will be mandatory in optical lithography. Mask-less pattern transfer technologies will emerge as alternatives under certain combinations of process conditions. Both approaches will introduce additional challenges to overlay metrology and require solutions beyond those currently in use. Today, overlay metrology is based on structures, which relate the relative placement of one layer to a previous one in the manufactured device.
These structures are becoming a limiting factor. Critical challenges are confronted:
- inability to compensate for the impact of across field scanner aberration variations on device overlay, enhanced by off-axis illumination techniques
- inability to accurately represent overlay errors associated with device structures, manufactured by sub wavelength lithography processes such as optical proximity corrections and phase shift masks.
As mask-less solutions begin to play a role, overlay issues will be critical. Many measurements will be required for overlay control. SEM metrology does not have the throughput and versatility to meet production needs. Optical metrology will remain the best contender. Solution is required which enables denser overlay metrology sampling within the active area of the die. The aim of the proposed project is to perform research and investigate solutions, which will lead to the development of new metrology applications that will enable overlay to be accurately measured in the face of the above-defined challenges.
The technology developed, will enable overlay control beyond the 65 nm node. In addition, the solution to the first challenge will be further validated in an end user environment, thus providing a field tested application that can be implemented in fabs throughout Europe, providing the later with a significant competitive edge entering the new era of semi-conductor manufacturing.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
23100 MIGDAL HAEMEK
Israel
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.