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Nanomechanical Hardware Platforms for Edge Computing

Descrizione del progetto

Una nuova piattaforma di commutazione per consentire l’edge computing in ambienti difficili

Nel caso in cui i componenti elettronici siano esposti a condizioni difficili, la progettazione della connettività IoT può risultare difficoltosa. Per esempio, le temperature estreme possono provocare il guasto di tali componenti o ridurne l’efficacia di funzionamento. Il progetto i-EDGE, finanziato dall’UE, si prefigge di sviluppare una piattaforma di commutazione nanoelettromeccanica per dispositivi edge che funzionano in condizioni impegnative, ad esempio a temperature superiori ai 300 gradi Celsius e dosi di radiazioni con valori fino a 1 Mrad. La piattaforma di commutazione pianificata non consumerà alcuna energia elettrica in modalità standby e sarà dotata di una memoria non volatile.

Obiettivo

Challenging operating environments are common across many important internet of things (IoT) applications related to enterprises and the circular economy, including automotive, aerospace, industrial and power generation. However, conventional electronics are not suitable for operation in challenging and harsh environments, e.g. at high temperatures. i-EDGE establishes an enabling nanoelectromechanical (NEM) switch technology platform for IoT edge devices operating under demanding conditions, i.e. high temperature (<300 °C) and/or high-radiation (<1 Mrad), uses zero standby power, non-volatile memory and has low compute performance requirements.
i-EDGE will realize a proof-of-concept demonstrator of a NEM “system-on-chip” (SoC) IoT node with an FPGA, non-volatile memory, and a temperature sensor, powered by a high-temperature capacitor bank, with a wireless power receiver for trickle charging the capacitor, and a simple data transceiver and sensor readout to interface to the on-chip FPGA and non-volatile memory. The FPGA fabric will be based on the NEM switch technology for digital logic, and integrated with a non-volatile memory array, analog utility blocks for wireless power transfer, data exchange and sensor readout. We will develop a NEM physical design kit (PDK) for design and circuit simulation, which will facilitate broad usage by application engineers. The technology and design flow will be demonstrated with a condition monitoring application, that has been developed for industrial IoT processes. In several previous EU and national projects, our technology has matured to TRL3 and i-EDGE will bring it to TRL5.
The i-EDGE consortium has all expertise to establish a full supply chain, from basic logic and memory cell design to Systems-on-Chip and a migration path to pilot manufacturing of the NEM technology in Europe. Thus, i-EDGE will help position the EU at the cutting edge of chip design and manufacturing capabilities, as envisaged by the EU Chips Act.

Coordinatore

GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Contribution nette de l'UE
€ 679 718,75
Indirizzo
OTTO BLUMENTHAL STRASSE
52074 Aachen
Germania

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PMI

L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione.

Regione
Nordrhein-Westfalen Köln Städteregion Aachen
Tipo di attività
Other
Collegamenti
Costo totale
€ 679 718,75

Partecipanti (3)

Partner (4)