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14 Anstrom CMOS IC technology

Project description

Pushing the limits of chip miniaturisation down to 1.4 nm

Microchips constantly evolve to meet requirements for more powerful computing systems. The EU-funded 14ACMOS project aims to develop solutions for the 1.4 nm process technology node. Project activities address four key pillars: lithography, metrology, mask-infrastructure and process technology. Lithography solutions will be pushed to meet 1.4 nm capability, and extreme UV plasma physics will be studied to optimise optics transmission and lifetime. In the metrology pillar, advanced methods will be developed to improve measurement sensitivity and uncertainty and assess reticle degradation introduced by extreme UV light. Mask-infrastructure will cover the development of mask repair strategies based on particle removal technology, and assess durability. Process technology involves the development of patterning solutions, active device selection and new interconnect technology, which are suitable for the 1.4 nm technology node.

Objective

14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manufacture; Lithography, Metrology, Mask Infrastructure and Process technology.

Carl ZEISS, Trumpf and ASML are the main parties to push the lithography solutions to 14A. Between Carl ZEISS, Fraunhofer, RWTH, UW and TNO further understanding of optics life time and plasma physics is pursued in optimizing optics transmission and lifetime.

Nova, BRT, ILT and PTB address measurement sensitivity enhancement of X-ray and optical based methodologies to meet the 14A requirements. Imec, TNO, PTB, UPB and RWTH will combine and tune metrology techniques specifically for the assessment of EUV reticle degradation. On throughput and resolution enhancement Bruker, EXC, PTB and AMIL will work on X-ray sources and AMIL, ICT and NFI on e-beam and SPM platforms for in-line metrology. On the reduction of Total Measurement Uncertainty, Prodrive and AMIL cover the development of an ultra-high precision wafer stage and NVIDIA, AMIL and Prodrive the development of a next generation image processing system.

In Mask Infrastructure there are FHG (IISB), ASML, Carl Zeiss covering the creation of a simulation based mask repair strategy and with Carl ZEISS, ASML, PI and UPB HW/SW and process technology for particle removal is created and repair durability is covered with Carl ZEISS, ASML, Suss and UPB.

Process technology covers the creation of patterning solutions with the involvement of imec and TEL. On active device selection there will be imec, Cadence, IBS, JSR, Recif and TEL with THERMO enabling advanced TEM characterization. Middle Of Line and Back End Of Line solution development is with imec, TEL, Solmates and Coventor for process modules and Cadence the interface with the design community. On Sustainable Semiconductor Technology and Systems there are imec, Recif and ThermoFisher covering sustainable material and processing alternatives.

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Keywords

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Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-JU-IA - HORIZON JU Innovation Actions

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-KDT-JU-2021-1-IA

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Coordinator

ASML NETHERLANDS B.V.
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 593 750,00
Address
DE RUN 6501
5504DR Veldhoven
Netherlands

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Region
Zuid-Nederland Noord-Brabant Zuidoost-Noord-Brabant
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 12 968 750,00

Participants (23)

Partners (1)

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