CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.
Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .
Resultado final
Logo and Website available and online
Strategic outline of the Communication & Dissemination Plan (updates during annual GA assemblies), First set of market analysis and stakeholder identification (to be updated before each annual GA assembly)
D1.1 Report on competitive requirements and updated baseline assessment (se abrirá en una nueva ventana)This report summarises the findings of the search in scientific literature, patent databases, and industrial reports and data sheets to serve as a benchmark for the project.
Publicaciones
Autores:
Zhou Da, Tingzhong Xu, Jiapeng Xu, Jérémy Streque, Alessandro Stuart Savoia
Publicado en:
2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2025, ISSN 2167-0021
Editor:
IEEE
DOI:
10.1109/TRANSDUCERS61432.2025.11109700
Autores:
Til Friebe, Nikita Ovsiannikov, Maximilian Lenz, Christian Bretthauer, Gabriele Schrag
Publicado en:
2025 IEEE SENSORS, 2025, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS59705.2025.11330565
Autores:
Zhou Da, Tingzhong Xu, Mohssen Moridi, Alessandro Stuart Savoia
Publicado en:
2023 IEEE International Ultrasonics Symposium (IUS), 2023, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS51837.2023.10307292
Autores:
M.D. Fariñas, T.E.G. Alvarez-Arenas
Publicado en:
2023 IEEE International Ultrasonics Symposium (IUS), 2023, ISBN 979-8-3503-4645-9
Editor:
IEEE
DOI:
10.1109/IUS51837.2023.10307535
Autores:
Gabriele Bosetti, Christian Bretthauer, Michael Steinberger, Karolina Gierl, Michael Krenzer, Gabriele Schrag
Publicado en:
2023 IEEE International Ultrasonics Symposium (IUS), 2023, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS51837.2023.10307891
Autores:
Zhou Da, Rodrigo T. Rocha, Jiapeng Xu, Jérémy Streque, Chunlei Xu, Alessandro S. Savoia, Tingzhong Xu
Publicado en:
2026 IEEE 39th International Conference on Micro Electro Mechanical Systems (MEMS), 2026, ISSN 2160-1968
Editor:
IEEE
DOI:
10.1109/MEMS64181.2026.11419458
Autores:
Mark Suppelt, Sven Suppelt, Jan Helge Dörsam, Alexander A. Altmann, Mario Kupnik
Publicado en:
2025 IEEE Global Engineering Education Conference (EDUCON), 2025, ISSN 2165-9567
Editor:
IEEE
DOI:
10.1109/EDUCON62633.2025.11016546
Autores:
Zhou Da, Tingzhong Xu, Jérémy Streque, Alessandro S. Savoia
Publicado en:
2026 IEEE 39th International Conference on Micro Electro Mechanical Systems (MEMS), 2026, ISSN 2160-1968
Editor:
IEEE
DOI:
10.1109/MEMS64181.2026.11419277
Autores:
Mark Suppelt, Bastian Latsch, Julian Seiler, Farah N. Mansour, Felix Herbst, Stephan Schaumann, Sven Suppelt, Steffen Graffe, Philipp Beckerle, Mario Kupnik
Publicado en:
2025 IEEE SENSORS, 2025
Editor:
IEEE
DOI:
10.1109/SENSORS59705.2025.11330377
Autores:
Alexander A. Altmann, Sven Suppelt, Max Ruhl, Stephan Schaumann, Bastian Latsch, Omar Ben Dali, Sergey Zhukov, Dennis Flachs, Xiaoqing Zhang, Christiane Thielemann, Heinz Von Seggern, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793858
Autores:
Nils Demuth, Stephan Schaumann, Sonja Wismath, Bastian Latsch, Tobias Frey, Sven Suppelt, Elena Wiemer, Sören Soennecken, Christoph Haugwitz, Matthias Rutsch, Luise Jazdzewski, Achim Bittner, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201841
Autores:
Axel Jäger, Sven Suppelt, Christoph Haugwitz, Jan Helge Dörsam, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201289
Autores:
Tingzhong Xu, Zhou Da, Jérémy Streque, Zdeněk Havránek, Jiapeng Xu, Rodrigo Tumolin Rocha, Alessandro Stuart Savoia
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201611
Autores:
Sven Suppelt, Jan Helge Dörsam, Carsten Kleber, Alexander A. Altmann, Toni Schmitt, Harald Gietler, Stefan Hess, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793817
Autores:
Felix Herbst, Bastian Latsch, Edwin Peng, Nils Demuth, Sven Suppelt, Christoph Haugwitz, Mario Kupnik
Publicado en:
2025 IEEE SENSORS, 2025
Editor:
IEEE
DOI:
10.1109/SENSORS59705.2025.11330930
Autores:
Christoph Haugwitz, Felix Besser, David Zentgraf, Sören Soennecken, Jan Helge Dörsam, Sonja Wismath, Nils Demuth, Stephan Schaumann, Felix Herbst, Matthias Weigold, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201440
Autores:
Alexander A. Altmann, Sven Suppelt, Omar Ben Dali, Bastian Latsch, Dieter Spiehl, Sergey Zhukov, Felix Herbst, Jan Helge Dörsam, Andreas Blaeser, Mario Kupnik
Publicado en:
2024 IEEE SENSORS, 2024, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS60989.2024.10784906
Autores:
Milind Pandit, Robert Ukropec, Pieter Gijsenbergh
Publicado en:
2026 IEEE 39th International Conference on Micro Electro Mechanical Systems (MEMS), 2026, ISSN 2160-1968
Editor:
IEEE
DOI:
10.1109/MEMS64181.2026.11419303
Autores:
T. Friebe, G. Schrag, G. Bosetti, C. Bretthauer
Publicado en:
Vorträge, 2024
Editor:
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
DOI:
10.5162/SENSOREN2024/C3.2
Autores:
Jiapeng Xu, Tingzhong Xu, Rodrigo Tumolin Rocha, Chunlei Xu, Zhou Da, Humberto Campanella, Gabriele Schrag
Publicado en:
2026 IEEE 39th International Conference on Micro Electro Mechanical Systems (MEMS), 2026, ISSN 2160-1968
Editor:
IEEE
DOI:
10.1109/MEMS64181.2026.11419616
Autores:
Jan Helge Dörsam, Sven Suppelt, Tobias Bossert, Alexander A. Altmann, Claas Hartmann, Christoph Haugwitz, Yannick Schroedel, Tino Lang, Anne Harth, Christoph Heyl, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793929
Autores:
T. Friebe, M. Lenz, H. Ahrens, C. Bretthauer and G. Schrag
Publicado en:
MST Kongress 2025, 2025
Editor:
MST Kongress 2025
DOI:
10.30420/456614127
Autores:
Marco Schewa, Richard Gaggl, Bjoern Eversmann, Christian Bretthauer, Henning Ahrens, Ralf Brederlow
Publicado en:
2025 IEEE International Symposium on Circuits and Systems (ISCAS), 2025
Editor:
IEEE
DOI:
10.1109/ISCAS56072.2025.11043268
Autores:
Vicente Genovés, Tingzhong Xu, Rodrigo Tumolin, Tomás Gómez
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201528
Autores:
T.E.G. Álvarez-Arenas; P. Salso; V. Genovés
Publicado en:
Journal of Physics: Conference Series, 2024
Editor:
IOP Publishing
DOI:
10.1088/1742-6596/2822/1/012101
Autores:
Patricia Salso, Vicente Genovés and Tomás Gómez Álvarez-Arenas
Publicado en:
ICU 2023 to be publised in POMA, 2023
Editor:
DIGITAL.CSIC
Autores:
Sören Soennecken, Sonja Wismath, Jan Helge Dörsam, Anton Herzog, Christoph Haugwitz, Nils Demuth, Hanna Malang, Christoph M. Heyl, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201359
Autores:
Felix Herbst, Esan Sundaralingam, Bastian Latsch, Sven Suppelt, Julian Seiler, Alexander Anton Altmann, Mario Kupnik
Publicado en:
2024 IEEE SENSORS, 2024, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS60989.2024.10784826
Autores:
Epimitheas Georgitzikis, Pieter Gijsenbergh, Gianluca Massimino, Robert Ukropec, Milind Pandit, Jeremy Segers, Dominika Wysocka, Denis Van Lancker, Zhiyuan Shen, Grim Keulemans, Paresh Limaye, Erwin Hijzen
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201418
Autores:
Sonja Wismath, Atieh Razavi, Matthias Rutsch, Marius Finder, Christoph Haugwitz, Jan Helge Dörsam, Nils Demuth, Sören Soennecken, Regine Von Klitzing, Amin Rahimzadeh, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2025, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793883
Autores:
Eduardo Moreno Hernández, Roberto Carlos Giacchetta, Adriel Ivan Domke, Wagner Coelho de Alburquerque Pereira
Publicado en:
"International Conference ""NDT Days"" 2023 organized by Bulgarian Society for NDT ", Edición Volume 7, Edición 4, 2023, ISSN 2603-4018
Editor:
Bulgarian Society for NDT
Autores:
Jiapeng Xu, Gabriele Schrag, Zhou Da, Yong Wang, Tingzhong Xu
Publicado en:
2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2025, ISSN 2167-0021
Editor:
IEEE
DOI:
10.1109/TRANSDUCERS61432.2025.11109732
Autores:
Jan Helge Dörsam, Christian Kayser, Alexander A. Altmann, Sven Suppelt, Claas Hartmann, Christoph Haugwitz, Sonja Wismath, Sören Soennecken, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793980
Autores:
A. Vogl, G. Sordo, L. Lidicky
Publicado en:
Poster II, 2025
Editor:
AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf
DOI:
10.5162/EUROSENSORS2025/TP31
Autores:
Bastian Latsch, Alexander A. Altmann, Omar Ben Dali, Romol Chadda, Niklas Schäfer, Kilian Schäfer, Muhammad Bilal Khan, Jan Helge Dörsam, Felix Herbst, Sven Suppelt, Oliver Gutfleisch, Mario Kupnik
Publicado en:
2024 IEEE SENSORS, 2024, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS60989.2024.10784914
Autores:
Gabriele Schrag, Gabriele Bosetti
Publicado en:
2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024
Editor:
IEEE
DOI:
10.1109/DTIP62575.2024.10613058
Autores:
Maximilian L. Amberg, Sven Suppelt, Alexander A. Altmann, Florian G. Freidinger, Felix Herbst, Bastian Latsch, Mario Kupnik
Publicado en:
2024 IEEE SENSORS, 2024, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS60989.2024.10785132
Autores:
Alexander A. Altmann, Fatma Souissi, Omar Ben Dali, Sven Suppelt, Bastian Latsch, Jan Helge Dörsam, Sergey Zhukov, Dennis Flachs, Mario Kupnik
Publicado en:
2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2024, ISSN 2832-8256
Editor:
IEEE
DOI:
10.1109/FLEPS61194.2024.10604067
Autores:
Bastian Latsch, Alexander A. Altmann, Omar Ben Dali, Romol Chadda, Niklas Schäfer, Kilian Schäfer, Muhammad Bilal Khan, Jan Helge Dörsam, Felix Herbst, Sven Suppelt, Oliver Gutfleisch, Mario Kupnik
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10794160
Autores:
Alexander A. Altmann, Sven Suppelt, Bastian Latsch, Omar Ben Dali, Jan Helge Dörsam, Daniel G. E. Thiem, Mario Kupnik
Publicado en:
2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2024, ISSN 2832-8256
Editor:
IEEE
DOI:
10.1109/FLEPS61194.2024.10603940
Autores:
Tingzhong Xu, Damiano Caponi, Zhou Da
Publicado en:
2023 IEEE International Ultrasonics Symposium (IUS), 2023, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS51837.2023.10307481
Autores:
P. Salso, V. Genovés, T. Gómez
Publicado en:
ICU 2023 publised in POMA, 2023
Editor:
DIGITAL.CSIC
Autores:
Soren Soennecken,, Jan Helge Dorsam, Christoph Haugwitz, Axel Jager, Sonja Wismath, Nils Demuth, Mario Kupnik
Publicado en:
UFFC-JS2024, 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.26083/TUPRINTS-00030736
Autores:
Jiapeng Xu, Zhou Da, Gabriele Schrag, Jeremy Streque, Tingzhong Xu
Publicado en:
2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2025, ISSN 2167-0021
Editor:
IEEE
DOI:
10.1109/TRANSDUCERS61432.2025.11110449
Autores:
Stephan Schaumann, Nils Demuth, Sven Suppelt, Tom Middendorf, Omar Ben Dali, Bastian Latsch, Christoph Haugwitz, Luise E. Jazdzewski, Achim Bittner, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201754
Autores:
Gabriele Bosetti, Christian Bretthauer, Andreas Bogner, Michael Krenzer, Karolina Gierl, Heinrich Heiss, Gabriele Schrag
Publicado en:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, ISSN 2833-8596
Editor:
IEEE
DOI:
10.1109/EUROSIME60745.2024.10491462
Autores:
Jiapeng Xu, Gabriele Schrag, Zongru Doris Shao, Rodrigo Tumolin Rocha, Tingzhong Xu
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.1109/UFFC-JS60046.2024.10793964
Autores:
Vicente Genovés, Tingzhong Xu, Rodrigo Tumolin, Tomás Gómez
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201474
Autores:
Bastian Latsch, Niklas Schäfer, Stephan Schaumann, Steffen Graffe, Asghar Mahmoudi, Martin Grimmer, Alexander A. Altmann, Omar Ben Dali, Julian Seiler, Stephan Rinderknecht, Philipp Beckerle, Mario Kupnik
Publicado en:
2024 IEEE SENSORS, 2024, ISSN 2168-9229
Editor:
IEEE
DOI:
10.1109/SENSORS60989.2024.10784617
Autores:
Nils Demuth, Stephan Schaumann, Sonja Wismath, Boris Sosnov, Sven Suppelt, Bastian Latsch, Felix Herbst, Sören Soennecken, Christoph Haugwitz, Matthias Rutsch, Luise Jazdzewski, Achim Bittner, Mario Kupnik
Publicado en:
2025 IEEE International Ultrasonics Symposium (IUS), 2025, ISSN 1948-5727
Editor:
IEEE
DOI:
10.1109/IUS62464.2025.11201524
Autores:
Muhammad Hassan Malik, Zhou Da, Rodrigo Tumolin Rocha, Chunlei Xu, Tingzhong Xu
Publicado en:
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2025
Editor:
IEEE
DOI:
10.23919/EMPC63132.2025.11222470
Autores:
Felix Herbst, Sven Suppelt, Niklas Schäfer, Romol Chadda, Mario Kupnik
Publicado en:
Hardware, Edición 3, 2025, ISSN 2813-6640
Editor:
MDPI AG
DOI:
10.3390/HARDWARE3030007
Autores:
Latsch, Bastian; Schäfer, Niklas; Schaumann, Stephan; Graffe, Steffen; Mahmoudi, Asghar; Grimmer, Martin; Altmann, Alexander A.; Ben Dali, Omar; Seiler, Julian; Rinderknecht, Stephan; Beckerle, Philipp; Kupnik, Mario
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.26083/TUPRINTS-00030013
Autores:
Shahabodin Hashemi, Sayed; Martín Rodríguez, José Luis; Ruiz Molina, Ángel; Callejas Zafra, Antonio Manuel; Rus Carlborg, Guillermo
Publicado en:
Ultrasonics, 2026, ISSN 0041-624X
Editor:
Elsevier BV
DOI:
10.1016/J.ULTRAS.2025.107771
Autores:
Sonja Wismath, Fabian Merbeler, Elena Wiemer, Sven Suppelt, Felix Herbst, Sören Soennecken, Christoph Haugwitz, Jan Helge Dörsam, Matthias Rutsch, Yoojeong Kim, Christian Bretthauer, Hyunjoo Jenny Lee, Mario Kupnik
Publicado en:
IEEE Sensors Journal, Edición 26, 2025, ISSN 1530-437X
Editor:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/JSEN.2025.3620132
Autores:
Yousef Almashakbeh; Hirad Shamimi; Antonio Callejas; Guillermo Rus
Publicado en:
Scientific Reports, 2024, ISSN 2045-2322
Editor:
Nature Portfolio
DOI:
10.1038/s41598-024-69708-6
Autores:
Schäfer, Niklas; Latsch, Bastian; Schaumann, Stephan; Graffe, Steffen; Mohseni, Omid; Seiler, Julian; Altmann, Alexander A.; Ben Dali, Omar; Grimmer, Martin; Seyfarth, André; Kupnik, Mario; Beckerle, Philipp
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.26083/TUPRINTS-00030009
Autores:
Gómez Álvarez-Arenas, Tomás; Sipkens, Timothy A.; Corbin, Joel C.; Salso, Patricia; Genovés, Vicente
Publicado en:
Scientific Reports, 2024, ISSN 2045-2322
Editor:
Nature Publishing Group
DOI:
10.1038/s41598-024-67809-w
Autores:
Patricia Salso; Vicente Genovés; Beatriz Merillas Valero; Tomas Gómez Álvarez-Arenas
Publicado en:
Polymer Testing, 2025, ISSN 0142-9418
Editor:
Elsevier
DOI:
10.1016/J.POLYMERTESTING.2025.108837
Autores:
Beatriz Blanco; Roberto Palma; Manuel Hurtado; Gema Jiménez; Carmen Griñán-Lisón; Juan Melchor; Juan Antonio Marchal; Hector Gomez; Guillermo Rus; Juan Soler
Publicado en:
Mathematics and Computers in Simulation, 2025, ISSN 0378-4754
Editor:
Elsevier
DOI:
10.48550/ARXIV.2402.09847
Autores:
Suppelt, Sven; Altmann, Alexander A.; Schaumann, Stephan; Demuth, Nils; Müller, Marc; Jazdzewski, Luise E.; Gómez Álvarez-Arenas, Tomás E.; Bretthauer, Christian; Bittner, Achim; Kupnik, Mario
Publicado en:
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), 2024, ISSN 2375-0448
Editor:
IEEE
DOI:
10.26083/TUPRINTS-00030007
Autores:
Tomas Gomez Alvarez-Arenas
Publicado en:
The Journal of the Acoustical Society of America, Edición 155, 2024, ISSN 1520-8524
Editor:
Acoustical Society of America (ASA)
DOI:
10.1121/10.0027309
Autores:
Stephan Schaumann, Bastian Latsch, Niklas Schäfer, Omar Ben Dali, Julian Seiler, Jennifer Raynaud, Martin Grimmer, Herta Flor, Philipp Beckerle, Mario Kupnik
Publicado en:
IEEE Sensors Letters, Edición 8, 2024, ISSN 2475-1472
Editor:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/LSENS.2024.3417278
Autores:
Lola Fariñas; Tomás E. Gómez Álvarez-Arenas
Publicado en:
Ultrasonics, 2025, ISSN 2375-2548
Editor:
Elsevier
DOI:
10.1016/J.ULTRAS.2025.107735
Autores:
Felix Herbst, Romol Chadda, Julian Peters, David Riehl, Claas Hartmann, Sven Suppelt, Richard Breimann, Eckhard Kirchner, Klaus Hofmann, Sven Matthiesen, Mario Kupnik
Publicado en:
IEEE Sensors Journal, Edición 24, 2024, ISSN 1558-1748
Editor:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/JSEN.2024.3427833
Autores:
Mark Suppelt, Felix Herbst, Stephan Schaumann, David Riehl, Dirk Leiacker, Julian Peters, Sonja Wismath, Sven Suppelt, Klaus Hofmann, Sven Matthiesen, Mario Kupnik
Publicado en:
IEEE Sensors Letters, Edición 9, 2025, ISSN 2475-1472
Editor:
Institute of Electrical and Electronics Engineers (IEEE)
DOI:
10.1109/LSENS.2025.3588606
Autores:
Eslam Hussein, Bernd Waschneck, Christian Mayr
Publicado en:
Journal of Systems Architecture, Edición 148, 2024, ISSN 1383-7621
Editor:
Elsevier BV
DOI:
10.1016/J.SYSARC.2024.103080
Autores:
Paula Pleguezuelos-Beltrán; Sara Herráiz-Gil; Daniel Martínez-Moreno; Iria Medraño-Fernandez; Carlos León; Sara Guerrero-Aspizua
Publicado en:
Cosmetics, 2024, ISSN 2079-9284
Editor:
MDPI
DOI:
10.3390/cosmetics11040121
Autores:
Runar Dahl Hansen, Andreas Vogl, Paul Wittendorp, Guido Sordo
Publicado en:
IEEE ISAF2025, 2025
Editor:
IEEE
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