Periodic Reporting for period 2 - HICONNECTS (Heterogeneous Integration for Connectivity and Sustainability)
Periodo di rendicontazione: 2024-01-01 al 2024-12-31
In the below sections the main objectives derived for each of these areas are covered in further detail. To realize this objective the project consists of the following work packages:
- WP1: Management
- WP2: Heterogeneous integration pilot lines
- WP3: Heterogeneous integration systems productization
- WP4: Public health and safety demonstrators
- WP5: Automotive and smart city demonstrators
- WP2: Heterogeneous integration pilot lines: All pilot lines making progress but will require 9 month extension. Main achievement includes SiPh and InP modules tape-out by imec and FBH(T2.2 T2.1).
- WP3: Heterogeneous integration systems productization: the system productization main achievements include the process and metrology equipment development which are progress as planned; the manufacturing enhancements (such as IIOT setup, data analytics, and yield improvements) planning at ST-I; the HI PCB integration planning at AT&S was postponed by 6 month due to T2.2 delay and PCB manufacturing is planned for May 2025; the system developments configuration completion by NXP and NVIDIA have made good progress. NVIDIA tested the configuration with dummy components in preparations to the real components which will be received during the project 9 month extension.
- WP4: Public health and safety demonstrators: both use cases execution plans completed and 6 month extension requested due to delays in activities at TUE. THERMO, Novalix, TUE and NVIDIA will start demonstration during period 3.
- WP5: Automotive and smart city demonstrators: the three use cases execution plans completed and demonstration will start by mid 2025.