Heterogeneous Integration for Connectivity and Sustainability

Projektinformationen

HICONNECTS

ID Finanzhilfevereinbarung: 101097296

DOI

10.3030/101097296

EK-Unterschriftsdatum 2 Dezember 2022

Startdatum 1 Januar 2023

Enddatum 30 September 2026

Finanziert unter

• Digital, Industry and Space

Gesamtkosten

€ 101 900 657,84

EU-Beitrag

€ 24 573 772,08

Koordiniert durch

NXP SEMICONDUCTORS GERMANY GMBH
Germany

Periodic Reporting for period 2 - HICONNECTS (Heterogeneous Integration for Connectivity and Sustainability)

Berichtszeitraum: 2024-01-01 bis 2024-12-31

Zusammenfassung vom Kontext und den Gesamtzielen des Projekts

The overall objective of the HICONNECTS project is to support major societal and industrial challenges by developing heterogenous integration (HI) core technology solutions for energy-efficient and high-performance wireless/wired cloud and edge computing as well as automotive radar to solve two of the main state-of- the-art roadblocks: the transmission of Internet of Things (IoT) data over the IT network and sensing of objects to enable Highly Automated Driving (HAD). The second and directly linked objective is to use these HI components to develop solutions in societal and economical important areas, with major focus on Radio Frequency (RF) technologies (5G/6G and radar) and IT data growth infrastructure (networking cards and switches) for the advancement of vertical sectors such as connected vehicles, smart cities, and connected industry.
In the below sections the main objectives derived for each of these areas are covered in further detail. To realize this objective the project consists of the following work packages:
- WP1: Management
- WP2: Heterogeneous integration pilot lines
- WP3: Heterogeneous integration systems productization
- WP4: Public health and safety demonstrators
- WP5: Automotive and smart city demonstrators

Arbeit, die ab Beginn des Projekts bis zum Ende des durch den Bericht erfassten Berichtszeitraums geleistet wurde, und die wichtigsten bis dahin erzielten Ergebnisse

- WP1: Management: bi-monthly WPL meetings; various WP scheduled meeting; intermediate 6 month meeting in TEAM; period 2 technical review meeting (f2f in IMEC, Leuven, Belgium). Three amendments finalized and approved by the end of P2.
- WP2: Heterogeneous integration pilot lines: All pilot lines making progress but will require 9 month extension. Main achievement includes SiPh and InP modules tape-out by imec and FBH(T2.2 T2.1).
- WP3: Heterogeneous integration systems productization: the system productization main achievements include the process and metrology equipment development which are progress as planned; the manufacturing enhancements (such as IIOT setup, data analytics, and yield improvements) planning at ST-I; the HI PCB integration planning at AT&S was postponed by 6 month due to T2.2 delay and PCB manufacturing is planned for May 2025; the system developments configuration completion by NXP and NVIDIA have made good progress. NVIDIA tested the configuration with dummy components in preparations to the real components which will be received during the project 9 month extension.
- WP4: Public health and safety demonstrators: both use cases execution plans completed and 6 month extension requested due to delays in activities at TUE. THERMO, Novalix, TUE and NVIDIA will start demonstration during period 3.
- WP5: Automotive and smart city demonstrators: the three use cases execution plans completed and demonstration will start by mid 2025.

Fortschritte, die über den aktuellen Stand der Technik hinausgehen und voraussichtliche potenzielle Auswirkungen (einschließlich der bis dato erzielten sozioökonomischen Auswirkungen und weiter gefassten gesellschaftlichen Auswirkungen des Projekts)

the beyond state of the art (BSOTA) are included in the KPI tables which is part of the grant agreement technical annex. During the first period all the base line KPIs were advanced toward achieving the BSOTA KPIs but their achievements is expected toward the end of the 3rd period.

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