Periodic Reporting for period 1 - HICONNECTS (Heterogeneous Integration for Connectivity and Sustainability)
Berichtszeitraum: 2023-01-01 bis 2023-12-31
In the below sections the main objectives derived for each of these areas are covered in further detail. To realize this objective the project consists of the following work packages:
- WP1: Management
- WP2: Heterogeneous integration pilot lines
- WP3: Heterogeneous integration systems productization
- WP4: Public health and safety demonstrators
- WP5: Automotive and smart city demonstrators
- WP2: Heterogeneous integration pilot lines: All pilot lines making progress as planned. Main achievement includes SiPh modules tape-out by imec (T2.2).
- WP3: Heterogeneous integration systems productization: the system productization main achievements include the process and metrology equipment development which are progress as planned; the manufacturing enhancements (such as IIOT setup, data analytics, and yield improvements) planning at ST-I; the HI PCB integration planning at AT&S; and the system developments configuration completion by NXP and NVIDIA.
- WP4: Public health and safety demonstrators: both use cases execution plans completed. A new company ARBONOUT was added in amendment 2 to assist SOFTABILITY with the public safety demonstrator (drones inspection of forest fire). The new company contribution will start from period 2 and on.
- WP5: Automotive and smart city demonstrators: the three use cases execution plans completed. A new company, RAKUN, will be added during period 2. This company is a spinoff from FORD and will take over the AMR development. FORD will still provide the logistic warehouse demonstration location.