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Nano meta components for electronic smart wireless systems

Periodic Reporting for period 1 - SMARTWAY (Nano meta components for electronic smart wireless systems)

Berichtszeitraum: 2023-05-01 bis 2024-04-30

New communication and radar systems need small and tunable radio frequency devices, relying on the Internet of Things (IoT). With global mobile traffic expected to hit 4394 exabytes by 2030, ultra-fast, low-power processing will promote the 6G era, targeting data rates of up to 1 terabit per second. Radar sensors are crucial in wireless applications, with their frequency reaching up to 300GHz for higher sensitivity and inspection systems, while 60GHz sensors are important for smart homes and IoT applications. Current market challenges include limited antenna performance and frequency selectivity. SMARTWAY aims to create innovative designs using new materials for radar sensors, resulting in two industry-ready demonstrators.
During the fisrt year of the project, technical work has progressed well on both active WPs (WP1 and WP2).WP4 is dedeciated for the management and dissemination activities.
WP1 :
- IMT has explored new planar antennas using nanocrystalline graphene for 60-GHz applications. Please, refer to D1. 2 for details on design, simulations, fabrication, and measurements.
- IMT and Thales explored new miniaturized antennas using either pseudo-lumped elements with carbon nanotube varactors or coplanar waveguide lines with nanocrystalline graphene for 60-GHz applications. Refer to D1. 3 for detailed results on design, simulations, and measurements. Tests on CNT growth directly on NCG on silicon have also begun.
- IMT and IHP has had fruitful discussions with all the other partners about how to integrate antennas and filters/switches on the same silicon wafer (thickness of 200 µm) for compact 60-GHz radars. Please, refer to D1.5 “Heterogeneous integration platform develop. and perform. report” for more details.
- This task, led by Taipro, focuses on planning the integration of modules using assembly techniques and assessing thermal, mechanical, and reliability aspects. It will test two integration methods for the SiGe BiCMOS Radar chipset assembly: a standard solder flip chip process and a thermocompression process, which offers a higher thermal budget. Additionally, two underfill methods will be studied: standard underfill and non-conductive polymer. The second part involves modeling both integration methods to meet the defined thermal and reliability specifications.

WP2 :
The tasks involve selecting technical solutions for the demonstrator system, defining its expected performance for evaluation purposes, and designing the 60-GHz radar module. IMT discussed with partners to adapt solutions for the 60-GHz demo, incorporating specifications and packaging solutions.

WP4 :
- Organisation of progress meeting with all the consortium to follow the project
- logo and website have been done
- 5 publication related to the project
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