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UNISCOOL: SMART IN-CHIP LIQUID COOLING FOR ADVANCED MICROELECTRONIC SYSTEMS

Project description

Direct-to-chip liquid cooling technology to boost electronics thermal management

The EU-funded UniScool project plans to develop a patented liquid cooling system that can be embedded into a chip to address thermal management issues faced by the ICT industry. This innovative system will use thermally activated fins that adapt to varying heat loads, preventing overcooling and reducing pump power needs. With the potential to boost heat extraction capacity up to 1 kW/cm2, the proposed system also promises significant reductions in flow rate and power consumption and a tenfold reduction in space usage. Together with Women TechEU, UniScool will demonstrate a prototype of this in-chip liquid cooling solution. This prototype could potentially encourage semiconductor manufacturers to integrate UniScool’s technology into their microelectronic components for more sustainable and efficient thermal management.

Objective

The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant push for size and cost reduction settles thermal management as a big concern for the ICT industry. Consequently, cooling, with its enormous consumption of electricity and water has an increasingly large environmental impact, and new technologies to extract the heat in a more sustainable way are committed. A promising approach for more efficient thermal management is to directly embed liquid cooling inside the chip, eliminating the thermal resistance between the semiconductor die and the packaging.

UniScool proposes a new patented and highly innovative liquid cooling system, based on an adaptive heat sink that includes a series of thermally activated fins capable of efficiently adapting the local heat extraction to time-dependent and non-uniform heat load scenarios, providing high-temperature uniformity without a custom design stage, avoiding overcooling and reducing the required pumping power, what provides an added-value solution that improves the existing ones. But with this project, we aim to go further and enter a new leading thermal management paradigm by developing an embedded liquid cooling system at the chip stack with the advantages of self-adaptive fins. This solution can boost the heat extraction capacity of the system up to more than 1kW/cm2 with significantly reduced flow rate and pumping power consumption (x 0.5) high performance, and significantly reduced space (x10) in a sustainable and environmentally friendly way.

With Women TechEU, we aim to do a prototype demonstration of in-chip liquid cooling, embedded at the chip stack, based on a microchannel array with self-adaptive fins that regulate the local thermal resistance according to local temperature, which can be an open door for semiconductor manufacturers to believe in in-chip cooling and incorporate UniSCool solution in their microelectronic components.

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Keywords

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Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-CSA - HORIZON Coordination and Support Actions

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-EIE-2022-SCALEUP-02

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Coordinator

UNIVERSAL SMART COOLING S.L.
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 75 000,00
Address
PARC DE GARDENY S/N, EDIFICI CEDICO
25003 Lleida
Spain

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Este Cataluña Lleida
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data
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