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Dispersion force masked-based helium atom lithography

Descrizione del progetto

Migliori caratteristiche dei chip all’avanguardia

I chip semiconduttori sono la base su cui si fonda la digitalizzazione. La domanda dei cosiddetti chip all’avanguardia, quelli di dimensioni più ridotte (rispetto alle tecnologie meno elaborate, mature e di dimensioni maggiori), sta aumentando in modo esponenziale. Saranno fondamentali per l’economia europea in settori che vanno dall’industria automobilistica, ai servizi finanziari, alle TIC, all’intelligenza artificiale e all’informatica quantistica. Inoltre, questi chip all’avanguardia richiedono caratteristiche ottimizzate per soddisfare i requisiti di prestazioni ed efficienza energetica. Il progetto FabouLACE, finanziato dal CEI, prevede di sviluppare un prototipo che migliori le caratteristiche dei chip all’avanguardia. Il successo della dimostrazione potrebbe aprire la strada alla commercializzazione di questi impareggiabili chip all’avanguardia.

Obiettivo

As Margrethe Vestager, European Commission Executive Vice-President, said There is no digital without chips.
Leading-edge semiconductors provide the foundation of the digitalization of entire sectors and industries that are transforming the EU economy and of emerging technologies such as artificial intelligence and quantum computing.
Photolithography is currently used for the initial patterning step of chip manufacturing and leading-edge chips require smaller and smaller features.
The smallest features that can be produced with this technology (26 nm at present and expected to reach 16 nm in 2028) not only limits the performance and power efficiency of leading-edge chips, but also the opening of new markets linked to quantum devices and silicon devices with integrated light sources.
FabouLACE project catches this opportunity through a disruptive lithography approach that uses metastable atoms and dispersion force-based masks and enables features of 2 nm. The technology, currently at proof of concept stage and protected by two patents, will be brought at TRL 6 by the end of the project by developing a prototype. Its performances will be validated together with Imec (key actor in the development, testing and early adoption of nano- and digital technology innovations, including lithography) and end-users in the markets of interest. The spin-off Lace, founded in 2022, will bring the technology to the market by 2031. The technology has already attracted a great interest among investors (450k raised in few months) and among the major foundry Intel that accepted Lace in its highly competitive start-up program intel-ignite. Market and business readiness will be developed together with end-users and leveraging on the economic support from investors (>3M private funding expected to be attracted by 2026). The technological and business maturation is expected to result in as much as 628M in revenue in the 2031-2036 period. Let the quantum future begin.

Campo scientifico (EuroSciVoc)

CORDIS classifica i progetti con EuroSciVoc, una tassonomia multilingue dei campi scientifici, attraverso un processo semi-automatico basato su tecniche NLP.

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Parole chiave

Meccanismo di finanziamento

HORIZON-EIC - HORIZON EIC Grants

Coordinatore

LACE LITHOGRAPHY AS
Contribution nette de l'UE
€ 2 153 687,50
Indirizzo
THORMOHLENS GATE 51
5006 BERGEN
Norvegia

Mostra sulla mappa

PMI

L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione.

Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Collegamenti
Costo totale
€ 2 153 687,50

Partecipanti (1)