Objective Printed circuit boards are an indispensable technology present in all classes of modern electronics. Their flexible embodiments (flexPCBs) enable current and emerging form factors and drive the transition to human-centered applications. At the same time, PCBs are notoriously difficult to recycle and contribute majorly to the growth of electronic waste and an unsustainable use of resources. A paradigm change towards bioderived and biodegradable materials promises a remedy, however so far, no viable solution for sustainable (flex)PCBs exists. MycoSub takes on an entirely new approach of growing and refining fungal mycelium skins as environmentally friendly and entirely biodegradable, yet high performance substrate material for the manufacturing of flexPCBs. Building upon MycelioTronics, the first mycelium-based electronic circuits, we here aim at developing an industry-compatible process flow that seamlessly merges into established commercial procedures for rapid adoption of the technology. With facile post-processing steps that do not impede biodegradability, we will achieve a competitive flexible circuit board substrate with high thermal stability, high flexibility and low surface roughness. We aim to develop both conventional subtractive (etching) as well as fully sustainable additive manufacturing techniques for low-conductivity, soldering-compatible conducting traces. Such MycoSub-flexPCBs will ultimately provide unprecedented levels of sustainability through the combination of a biodegradable yet resilient substrate with efficient waste-minimizing, energy-saving workflows and re-use strategies for precious metals and electronic components. These endeavors will be accompanied by thorough material characterization, ensuring that MycoSub materials live up to the high requirements of the industry. Ultimately, MycoSub-flexPCB demoboards will showcase the potential of sustainable solutions for the broad ecosystem of flexible electronics. Fields of science natural sciencesbiological sciencesecologyecosystemsengineering and technologymechanical engineeringmanufacturing engineeringadditive manufacturing Keywords MycoSub Programme(s) HORIZON.1.1 - European Research Council (ERC) Main Programme Topic(s) ERC-2023-POC - ERC PROOF OF CONCEPT GRANTS Call for proposal ERC-2023-POC See other projects for this call Funding Scheme HORIZON-ERC-POC - HORIZON ERC Proof of Concept Grants Host institution UNIVERSITAT LINZ Net EU contribution € 150 000,00 Address ALTENBERGER STRASSE 69 4040 Linz Austria See on map Region Westösterreich Oberösterreich Linz-Wels Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data Beneficiaries (1) Sort alphabetically Sort by Net EU contribution Expand all Collapse all UNIVERSITAT LINZ Austria Net EU contribution € 150 000,00 Address ALTENBERGER STRASSE 69 4040 Linz See on map Region Westösterreich Oberösterreich Linz-Wels Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data