Skip to main content
Go to the home page of the European Commission (opens in new window)
English English
CORDIS - EU research results
CORDIS

Mycelium-based substrate for sustainable flexible PCBs

Project description

A new type of sustainable flexible circuit boards

The growing reliance on printed circuit boards (PCBs) in modern electronics has contributed to an increasing environmental challenge, as these devices are difficult to recycle and contribute to electronic waste. Flexible printed circuit boards (flexPCBs) are key to enabling cutting-edge technologies and human-centredapplications, but they share the same sustainability issues. The transition to biodegradable and bio-derived materials offers a potential solution, but viable options for sustainable flexPCBs remain elusive. The ERC-funded MycoSub project will develop fungal mycelium-based substrates that are biodegradable, high-performance, and environmentally friendly. By integrating them into established manufacturing processes, MycoSub aims to create a fully sustainable, flexible circuit board solution, reducing waste and energy consumption while maintaining industry standards.

Objective

Printed circuit boards are an indispensable technology present in all classes of modern electronics. Their flexible embodiments (flexPCBs) enable current and emerging form factors and drive the transition to human-centered applications. At the same time, PCBs are notoriously difficult to recycle and contribute majorly to the growth of electronic waste and an unsustainable use of resources. A paradigm change towards bioderived and biodegradable materials promises a remedy, however so far, no viable solution for sustainable (flex)PCBs exists. MycoSub takes on an entirely new approach of growing and refining fungal mycelium skins as environmentally friendly and entirely biodegradable, yet high performance substrate material for the manufacturing of flexPCBs. Building upon MycelioTronics, the first mycelium-based electronic circuits, we here aim at developing an industry-compatible process flow that seamlessly merges into established commercial procedures for rapid adoption of the technology. With facile post-processing steps that do not impede biodegradability, we will achieve a competitive flexible circuit board substrate with high thermal stability, high flexibility and low surface roughness. We aim to develop both conventional subtractive (etching) as well as fully sustainable additive manufacturing techniques for low-conductivity, soldering-compatible conducting traces. Such MycoSub-flexPCBs will ultimately provide unprecedented levels of sustainability through the combination of a biodegradable yet resilient substrate with efficient waste-minimizing, energy-saving workflows and re-use strategies for precious metals and electronic components. These endeavors will be accompanied by thorough material characterization, ensuring that MycoSub materials live up to the high requirements of the industry. Ultimately, MycoSub-flexPCB demoboards will showcase the potential of sustainable solutions for the broad ecosystem of flexible electronics.

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.

You need to log in or register to use this function

Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-ERC-POC - HORIZON ERC Proof of Concept Grants

See all projects funded under this funding scheme

Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) ERC-2023-POC

See all projects funded under this call

Host institution

UNIVERSITAT LINZ
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 150 000,00
Address
ALTENBERGER STRASSE 69
4040 Linz
Austria

See on map

Region
Westösterreich Oberösterreich Linz-Wels
Activity type
Higher or Secondary Education Establishments
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data

Beneficiaries (1)

My booklet 0 0