Project description
Semiconductor packaging with precision and efficiency
The semiconductor packaging industry faces challenges in miniaturisation, with the demand for smaller, more efficient components escalating. Current manufacturing methods often struggle with high costs, low scalability, and limitations in precision for advanced 2D and 3D interconnects. As the micro-LED market booms, the need for cost-effective technologies becomes even more critical. Additionally, there is a constant drive to improve throughput while maintaining accuracy. The EIC-funded Impulse Printing project will introduce unprecedented scalability, accuracy, and throughput, enabling interconnect printing for both 2D and 3D applications. Overall, it delivers feature sizes from <10 µm to >100 µm, offering unparalleled performance, low ownership costs, and a compact footprint. This technology is poised to reshape the industry.
Objective
At Fonontech, our vision is to pioneer a transformative and sustainable era in semiconductor packaging industry through our proprietary cutting-edge technology, Impulse Printing. Originating from extensive research and development at the Dutch leading Applied Research Institute TNO, the Impulse Printing technology has the unprecedented scalability, accuracy, and throughput for both 2D and 3D interconnect printing for the billion-dollar semiconductor and micro-LED packaging industry. The technology can attain feature sizes ranging from <10 µm to >100 µm in 3D, with the highest throughput and lowest cost of ownership, providing major competitive edge particularly in the critical lower feature range essential for enabling product miniaturization. Impulse Printing, distinguished by minimal cost of ownership and facility footprint, is safeguarded by 14 patents. It is slated for direct sales to high-volume electronic device manufacturers or through system integrators securing the company a revenue of €533 M by 2030.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.3.1 - The European Innovation Council (EIC)
MAIN PROGRAMME
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-EIC-ACC - HORIZON EIC Accelerator
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-EIC-2024-ACCELERATOR-02
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
5656 AE Eindhoven
Netherlands
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.