Project description
Semiconductor packaging with precision and efficiency
The semiconductor packaging industry faces challenges in miniaturisation, with the demand for smaller, more efficient components escalating. Current manufacturing methods often struggle with high costs, low scalability, and limitations in precision for advanced 2D and 3D interconnects. As the micro-LED market booms, the need for cost-effective technologies becomes even more critical. Additionally, there is a constant drive to improve throughput while maintaining accuracy. The EIC-funded Impulse Printing project will introduce unprecedented scalability, accuracy, and throughput, enabling interconnect printing for both 2D and 3D applications. Overall, it delivers feature sizes from <10 µm to >100 µm, offering unparalleled performance, low ownership costs, and a compact footprint. This technology is poised to reshape the industry.
Objective
At Fonontech, our vision is to pioneer a transformative and sustainable era in semiconductor packaging industry through our proprietary cutting-edge technology, Impulse Printing. Originating from extensive research and development at the Dutch leading Applied Research Institute TNO, the Impulse Printing technology has the unprecedented scalability, accuracy, and throughput for both 2D and 3D interconnect printing for the billion-dollar semiconductor and micro-LED packaging industry. The technology can attain feature sizes ranging from <10 m to >100 m in 3D, with the highest throughput and lowest cost of ownership, providing major competitive edge particularly in the critical lower feature range essential for enabling product miniaturization. Impulse Printing, distinguished by minimal cost of ownership and facility footprint, is safeguarded by 14 patents. It is slated for direct sales to high-volume electronic device manufacturers or through system integrators securing the company a revenue of 533 M by 2030.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: https://op.europa.eu/en/web/eu-vocabularies/euroscivoc.
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Keywords
Programme(s)
- HORIZON.3.1 - The European Innovation Council (EIC) Main Programme
Call for proposal
(opens in new window) HORIZON-EIC-2024-ACCELERATOR-02
See other projects for this callFunding Scheme
HORIZON-EIC-ACC - HORIZON EIC AcceleratorCoordinator
5581 WG WAALRE
Netherlands
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.