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Silicon-Rich Materials for Advanced Semiconductor Fabrication

Project description

Preparing semiconductor manufacturing for the next generation

Semiconductor chips are integral to virtually all modern technologies, yet producing them for next-generation performance remains complex. It requires advanced materials and equipment capable of nanometre-scale precision. As chip demands continue to grow, the need for more powerful, efficient, and compact designs drives the industry to explore new techniques. Extreme ultraviolet lithography (EUVL) is key to achieving these breakthroughs, but developing the materials necessary for EUVL, particularly for structures under 3 nm, is highly demanding. With this in mind, the EIC-funded IO-PR project focuses on overcoming these material challenges. PiBond, one of the two global leaders in inorganic EUVL materials, aims to unlock the advanced chips market by developing groundbreaking materials that meet future needs.

Objective

Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision required for their manufacture. To further improve semiconductor chips performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally who have innovated inorganic EUVL materials meeting future needs. Yet, the development of materials, which enable the formulation chip structures below 3nm node, is extremely challenging. It requires extreme molecular material control and outstanding quality and there is a myriad of challenges to overcome for a successful material and process. This high-risk project enables us to unlock a significant portion of advanced chips market of >500Bn€ and SAM of >3Bn€ in photoresist materials. Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).

Fields of science (EuroSciVoc)

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Keywords

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Programme(s)

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Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-EIC-ACC-BF - HORIZON EIC Accelerator Blended Finance

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-EIC-2023-ACCELERATOR-01

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Coordinator

PIBOND OY
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 487 240,00
Address
KUTOJANTIE 2B
02630 Espoo
Finland

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Manner-Suomi Helsinki-Uusimaa Helsinki-Uusimaa
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 3 553 200,00

Participants (2)

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