Objective
Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision required for their manufacture. To further improve semiconductor chips performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally who have innovated inorganic EUVL materials meeting future needs. Yet, the development of materials, which enable the formulation chip structures below 3nm node, is extremely challenging. It requires extreme molecular material control and outstanding quality and there is a myriad of challenges to overcome for a successful material and process. This high-risk project enables us to unlock a significant portion of advanced chips market of >500Bn and SAM of >3Bn in photoresist materials. Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
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Keywords
Programme(s)
- HORIZON.3.1 - The European Innovation Council (EIC) Main Programme
Funding Scheme
HORIZON-EIC-ACC-BF - HORIZON EIC Accelerator Blended FinanceCoordinator
02630 Espoo
Finland
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.