Skip to main content
Go to the home page of the European Commission (opens in new window)
English en
CORDIS - EU research results
CORDIS

Silicon-Rich Materials for Advanced Semiconductor Fabrication

Project description

Preparing semiconductor manufacturing for the next generation

Semiconductor chips are integral to virtually all modern technologies, yet producing them for next-generation performance remains complex. It requires advanced materials and equipment capable of nanometre-scale precision. As chip demands continue to grow, the need for more powerful, efficient, and compact designs drives the industry to explore new techniques. Extreme ultraviolet lithography (EUVL) is key to achieving these breakthroughs, but developing the materials necessary for EUVL, particularly for structures under 3 nm, is highly demanding. With this in mind, the EIC-funded IO-PR project focuses on overcoming these material challenges. PiBond, one of the two global leaders in inorganic EUVL materials, aims to unlock the advanced chips market by developing groundbreaking materials that meet future needs.

Objective

Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision required for their manufacture. To further improve semiconductor chips performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally who have innovated inorganic EUVL materials meeting future needs. Yet, the development of materials, which enable the formulation chip structures below 3nm node, is extremely challenging. It requires extreme molecular material control and outstanding quality and there is a myriad of challenges to overcome for a successful material and process. This high-risk project enables us to unlock a significant portion of advanced chips market of >500Bn€ and SAM of >3Bn€ in photoresist materials. Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).

Fields of science (EuroSciVoc)

This project has not yet been classified with EuroSciVoc.
Be the first one to suggest relevant scientific fields and help us improve our classification service

Keywords

Programme(s)

Topic(s)

Funding Scheme

HORIZON-EIC-ACC-BF - HORIZON EIC Accelerator Blended Finance

See all projects funded under this funding scheme

Call for proposal

(opens in new window) HORIZON-EIC-2023-ACCELERATOR-01

See all projects funded under this call

Coordinator

PIBOND OY
Net EU contribution
€ 2 487 240,00
Address
KUTOJANTIE 2B
02630 Espoo
Finland
SME
Yes
Region
Manner-Suomi Helsinki-Uusimaa Helsinki-Uusimaa
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 3 553 200,00

Participants (2)