Projektbeschreibung
Nanoelectronics Technology
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects. For Lithography, the key areas of illumination systems for mask aligners, EUV mask manufacturing and intelligent overlay management are addressed as well as massively parallel e-beam lithography. In addition, three important processes are addressed: low temperature oxidation, cleaning of sensitive interconnect stacks/structures and ion implantation for ultra shallow junctions and defect engineering. For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilised with specifications that will be refined for each equipment type for the progressively emerging technology nodes.Overall SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.
SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment themes are equally spread amongst processing and metrology equipment, heading beyond the current state-of-the-art both for More Moore and More than Moore applications. The strategic objective of SEAL is to effectively combine efforts, resources and expertise in the joint assessment of novel equipment supported by cross-cut R&D dedicated to the identified needs of the assessment sub-projects.For Lithography, the key areas of illumination systems for mask aligners, EUV mask manufacturing and intelligent overlay management are addressed as well as massively parallel e-beam lithography. In addition, three important processes are addressed: low temperature oxidation, cleaning of sensitive interconnect stacks/structures and ion implantation for ultra shallow junctions and defect engineering. For metrology and analysis, the main focus is on enabling innovative systems to efficiently contribute to at-line and in-line monitoring and control within semiconductor facilities. Without such equipment, it will not be possible to validate progressively advanced processes during development and manufacturing.Cross-cut R&D activities relating to all equipment assessment sub-projects are covered including APC, model based control, equipment simulation, enhanced wafer and equipment logistics, advanced communication and man machine-interfaces, and virtual equipment engineering. A common approach for the assessment activities will be utilised with specifications that will be refined for each equipment type for the progressively emerging technology nodes.Overall SEAL will strengthen the European equipment manufacturing industry in an ideal and sustainable way by combining advanced R&D topics in equipment sub-projects involving a wide community of users, research institutes and equipment suppliers with many SMEs.
Wissenschaftliches Gebiet
Programm/Programme
Thema/Themen
Aufforderung zur Vorschlagseinreichung
FP7-ICT-2009-5
Andere Projekte für diesen Aufruf anzeigen
Finanzierungsplan
CP - Collaborative project (generic)Kontakt Koordinator
Koordinator
80686 Munchen
Deutschland
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Beteiligte (38)
Beteiligung beendet
9500 Villach
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2700 WIENER NEUSTADT
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8141 UNTERPREMSTATTEN
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3001 Leuven
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CH - 7323 Wangs
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2068 Hauterive
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75447 Sternenfels
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85551 Heimstetten
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07745 Jena
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89160 Dornstadt
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65205 Wiesbaden
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85716 Unterschleissheim
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Beteiligung beendet
84034 LANDSHUT
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51429 Bergisch Gladbach
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Beteiligung beendet
85748 GARCHING
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85579 Neubiberg
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57078 Siegen
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81677 Munchen
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01109 Dresden
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73730 ESSLINGEN
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73463 Westhausen
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85748 GARCHING
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08193 Cerdanyola Del Valles
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75015 PARIS 15
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38920 Crolles
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74000 Annecy
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13790 Rousset
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Beteiligung beendet
38190 Bernin
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13106 ROUSSET
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1117 BUDAPEST
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76705 Rehovot
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23100 Migdal Haemek
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28100 NOVARA
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20864 AGRATE BRIANZA
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2628 XK DELFT
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BS48 4DD Nailsea
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12201 Albany Ny
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19801 WILMINGTON NEW CASTLE DE
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