Final Report Summary - M&M´S (New Paradigms for MEMS & NEMS Integration)
(1) Wafer-Level Heterogeneous Integration for MEMS and NEMS, where we explored new and improved wafer-level heterogeneous integration technologies for MEMS and NEMS devices. Novel, high yield wafer bonding and transfer processes have been established for integrating ultra-thin silicon and graphene membranes on top of CMOS-based electronic circuits. Furthermore, this project led to the completely novel discovery of crack-defined nanogap electrodes, which show great potential for molecular electronics and tunnelling devices.
(2) Integration of Materials into MEMS Using High-Speed Wire Bonding Tools, where we explored new ways of integrating various types of wire materials into MEMS devices. Efficient processes for very high-aspect ratio through silicon and through glass vias, as well as various coils structures have been implemented. A novel, high-speed magnetic assembly method for TSV filling has been developed.
(3) Free-Form 3D Printing of Silicon Micro- and Nanostructures, where we explored entirely novel ways of implementing silicon MEMS and NEMS structures that can be arbitrarily shaped. The viability of a new 3D printing process for implementing silicon nanostructures has been demonstrated.