Deliverables
40 publications in total
Solid state memory data erasure: GuidanceD5.2 is the outcome of Task 5.2
Design for Disassembly GuidelinesD 7.4 is the final outcome from Task 7.4, is an input to the policy activities in WP 8.
Product repair guidesD 7.6 is the final outcome of Task 7.6 and is closely aligned with the product developments in WP 1.
D4R tablet: Fab Lab production modelD1.4 is the outcome of Task 1.7, and will be aligned with the findings of Task 6.3 (business model)
Policy Analysis: Summary of recommendationsCompilation of policy briefs and input provided to standardisation activities
Disassembly studiesD 7.1 is the outcome from Task 7.1 and will provide guidance for technology developments in WPs 1-5.
D3.2 is the outcome of Task 3.3, and will be the point of reference for the final economic and environmental assessments in WP 7
Puzzle IoT: Modular IoT system Technology Demonstrator, Technical documentationD1.2 is the joint outcome of Tasks 1.4, 1.5
Reparability Score: Validation and tool implementationD 7.5 is the final outcome of Task 7.5.
Device with reused components: Technology demonstrationD4.3 is the outcome of Task 4.3, and will be the point of reference for the final economic and environmental assessments in WP 7
Aligning, sorting and handling equipment: Technology demonstrationD3.1 is the outcome of Task 3.2, and will be the point of reference for the final economic and environmental assessments in WP 7
D4R tablet: Pilot batch (30 units)D1.9 is one of the outcomes of Task 1.7 and comprises physical units of tablets produced as a small batch
Remanufactured packaged semiconductors: Technology validationD4.2 is the outcome of Task 4.2, will be the input for Task 4.3 and will be the point of reference for the final economic and environmental assessments in WP 7
D4R tablet: Concept and technology validationD1.3 is the outcome of Task 1.6, and will be the input for Task 1.7
3 dissemination events Europe wide organized and handouts available
Blog posts compilationCompilation of 14 blog posts released over the project lifetime.
Publications
Author(s):
Bernd Kopacek
Published in:
European Rare Earth Resources Conference - ERES2017, Issue May 29-31,2017, 2017
Publisher:
European Rare Earth Resources Conference - ERES2017
Author(s):
Bernd Kopacek
Published in:
CRETE2018 - 6th International Conference on Industrial and Hazardous Waste, Issue September 4-7, 2018, 2018
Publisher:
TU Crete
Author(s):
Bernd Kopacek
Published in:
SUM 2018 - Fourth Symposium on Urban Mining and Circular Economy, Issue May 21-23, 2018, 2018
Publisher:
Eurowaste
Author(s):
Bas Flipsen, Conny Bakker, Guus van Bohemen
Published in:
Electronics Goes Green 2016+, Issue September 7-9, 2016, 2016
Publisher:
Fraunhofer IZM
Author(s):
Johanna Reimers
Published in:
Circular Materials Conference, Issue March 7-8, 2018, 2018
Publisher:
Nordic Publishing
Author(s):
Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez
Published in:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, Page(s) 1-7, ISBN 978-0-9568086-4-6
Publisher:
IEEE
DOI:
10.23919/EMPC.2017.8346853
Author(s):
Bernd Kopacek
Published in:
5th International Conference on Serviceology, Issue July 12-14, 2017, 2017
Publisher:
University of Vienna
Author(s):
Bernd Kopacek
Published in:
PLATE 2017 - Product Lifetimes And The Environment, Issue November 8-10, 2017, 2017
Publisher:
TU Delft
Author(s):
Karsten Schischke, Marina Proske, Miquel Ballester Salvà, Laura Gerritsen, Nikolai Richter,
Nils F. Nissen, Klaus‐Dieter Lang, Christian Clemm
Published in:
8th International Conference on Life Cycle Management, 2017
Publisher:
Luxembourg Institute of Science and Technology (LIST)
Author(s):
Karsten Schischke
Published in:
The Ecodesign Directive in a changing policy climate: challenges & opportunities, Issue January 25, 2018, 2018
Publisher:
eceee, Lund University
Author(s):
Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Published in:
2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-8
Publisher:
IEEE
DOI:
10.1109/EGG.2016.7829810
Author(s):
Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil
Published in:
2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-7
Publisher:
IEEE
DOI:
10.1109/EGG.2016.7829846
Author(s):
Slowak, André P.; Regenfelder, Max; Manessis, Dionysios
Published in:
Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016
Publisher:
Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia
Author(s):
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Published in:
Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016
Publisher:
Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia
Author(s):
Max Regenfelder, Andre P. Slowak, Alejandro Santacreu
Published in:
2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-6
Publisher:
IEEE
DOI:
10.1109/EGG.2016.7829847
Author(s):
Rainer Pamminger, Stefan Kuso, Wolfgang Wimmer, Gerhard Podhardsky
Published in:
2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-9
Publisher:
IEEE
DOI:
10.1109/EGG.2016.7829815
Author(s):
Krystan Marquardt
Published in:
Entwicklerforum Batterien & Ladekonzepte, Issue February 15-16, 2017, 2017
Publisher:
DESIGN&ELEKTRONIK
Author(s):
Karsten Schischke
Published in:
Emerging Green 2015, Issue Sept 22-24, 2015, 2015
Publisher:
Green Electronics Council
Author(s):
D. Nguyen, S. Martinez, M. Khramova, Blancco, FI
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
J. Reimers, Refind Technologies, SE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Published in:
MRS Spring Meeting 2019, Symposium ES13: Materials Selection and Design—A Tool to Enable Sustainable Materials Development and a Reduced Materials Footprint, Issue April 22-26, 2019, 2019
Publisher:
MRS
Author(s):
C. Clemm, K. Marquardt, N. Dethlefs, K. Schischke, R. Hahn, N. Nissen, Fraunhofer IZM, DE
K. Lang, TU Berlin, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
J. Ospina, P. Maher, A. Galligan, MicroPro, IE, J. Gallagher, D. O’Donovan, GMIT Letterfrack, IE, G. Kast, ReUse, DE, K. Schischke, Fraunhofer IZM, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
M. Khramova, S. Martinez, Blancco, FI
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE ELectronics
Author(s):
M. Regenfelder, ReUse, DE
R. Pamminger, TU Wien, AT
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
Karsten Schischke, Nils F. Nissen, Klaus-Dieter Lang
Published in:
Sustainable Innovation 2019, 22nd International Conference, Road to 2030: Sustainability, Business Models, Innovation and Design, Issue March 4-5, 2019, 2019, Page(s) 179-187
Publisher:
The Centre for Sustainable Design
Author(s):
T. Kupka, G. Schulz, T. Krivec, AT&S, AT
W. Wimmer, Vienna University of Technology, AT
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
B. Flipsen, M. Huisken, iFixit, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL
P. Ciszewski, P. Dawidowicz, Semicon, PL
G. Podhradsky, Speech Processing Solutions, AT
R. Ambrosch, Pro Automation, AT
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
R. Ambrosch, E. Ambrosch, Pro Automation, AT
R. Pamminger, S. Glaser, Vienna University of Technology, AT
M. Regenfelder, ReUse, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
R. Pamminger, S. Glaser, W. Wimmer, Vienna University of Technology, AT
G. Podhradsky, Speech Processing Solutions, AT
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
B. May, A. Santacreu, Circular Devices, FI
N. Nissen, K. Schischke, Fraunhofer IZM, DE
K. Lang, TU Berlin, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
K. Schischke, M. Proske, J. Reinhold, Fraunhofer IZM, DE, M. Ballester, Fairphone, NL, K. Lang, TU
Berlin, DE, M. Regenfelder, ReUse, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
D. Sánchez, K. Schischke, N. Nissen, Fraunhofer IZM, DE
K. Lang, TU Berlin, DE
Published in:
Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher:
CARE Electronics
Author(s):
Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen
Published in:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Publisher:
IEEE
DOI:
10.23919/empc44848.2019.8951816
Author(s):
Karsten Schischke, Marina Proske, Rainer Pamminger, Sebastian Glaser, Nils F. Nissen, Martin Schneider-Ramelow
Published in:
Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019
Publisher:
LCM 2019
Author(s):
Dr. Rainer Pamminger, Sebastian Glaser, Prof. Dr. Wolfgang Wimmer,
Karsten Schischke, Marina Proske
Published in:
Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019
Publisher:
LCM 2019
Author(s):
Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch
Published in:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-5, ISBN 978-0-9568086-6-0
Publisher:
IEEE
DOI:
10.23919/empc44848.2019.8951884
Author(s):
Nils F. Nissen, Julia Reinhold, Karsten Schischke, Klaus-Dieter-Lang
Published in:
Proceedings of 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign2019), Issue Nov 25-27, 2019, 2019
Publisher:
Ecodenet
Author(s):
R. Pamminger, S. Glaser, R. Ambrosch, M. Genner
Published in:
International Symposium for Production and Research, 2019, Vienna, 2019
Publisher:
ISPR 2019
Author(s):
J. Ospina, P. Maher, A. Galligan, MicroPro
J. Gallagher, D. O’Donovan,GMIT Letterfrack;
St. Knorr, Designing Berlin
K. Schischke, Fraunhofer IZM
Published in:
PLATE 2019 - Product Lifetimes And The Environment, Issue Sep.19, 2019
Publisher:
PLATE 2019 - Product Lifetimes And The Environment
Author(s):
D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann
Published in:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Publisher:
IEEE
DOI:
10.23919/empc44848.2019.8951790
Author(s):
Tobias Kupka
Published in:
2018
Publisher:
Tobias Kupka
Author(s):
Julia Verena Zündel
Published in:
2018
Publisher:
Julia Verena Zündel
Author(s):
Octavian Graf Pilati
Published in:
2018
Publisher:
Octavian Graf Pilati
Author(s):
Piotr Dawidowicz, Piotr Ciszewski (Semicon)
Published in:
Elektronik, Issue 10/2016, 2016, Page(s) 2
Publisher:
Elektronik
Author(s):
Piotr Ciszewski
Published in:
EVERTIQ, Issue 04.11.2015, 2015
Publisher:
EVERTIQ
Author(s):
Piotr Ciszewski
Published in:
EVERTIQ, Issue 17.11.2015, 2015
Publisher:
EVERTIQ
Author(s):
Janusz Sitek
Published in:
ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA, Issue 1/6, 2016, Page(s) 119-122, ISSN 0033-2089
Publisher:
SIGMA-NOT
DOI:
10.15199/13.2016.6.25
Author(s):
Karsten Schischke, Marina Proske, Nils F. Nissen, Martin Schneider-Ramelow
Published in:
MRS Energy & Sustainability, Issue 6, 2019, ISSN 2329-2229
Publisher:
Cambridge University Press
DOI:
10.1557/mre.2019.17
Author(s):
Kristin Linnenkoper
Published in:
Recycling International, Issue 10 times/year, 2016, Page(s) 32-33, ISSN 1387-8700
Publisher:
HUSS-VERLAG GmbH
Intellectual Property Rights
Application/Publication number:
JP
2016-007332
Date:
2016-04-01
Applicant(s):
CIRCULAR DEVICES OY
Application/Publication number:
RCD
002806372
Date:
2015-10-01
Applicant(s):
CIRCULAR DEVICES OY
Application/Publication number:
JP
2016-007331
Date:
2016-04-01
Applicant(s):
CIRCULAR DEVICES OY
Application/Publication number:
US
29/560,085
Date:
2016-04-01
Applicant(s):
CIRCULAR DEVICES OY
Application/Publication number:
EUIPO
004525970-0001
Date:
2017-11-28
Applicant(s):
CIRCULAR DEVICES OY
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