Deliverables Documents, reports (7) Compilation of project publications 40 publications in total Solid state memory data erasure: Guidance D5.2 is the outcome of Task 5.2 Design for Disassembly Guidelines D 7.4 is the final outcome from Task 7.4, is an input to the policy activities in WP 8. Product repair guides D 7.6 is the final outcome of Task 7.6 and is closely aligned with the product developments in WP 1. D4R tablet: Fab Lab production model D1.4 is the outcome of Task 1.7, and will be aligned with the findings of Task 6.3 (business model) Policy Analysis: Summary of recommendations Compilation of policy briefs and input provided to standardisation activities Disassembly studies D 7.1 is the outcome from Task 7.1 and will provide guidance for technology developments in WPs 1-5. Demonstrators, pilots, prototypes (8) Disassembly equipment: Technology demonstration D3.2 is the outcome of Task 3.3, and will be the point of reference for the final economic and environmental assessments in WP 7 Puzzle IoT: Modular IoT system Technology Demonstrator, Technical documentation D1.2 is the joint outcome of Tasks 1.4, 1.5 Reparability Score: Validation and tool implementation D 7.5 is the final outcome of Task 7.5. Device with reused components: Technology demonstration D4.3 is the outcome of Task 4.3, and will be the point of reference for the final economic and environmental assessments in WP 7 Aligning, sorting and handling equipment: Technology demonstration D3.1 is the outcome of Task 3.2, and will be the point of reference for the final economic and environmental assessments in WP 7 D4R tablet: Pilot batch (30 units) D1.9 is one of the outcomes of Task 1.7 and comprises physical units of tablets produced as a small batch Remanufactured packaged semiconductors: Technology validation D4.2 is the outcome of Task 4.2, will be the input for Task 4.3 and will be the point of reference for the final economic and environmental assessments in WP 7 D4R tablet: Concept and technology validation D1.3 is the outcome of Task 1.6, and will be the input for Task 1.7 Websites, patent fillings, videos etc. (2) Dissemination events 3 dissemination events Europe wide organized and handouts available Blog posts compilation Compilation of 14 blog posts released over the project lifetime. Publications Conference proceedings (42) Mobile Hydrometallurgy to recover rare and precious metals from WEEE Author(s): Bernd Kopacek Published in: European Rare Earth Resources Conference - ERES2017, Issue May 29-31,2017, 2017 Publisher: European Rare Earth Resources Conference - ERES2017 Recovery of precious and critical metals as a service Author(s): Bernd Kopacek Published in: CRETE2018 - 6th International Conference on Industrial and Hazardous Waste, Issue September 4-7, 2018, 2018 Publisher: TU Crete MOBILE HYDROMETALLURGY TO RECOVER RARE AND PRECIOUS METALS FROM WEEE Author(s): Bernd Kopacek Published in: SUM 2018 - Fourth Symposium on Urban Mining and Circular Economy, Issue May 21-23, 2018, 2018 Publisher: Eurowaste Developing a Reparability Indicator for Electronic Products Author(s): Bas Flipsen, Conny Bakker, Guus van Bohemen Published in: Electronics Goes Green 2016+, Issue September 7-9, 2016, 2016 Publisher: Fraunhofer IZM Using machine learning to empower automation within reverse logistics Author(s): Johanna Reimers Published in: Circular Materials Conference, Issue March 7-8, 2018, 2018 Publisher: Nordic Publishing Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications Author(s): Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez Published in: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, Page(s) 1-7, ISBN 978-0-9568086-4-6 Publisher: IEEE DOI: 10.23919/EMPC.2017.8346853 Recycling as a Service - a New Business Model to Recover Critical and Precious Metals from Industrial Wastes Author(s): Bernd Kopacek Published in: 5th International Conference on Serviceology, Issue July 12-14, 2017, 2017 Publisher: University of Vienna INTELLIGENT DISASSEMBLY OF COMPENENTS FROM PRINTED CIRCUIT BOARDS TO ENABLE RE-USE AND MORE EFFICIENT RECOVERY OF CRITICAL METALS Author(s): Bernd Kopacek Published in: PLATE 2017 - Product Lifetimes And The Environment, Issue November 8-10, 2017, 2017 Publisher: TU Delft Modular Smartphones: Design Strategies Driven by Life Cycle Assessment Evidence Author(s): Karsten Schischke, Marina Proske, Miquel Ballester Salvà, Laura Gerritsen, Nikolai Richter, Nils F. Nissen, Klaus‐Dieter Lang, Christian Clemm Published in: 8th International Conference on Life Cycle Management, 2017 Publisher: Luxembourg Institute of Science and Technology (LIST) Product Design Features of Mobile Devices for Extended Product Life: Modularity as an Approach for Better Reparability, Upgradeability and Customization Author(s): Karsten Schischke Published in: The Ecodesign Directive in a changing policy climate: challenges & opportunities, Issue January 25, 2018, 2018 Publisher: eceee, Lund University Modular products: Smartphone design from a circular economy perspective Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-8 Publisher: IEEE DOI: 10.1109/EGG.2016.7829810 Challenges of reuse and remanufacturing of modern chips in smart mobile devices Author(s): Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-7 Publisher: IEEE DOI: 10.1109/EGG.2016.7829846 Analytics of Technology Endowment Making Business Ecosystems, Closing-the-Loop Chain Networks and Systemic Products Domains Author(s): Slowak, André P.; Regenfelder, Max; Manessis, Dionysios Published in: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016 Publisher: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia Achieving ‘Sustainable Smart Mobile Devices Lifecycles Through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technology’ Author(s): Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P. Published in: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016 Publisher: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia Closed-loop innovation for mobile electronics - the business model innovation approach of the sustainablySMART project Author(s): Max Regenfelder, Andre P. Slowak, Alejandro Santacreu Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-6 Publisher: IEEE DOI: 10.1109/EGG.2016.7829847 Re-design of a digital voice recorder to meet the needs of circular economy — Status analysis Author(s): Rainer Pamminger, Stefan Kuso, Wolfgang Wimmer, Gerhard Podhardsky Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-9 Publisher: IEEE DOI: 10.1109/EGG.2016.7829815 Experimental results of lithium polymer batteries ageing Author(s): Krystan Marquardt Published in: Entwicklerforum Batterien & Ladekonzepte, Issue February 15-16, 2017, 2017 Publisher: DESIGN&ELEKTRONIK Modularity Meets Circular Economy - Environmental Gains of Emerging Designs for Smartphones and Tablets Author(s): Karsten Schischke Published in: Emerging Green 2015, Issue Sept 22-24, 2015, 2015 Publisher: Green Electronics Council Implications of Circular Economy on Users Data Privacy: A Case Study on Android Smartphones Second-Hand Market Author(s): D. Nguyen, S. Martinez, M. Khramova, Blancco, FI Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Automated Identification and Sorting of Collected Smartphones Author(s): J. Reimers, Refind Technologies, SE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Getting the Balance Right between Circular Design and the Footprint of Modularity Materials for Smart Mobile Devices Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang Published in: MRS Spring Meeting 2019, Symposium ES13: Materials Selection and Design—A Tool to Enable Sustainable Materials Development and a Reduced Materials Footprint, Issue April 22-26, 2019, 2019 Publisher: MRS Battery Health in a Circular Economy: Embedding an Ageing Model in the Smart Battery System Author(s): C. Clemm, K. Marquardt, N. Dethlefs, K. Schischke, R. Hahn, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Designing an iameco D4R Tablet for Fab-Lab Level Production Author(s): J. Ospina, P. Maher, A. Galligan, MicroPro, IE, J. Gallagher, D. O’Donovan, GMIT Letterfrack, IE, G. Kast, ReUse, DE, K. Schischke, Fraunhofer IZM, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Analysis of data remanence after Factory Reset, and sophisticated attacks on memory chips Author(s): M. Khramova, S. Martinez, Blancco, FI Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE ELectronics New Business Models for Circular Economy Author(s): M. Regenfelder, ReUse, DE R. Pamminger, TU Wien, AT Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics The Life Cycle of Smart Devices in 2030: The Effect of Technology Trends and Circular Economy Drivers on Future Products Author(s): Karsten Schischke, Nils F. Nissen, Klaus-Dieter Lang Published in: Sustainable Innovation 2019, 22nd International Conference, Road to 2030: Sustainability, Business Models, Innovation and Design, Issue March 4-5, 2019, 2019, Page(s) 179-187 Publisher: The Centre for Sustainable Design Modularization of Printed Circuit Boards through embedding technology and the Influence of highly integrated modules on the product carbon footprint of electronic systems Author(s): T. Kupka, G. Schulz, T. Krivec, AT&S, AT W. Wimmer, Vienna University of Technology, AT Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Let´s Fix the Scoring of Reparability Author(s): B. Flipsen, M. Huisken, iFixit, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Desoldering and remanufacturing of semiconductor components from electronic mobile devices Author(s): J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL P. Ciszewski, P. Dawidowicz, Semicon, PL G. Podhradsky, Speech Processing Solutions, AT R. Ambrosch, Pro Automation, AT Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Automation of Smartphone Disassembly: Collaborative Approach Author(s): R. Ambrosch, E. Ambrosch, Pro Automation, AT R. Pamminger, S. Glaser, Vienna University of Technology, AT M. Regenfelder, ReUse, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Guideline development to design modular products that meet the needs of Circular Economy Author(s): R. Pamminger, S. Glaser, W. Wimmer, Vienna University of Technology, AT G. Podhradsky, Speech Processing Solutions, AT Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics The Sustainability Connection for Mobile Electronics Author(s): B. May, A. Santacreu, Circular Devices, FI N. Nissen, K. Schischke, Fraunhofer IZM, DE K. Lang, TU Berlin, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Strategies for more Circularity in the Life Cycle of Mobile Information Technology Author(s): K. Schischke, M. Proske, J. Reinhold, Fraunhofer IZM, DE, M. Ballester, Fairphone, NL, K. Lang, TU Berlin, DE, M. Regenfelder, ReUse, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Technology Assessment of Wireless Charging using Life Cycle Tools Author(s): D. Sánchez, K. Schischke, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9 Publisher: CARE Electronics Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment Author(s): Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0 Publisher: IEEE DOI: 10.23919/empc44848.2019.8951816 The “Environmental Activation Energy” of Modularity and Conditions for an Environmental Payback Author(s): Karsten Schischke, Marina Proske, Rainer Pamminger, Sebastian Glaser, Nils F. Nissen, Martin Schneider-Ramelow Published in: Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019 Publisher: LCM 2019 """I’LL BE BACK – MODELLING of DIFFERENT CIRCULAR END-OF-USE SCENARIOS for SMARTPHONES""" Author(s): Dr. Rainer Pamminger, Sebastian Glaser, Prof. Dr. Wolfgang Wimmer, Karsten Schischke, Marina Proske Published in: Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019 Publisher: LCM 2019 Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products. Author(s): Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-5, ISBN 978-0-9568086-6-0 Publisher: IEEE DOI: 10.23919/empc44848.2019.8951884 Recyclability of Tungsten, Tantalum and Neodymium from Smartphones Author(s): Nils F. Nissen, Julia Reinhold, Karsten Schischke, Klaus-Dieter-Lang Published in: Proceedings of 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign2019), Issue Nov 25-27, 2019, 2019 Publisher: Ecodenet UPSCALING of COLLABORATIVE DISASSEM-BLY LINES for MOBILE PHONES – ECONOMIC and ENVIRONMENTAL CONSIDERATIONS Author(s): R. Pamminger, S. Glaser, R. Ambrosch, M. Genner Published in: International Symposium for Production and Research, 2019, Vienna, 2019 Publisher: ISPR 2019 Lifetime Extension by Design and a Fab Lab Level Digital Manufacturing Strategy: Tablet Case Study Author(s): J. Ospina, P. Maher, A. Galligan, MicroPro J. Gallagher, D. O’Donovan,GMIT Letterfrack; St. Knorr, Designing Berlin K. Schischke, Fraunhofer IZM Published in: PLATE 2019 - Product Lifetimes And The Environment, Issue Sep.19, 2019 Publisher: PLATE 2019 - Product Lifetimes And The Environment Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices Author(s): D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0 Publisher: IEEE DOI: 10.23919/empc44848.2019.8951790 Thesis dissertations (3) Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben Author(s): Tobias Kupka Published in: 2018 Publisher: Tobias Kupka Characterization and modelling of the cure induced shrinkage of epoxy resin used in organic based electronic modules Author(s): Julia Verena Zündel Published in: 2018 Publisher: Julia Verena Zündel Possible framework for the reuse of smartphones Author(s): Octavian Graf Pilati Published in: 2018 Publisher: Octavian Graf Pilati Other (3) Systemowy odzysk elementów elektronicznych - aspekt ekologiczny Author(s): Piotr Dawidowicz, Piotr Ciszewski (Semicon) Published in: Elektronik, Issue 10/2016, 2016, Page(s) 2 Publisher: Elektronik Semicon oraz ITR w projekcie w ramach Horyzontu 2020 Author(s): Piotr Ciszewski Published in: EVERTIQ, Issue 04.11.2015, 2015 Publisher: EVERTIQ Drugie życie pamięci flash Author(s): Piotr Ciszewski Published in: EVERTIQ, Issue 17.11.2015, 2015 Publisher: EVERTIQ Peer reviewed articles (2) Elementy zrównoważonego rozwoju produktów elektronicznych w gospodarce o obiegu zamkniętym Author(s): Janusz Sitek Published in: ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA, Issue 1/6, 2016, Page(s) 119-122, ISSN 0033-2089 Publisher: SIGMA-NOT DOI: 10.15199/13.2016.6.25 Impact of modularity as a circular design strategy on materials use for smart mobile devices Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Martin Schneider-Ramelow Published in: MRS Energy & Sustainability, Issue 6, 2019, ISSN 2329-2229 Publisher: Cambridge University Press DOI: 10.1557/mre.2019.17 Non-peer reviewed articles (1) Writing the next chapter for optical sorting Author(s): Kristin Linnenkoper Published in: Recycling International, Issue 10 times/year, 2016, Page(s) 32-33, ISSN 1387-8700 Publisher: HUSS-VERLAG GmbH Searching for OpenAIRE data... There was an error trying to search data from OpenAIRE No results available
