Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies

Project Information

sustainablySMART

Grant agreement ID: 680604

DOI 10.3030/680604

Project closed

EC signature date 11 September 2015

Start date 1 September 2015

End date 31 October 2019

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced manufacturing and processing

Total cost € 7 005 292,50

EU contribution € 6 989 278,00

Coordinated by

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

Deliverables

Documents, reports (7)

Compilation of project publications

40 publications in total

Solid state memory data erasure: Guidance

D5.2 is the outcome of Task 5.2

Design for Disassembly Guidelines

D 7.4 is the final outcome from Task 7.4, is an input to the policy activities in WP 8.

Product repair guides

D 7.6 is the final outcome of Task 7.6 and is closely aligned with the product developments in WP 1.

D4R tablet: Fab Lab production model

D1.4 is the outcome of Task 1.7, and will be aligned with the findings of Task 6.3 (business model)

Policy Analysis: Summary of recommendations

Compilation of policy briefs and input provided to standardisation activities

Disassembly studies

D 7.1 is the outcome from Task 7.1 and will provide guidance for technology developments in WPs 1-5.

Demonstrators, pilots, prototypes (8)

Disassembly equipment: Technology demonstration

D3.2 is the outcome of Task 3.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Puzzle IoT: Modular IoT system Technology Demonstrator, Technical documentation

D1.2 is the joint outcome of Tasks 1.4, 1.5

Reparability Score: Validation and tool implementation

D 7.5 is the final outcome of Task 7.5.

Device with reused components: Technology demonstration

D4.3 is the outcome of Task 4.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Aligning, sorting and handling equipment: Technology demonstration

D3.1 is the outcome of Task 3.2, and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Pilot batch (30 units)

D1.9 is one of the outcomes of Task 1.7 and comprises physical units of tablets produced as a small batch

Remanufactured packaged semiconductors: Technology validation

D4.2 is the outcome of Task 4.2, will be the input for Task 4.3 and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Concept and technology validation

D1.3 is the outcome of Task 1.6, and will be the input for Task 1.7

Websites, patent fillings, videos etc. (2)

Dissemination events

3 dissemination events Europe wide organized and handouts available

Blog posts compilation

Compilation of 14 blog posts released over the project lifetime.

Publications

Conference proceedings (42)

Mobile Hydrometallurgy to recover rare and precious metals from WEEE

Author(s): Bernd Kopacek
Published in: European Rare Earth Resources Conference - ERES2017, Issue May 29-31,2017, 2017
Publisher: European Rare Earth Resources Conference - ERES2017

Recovery of precious and critical metals as a service

Author(s): Bernd Kopacek
Published in: CRETE2018 - 6th International Conference on Industrial and Hazardous Waste, Issue September 4-7, 2018, 2018
Publisher: TU Crete

MOBILE HYDROMETALLURGY TO RECOVER RARE AND PRECIOUS METALS FROM WEEE

Author(s): Bernd Kopacek
Published in: SUM 2018 - Fourth Symposium on Urban Mining and Circular Economy, Issue May 21-23, 2018, 2018
Publisher: Eurowaste

Developing a Reparability Indicator for Electronic Products

Author(s): Bas Flipsen, Conny Bakker, Guus van Bohemen
Published in: Electronics Goes Green 2016+, Issue September 7-9, 2016, 2016
Publisher: Fraunhofer IZM

Using machine learning to empower automation within reverse logistics

Author(s): Johanna Reimers
Published in: Circular Materials Conference, Issue March 7-8, 2018, 2018
Publisher: Nordic Publishing

Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications

Author(s): Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez
Published in: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, Page(s) 1-7, ISBN 978-0-9568086-4-6
Publisher: IEEE
DOI: 10.23919/EMPC.2017.8346853

Recycling as a Service - a New Business Model to Recover Critical and Precious Metals from Industrial Wastes

Author(s): Bernd Kopacek
Published in: 5th International Conference on Serviceology, Issue July 12-14, 2017, 2017
Publisher: University of Vienna

INTELLIGENT DISASSEMBLY OF COMPENENTS FROM PRINTED CIRCUIT BOARDS TO ENABLE RE-USE AND MORE EFFICIENT RECOVERY OF CRITICAL METALS

Author(s): Bernd Kopacek
Published in: PLATE 2017 - Product Lifetimes And The Environment, Issue November 8-10, 2017, 2017
Publisher: TU Delft

Modular Smartphones: Design Strategies Driven by Life Cycle Assessment Evidence

Author(s): Karsten Schischke, Marina Proske, Miquel Ballester Salvà, Laura Gerritsen, Nikolai Richter, Nils F. Nissen, Klaus‐Dieter Lang, Christian Clemm
Published in: 8th International Conference on Life Cycle Management, 2017
Publisher: Luxembourg Institute of Science and Technology (LIST)

Product Design Features of Mobile Devices for Extended Product Life: Modularity as an Approach for Better Reparability, Upgradeability and Customization

Author(s): Karsten Schischke
Published in: The Ecodesign Directive in a changing policy climate: challenges & opportunities, Issue January 25, 2018, 2018
Publisher: eceee, Lund University

Modular products: Smartphone design from a circular economy perspective

Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-8
Publisher: IEEE
DOI: 10.1109/EGG.2016.7829810

Challenges of reuse and remanufacturing of modern chips in smart mobile devices

Author(s): Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil
Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-7
Publisher: IEEE
DOI: 10.1109/EGG.2016.7829846

Analytics of Technology Endowment Making Business Ecosystems, Closing-the-Loop Chain Networks and Systemic Products Domains

Author(s): Slowak, André P.; Regenfelder, Max; Manessis, Dionysios
Published in: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016
Publisher: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Achieving ‘Sustainable Smart Mobile Devices Lifecycles Through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technology’

Author(s): Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Published in: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Issue 2016, 2016
Publisher: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Closed-loop innovation for mobile electronics - the business model innovation approach of the sustainablySMART project

Author(s): Max Regenfelder, Andre P. Slowak, Alejandro Santacreu
Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-6
Publisher: IEEE
DOI: 10.1109/EGG.2016.7829847

Re-design of a digital voice recorder to meet the needs of circular economy — Status analysis

Author(s): Rainer Pamminger, Stefan Kuso, Wolfgang Wimmer, Gerhard Podhardsky
Published in: 2016 Electronics Goes Green 2016+ (EGG), Issue September 7-9, 2016, 2016, Page(s) 1-9
Publisher: IEEE
DOI: 10.1109/EGG.2016.7829815

Experimental results of lithium polymer batteries ageing

Author(s): Krystan Marquardt
Published in: Entwicklerforum Batterien & Ladekonzepte, Issue February 15-16, 2017, 2017
Publisher: DESIGN&ELEKTRONIK

Modularity Meets Circular Economy - Environmental Gains of Emerging Designs for Smartphones and Tablets

Author(s): Karsten Schischke
Published in: Emerging Green 2015, Issue Sept 22-24, 2015, 2015
Publisher: Green Electronics Council

Implications of Circular Economy on Users Data Privacy: A Case Study on Android Smartphones Second-Hand Market

Author(s): D. Nguyen, S. Martinez, M. Khramova, Blancco, FI
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Automated Identification and Sorting of Collected Smartphones

Author(s): J. Reimers, Refind Technologies, SE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Getting the Balance Right between Circular Design and the Footprint of Modularity Materials for Smart Mobile Devices

Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Published in: MRS Spring Meeting 2019, Symposium ES13: Materials Selection and Design—A Tool to Enable Sustainable Materials Development and a Reduced Materials Footprint, Issue April 22-26, 2019, 2019
Publisher: MRS

Battery Health in a Circular Economy: Embedding an Ageing Model in the Smart Battery System

Author(s): C. Clemm, K. Marquardt, N. Dethlefs, K. Schischke, R. Hahn, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Designing an iameco D4R Tablet for Fab-Lab Level Production

Author(s): J. Ospina, P. Maher, A. Galligan, MicroPro, IE, J. Gallagher, D. O’Donovan, GMIT Letterfrack, IE, G. Kast, ReUse, DE, K. Schischke, Fraunhofer IZM, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Analysis of data remanence after Factory Reset, and sophisticated attacks on memory chips

Author(s): M. Khramova, S. Martinez, Blancco, FI
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE ELectronics

New Business Models for Circular Economy

Author(s): M. Regenfelder, ReUse, DE R. Pamminger, TU Wien, AT
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

The Life Cycle of Smart Devices in 2030: The Effect of Technology Trends and Circular Economy Drivers on Future Products

Author(s): Karsten Schischke, Nils F. Nissen, Klaus-Dieter Lang
Published in: Sustainable Innovation 2019, 22nd International Conference, Road to 2030: Sustainability, Business Models, Innovation and Design, Issue March 4-5, 2019, 2019, Page(s) 179-187
Publisher: The Centre for Sustainable Design

Modularization of Printed Circuit Boards through embedding technology and the Influence of highly integrated modules on the product carbon footprint of electronic systems

Author(s): T. Kupka, G. Schulz, T. Krivec, AT&S, AT W. Wimmer, Vienna University of Technology, AT
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Let´s Fix the Scoring of Reparability

Author(s): B. Flipsen, M. Huisken, iFixit, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Desoldering and remanufacturing of semiconductor components from electronic mobile devices

Author(s): J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL P. Ciszewski, P. Dawidowicz, Semicon, PL G. Podhradsky, Speech Processing Solutions, AT R. Ambrosch, Pro Automation, AT
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Automation of Smartphone Disassembly: Collaborative Approach

Author(s): R. Ambrosch, E. Ambrosch, Pro Automation, AT R. Pamminger, S. Glaser, Vienna University of Technology, AT M. Regenfelder, ReUse, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Guideline development to design modular products that meet the needs of Circular Economy

Author(s): R. Pamminger, S. Glaser, W. Wimmer, Vienna University of Technology, AT G. Podhradsky, Speech Processing Solutions, AT
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

The Sustainability Connection for Mobile Electronics

Author(s): B. May, A. Santacreu, Circular Devices, FI N. Nissen, K. Schischke, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Strategies for more Circularity in the Life Cycle of Mobile Information Technology

Author(s): K. Schischke, M. Proske, J. Reinhold, Fraunhofer IZM, DE, M. Ballester, Fairphone, NL, K. Lang, TU Berlin, DE, M. Regenfelder, ReUse, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Technology Assessment of Wireless Charging using Life Cycle Tools

Author(s): D. Sánchez, K. Schischke, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Published in: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Publisher: CARE Electronics

Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment

Author(s): Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen
Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Publisher: IEEE
DOI: 10.23919/empc44848.2019.8951816

The “Environmental Activation Energy” of Modularity and Conditions for an Environmental Payback

Author(s): Karsten Schischke, Marina Proske, Rainer Pamminger, Sebastian Glaser, Nils F. Nissen, Martin Schneider-Ramelow
Published in: Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019
Publisher: LCM 2019

"""I’LL BE BACK – MODELLING of DIFFERENT CIRCULAR END-OF-USE SCENARIOS for SMARTPHONES"""

Author(s): Dr. Rainer Pamminger, Sebastian Glaser, Prof. Dr. Wolfgang Wimmer, Karsten Schischke, Marina Proske
Published in: Life Cycle Management Conference, 2019, Poznan, Issue Sep.19, 2019
Publisher: LCM 2019

Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products.

Author(s): Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch
Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-5, ISBN 978-0-9568086-6-0
Publisher: IEEE
DOI: 10.23919/empc44848.2019.8951884

Recyclability of Tungsten, Tantalum and Neodymium from Smartphones

Author(s): Nils F. Nissen, Julia Reinhold, Karsten Schischke, Klaus-Dieter-Lang
Published in: Proceedings of 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign2019), Issue Nov 25-27, 2019, 2019
Publisher: Ecodenet

UPSCALING of COLLABORATIVE DISASSEM-BLY LINES for MOBILE PHONES – ECONOMIC and ENVIRONMENTAL CONSIDERATIONS

Author(s): R. Pamminger, S. Glaser, R. Ambrosch, M. Genner
Published in: International Symposium for Production and Research, 2019, Vienna, 2019
Publisher: ISPR 2019

Lifetime Extension by Design and a Fab Lab Level Digital Manufacturing Strategy: Tablet Case Study

Author(s): J. Ospina, P. Maher, A. Galligan, MicroPro J. Gallagher, D. O’Donovan,GMIT Letterfrack; St. Knorr, Designing Berlin K. Schischke, Fraunhofer IZM
Published in: PLATE 2019 - Product Lifetimes And The Environment, Issue Sep.19, 2019
Publisher: PLATE 2019 - Product Lifetimes And The Environment

Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

Author(s): D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann
Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Publisher: IEEE
DOI: 10.23919/empc44848.2019.8951790

Thesis and dissertations (3)

Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben

Author(s): Tobias Kupka
Published in: 2018
Publisher: Tobias Kupka

Characterization and modelling of the cure induced shrinkage of epoxy resin used in organic based electronic modules

Author(s): Julia Verena Zündel
Published in: 2018
Publisher: Julia Verena Zündel

Possible framework for the reuse of smartphones

Author(s): Octavian Graf Pilati
Published in: 2018
Publisher: Octavian Graf Pilati

Other (3)

Systemowy odzysk elementów elektronicznych - aspekt ekologiczny

Author(s): Piotr Dawidowicz, Piotr Ciszewski (Semicon)
Published in: Elektronik, Issue 10/2016, 2016, Page(s) 2
Publisher: Elektronik

Semicon oraz ITR w projekcie w ramach Horyzontu 2020

Author(s): Piotr Ciszewski
Published in: EVERTIQ, Issue 04.11.2015, 2015
Publisher: EVERTIQ

Drugie życie pamięci flash

Author(s): Piotr Ciszewski
Published in: EVERTIQ, Issue 17.11.2015, 2015
Publisher: EVERTIQ

Peer reviewed articles (2)

Elementy zrównoważonego rozwoju produktów elektronicznych w gospodarce o obiegu zamkniętym

Author(s): Janusz Sitek
Published in: ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA, Issue 1/6, 2016, Page(s) 119-122, ISSN 0033-2089
Publisher: SIGMA-NOT
DOI: 10.15199/13.2016.6.25

Impact of modularity as a circular design strategy on materials use for smart mobile devices

Author(s): Karsten Schischke, Marina Proske, Nils F. Nissen, Martin Schneider-Ramelow
Published in: MRS Energy & Sustainability, Issue 6, 2019, ISSN 2329-2229
Publisher: Cambridge University Press
DOI: 10.1557/mre.2019.17

Non-peer reviewed articles (1)

Writing the next chapter for optical sorting

Author(s): Kristin Linnenkoper
Published in: Recycling International, Issue 10 times/year, 2016, Page(s) 32-33, ISSN 1387-8700
Publisher: HUSS-VERLAG GmbH