Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies

Livrables

Compilation of project publications

40 publications in total

Solid state memory data erasure: Guidance

D5.2 is the outcome of Task 5.2

Design for Disassembly Guidelines

D 7.4 is the final outcome from Task 7.4, is an input to the policy activities in WP 8.

Product repair guides

D 7.6 is the final outcome of Task 7.6 and is closely aligned with the product developments in WP 1.

D4R tablet: Fab Lab production model

D1.4 is the outcome of Task 1.7, and will be aligned with the findings of Task 6.3 (business model)

Policy Analysis: Summary of recommendations

Compilation of policy briefs and input provided to standardisation activities

Disassembly studies

D 7.1 is the outcome from Task 7.1 and will provide guidance for technology developments in WPs 1-5.

Disassembly equipment: Technology demonstration

D3.2 is the outcome of Task 3.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Puzzle IoT: Modular IoT system Technology Demonstrator, Technical documentation

D1.2 is the joint outcome of Tasks 1.4, 1.5

Reparability Score: Validation and tool implementation

D 7.5 is the final outcome of Task 7.5.

Device with reused components: Technology demonstration

D4.3 is the outcome of Task 4.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Aligning, sorting and handling equipment: Technology demonstration

D3.1 is the outcome of Task 3.2, and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Pilot batch (30 units)

D1.9 is one of the outcomes of Task 1.7 and comprises physical units of tablets produced as a small batch

Remanufactured packaged semiconductors: Technology validation

D4.2 is the outcome of Task 4.2, will be the input for Task 4.3 and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Concept and technology validation

D1.3 is the outcome of Task 1.6, and will be the input for Task 1.7

Dissemination events

3 dissemination events Europe wide organized and handouts available

Blog posts compilation

Compilation of 14 blog posts released over the project lifetime.

Publications

Mobile Hydrometallurgy to recover rare and precious metals from WEEE

Auteurs: Bernd Kopacek
Publié dans: European Rare Earth Resources Conference - ERES2017, Numéro May 29-31,2017, 2017
Éditeur: European Rare Earth Resources Conference - ERES2017

Recovery of precious and critical metals as a service

Auteurs: Bernd Kopacek
Publié dans: CRETE2018 - 6th International Conference on Industrial and Hazardous Waste, Numéro September 4-7, 2018, 2018
Éditeur: TU Crete

MOBILE HYDROMETALLURGY TO RECOVER RARE AND PRECIOUS METALS FROM WEEE

Auteurs: Bernd Kopacek
Publié dans: SUM 2018 - Fourth Symposium on Urban Mining and Circular Economy, Numéro May 21-23, 2018, 2018
Éditeur: Eurowaste

Developing a Reparability Indicator for Electronic Products

Auteurs: Bas Flipsen, Conny Bakker, Guus van Bohemen
Publié dans: Electronics Goes Green 2016+, Numéro September 7-9, 2016, 2016
Éditeur: Fraunhofer IZM

Using machine learning to empower automation within reverse logistics

Auteurs: Johanna Reimers
Publié dans: Circular Materials Conference, Numéro March 7-8, 2018, 2018
Éditeur: Nordic Publishing

Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications

Auteurs: Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez
Publié dans: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, Page(s) 1-7, ISBN 978-0-9568086-4-6
Éditeur: IEEE
DOI: 10.23919/EMPC.2017.8346853

Recycling as a Service - a New Business Model to Recover Critical and Precious Metals from Industrial Wastes

Auteurs: Bernd Kopacek
Publié dans: 5th International Conference on Serviceology, Numéro July 12-14, 2017, 2017
Éditeur: University of Vienna

INTELLIGENT DISASSEMBLY OF COMPENENTS FROM PRINTED CIRCUIT BOARDS TO ENABLE RE-USE AND MORE EFFICIENT RECOVERY OF CRITICAL METALS

Auteurs: Bernd Kopacek
Publié dans: PLATE 2017 - Product Lifetimes And The Environment, Numéro November 8-10, 2017, 2017
Éditeur: TU Delft

Modular Smartphones: Design Strategies Driven by Life Cycle Assessment Evidence

Auteurs: Karsten Schischke, Marina Proske, Miquel Ballester Salvà, Laura Gerritsen, Nikolai Richter, Nils F. Nissen, Klaus‐Dieter Lang, Christian Clemm
Publié dans: 8th International Conference on Life Cycle Management, 2017
Éditeur: Luxembourg Institute of Science and Technology (LIST)

Product Design Features of Mobile Devices for Extended Product Life: Modularity as an Approach for Better Reparability, Upgradeability and Customization

Auteurs: Karsten Schischke
Publié dans: The Ecodesign Directive in a changing policy climate: challenges & opportunities, Numéro January 25, 2018, 2018
Éditeur: eceee, Lund University

Modular products: Smartphone design from a circular economy perspective

Auteurs: Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Publié dans: 2016 Electronics Goes Green 2016+ (EGG), Numéro September 7-9, 2016, 2016, Page(s) 1-8
Éditeur: IEEE
DOI: 10.1109/EGG.2016.7829810

Challenges of reuse and remanufacturing of modern chips in smart mobile devices

Auteurs: Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil
Publié dans: 2016 Electronics Goes Green 2016+ (EGG), Numéro September 7-9, 2016, 2016, Page(s) 1-7
Éditeur: IEEE
DOI: 10.1109/EGG.2016.7829846

Analytics of Technology Endowment Making Business Ecosystems, Closing-the-Loop Chain Networks and Systemic Products Domains

Auteurs: Slowak, André P.; Regenfelder, Max; Manessis, Dionysios
Publié dans: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Numéro 2016, 2016
Éditeur: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Achieving ‘Sustainable Smart Mobile Devices Lifecycles Through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technology’

Auteurs: Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Publié dans: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Numéro 2016, 2016
Éditeur: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Closed-loop innovation for mobile electronics - the business model innovation approach of the sustainablySMART project

Auteurs: Max Regenfelder, Andre P. Slowak, Alejandro Santacreu
Publié dans: 2016 Electronics Goes Green 2016+ (EGG), Numéro September 7-9, 2016, 2016, Page(s) 1-6
Éditeur: IEEE
DOI: 10.1109/EGG.2016.7829847

Re-design of a digital voice recorder to meet the needs of circular economy — Status analysis

Auteurs: Rainer Pamminger, Stefan Kuso, Wolfgang Wimmer, Gerhard Podhardsky
Publié dans: 2016 Electronics Goes Green 2016+ (EGG), Numéro September 7-9, 2016, 2016, Page(s) 1-9
Éditeur: IEEE
DOI: 10.1109/EGG.2016.7829815

Experimental results of lithium polymer batteries ageing

Auteurs: Krystan Marquardt
Publié dans: Entwicklerforum Batterien & Ladekonzepte, Numéro February 15-16, 2017, 2017
Éditeur: DESIGN&ELEKTRONIK

Modularity Meets Circular Economy - Environmental Gains of Emerging Designs for Smartphones and Tablets

Auteurs: Karsten Schischke
Publié dans: Emerging Green 2015, Numéro Sept 22-24, 2015, 2015
Éditeur: Green Electronics Council

Implications of Circular Economy on Users Data Privacy: A Case Study on Android Smartphones Second-Hand Market

Auteurs: D. Nguyen, S. Martinez, M. Khramova, Blancco, FI
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Automated Identification and Sorting of Collected Smartphones

Auteurs: J. Reimers, Refind Technologies, SE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Getting the Balance Right between Circular Design and the Footprint of Modularity Materials for Smart Mobile Devices

Auteurs: Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Publié dans: MRS Spring Meeting 2019, Symposium ES13: Materials Selection and Design—A Tool to Enable Sustainable Materials Development and a Reduced Materials Footprint, Numéro April 22-26, 2019, 2019
Éditeur: MRS

Battery Health in a Circular Economy: Embedding an Ageing Model in the Smart Battery System

Auteurs: C. Clemm, K. Marquardt, N. Dethlefs, K. Schischke, R. Hahn, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Designing an iameco D4R Tablet for Fab-Lab Level Production

Auteurs: J. Ospina, P. Maher, A. Galligan, MicroPro, IE, J. Gallagher, D. O’Donovan, GMIT Letterfrack, IE, G. Kast, ReUse, DE, K. Schischke, Fraunhofer IZM, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Analysis of data remanence after Factory Reset, and sophisticated attacks on memory chips

Auteurs: M. Khramova, S. Martinez, Blancco, FI
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE ELectronics

New Business Models for Circular Economy

Auteurs: M. Regenfelder, ReUse, DE R. Pamminger, TU Wien, AT
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

The Life Cycle of Smart Devices in 2030: The Effect of Technology Trends and Circular Economy Drivers on Future Products

Auteurs: Karsten Schischke, Nils F. Nissen, Klaus-Dieter Lang
Publié dans: Sustainable Innovation 2019, 22nd International Conference, Road to 2030: Sustainability, Business Models, Innovation and Design, Numéro March 4-5, 2019, 2019, Page(s) 179-187
Éditeur: The Centre for Sustainable Design

Modularization of Printed Circuit Boards through embedding technology and the Influence of highly integrated modules on the product carbon footprint of electronic systems

Auteurs: T. Kupka, G. Schulz, T. Krivec, AT&S, AT W. Wimmer, Vienna University of Technology, AT
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Let´s Fix the Scoring of Reparability

Auteurs: B. Flipsen, M. Huisken, iFixit, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Desoldering and remanufacturing of semiconductor components from electronic mobile devices

Auteurs: J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL P. Ciszewski, P. Dawidowicz, Semicon, PL G. Podhradsky, Speech Processing Solutions, AT R. Ambrosch, Pro Automation, AT
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Automation of Smartphone Disassembly: Collaborative Approach

Auteurs: R. Ambrosch, E. Ambrosch, Pro Automation, AT R. Pamminger, S. Glaser, Vienna University of Technology, AT M. Regenfelder, ReUse, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Guideline development to design modular products that meet the needs of Circular Economy

Auteurs: R. Pamminger, S. Glaser, W. Wimmer, Vienna University of Technology, AT G. Podhradsky, Speech Processing Solutions, AT
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

The Sustainability Connection for Mobile Electronics

Auteurs: B. May, A. Santacreu, Circular Devices, FI N. Nissen, K. Schischke, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Strategies for more Circularity in the Life Cycle of Mobile Information Technology

Auteurs: K. Schischke, M. Proske, J. Reinhold, Fraunhofer IZM, DE, M. Ballester, Fairphone, NL, K. Lang, TU Berlin, DE, M. Regenfelder, ReUse, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Technology Assessment of Wireless Charging using Life Cycle Tools

Auteurs: D. Sánchez, K. Schischke, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publié dans: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Éditeur: CARE Electronics

Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment

Auteurs: Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen
Publié dans: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Éditeur: IEEE
DOI: 10.23919/empc44848.2019.8951816

The “Environmental Activation Energy” of Modularity and Conditions for an Environmental Payback

Auteurs: Karsten Schischke, Marina Proske, Rainer Pamminger, Sebastian Glaser, Nils F. Nissen, Martin Schneider-Ramelow
Publié dans: Life Cycle Management Conference, 2019, Poznan, Numéro Sep.19, 2019
Éditeur: LCM 2019

"""I’LL BE BACK – MODELLING of DIFFERENT CIRCULAR END-OF-USE SCENARIOS for SMARTPHONES"""

Auteurs: Dr. Rainer Pamminger, Sebastian Glaser, Prof. Dr. Wolfgang Wimmer, Karsten Schischke, Marina Proske
Publié dans: Life Cycle Management Conference, 2019, Poznan, Numéro Sep.19, 2019
Éditeur: LCM 2019

Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products.

Auteurs: Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch
Publié dans: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-5, ISBN 978-0-9568086-6-0
Éditeur: IEEE
DOI: 10.23919/empc44848.2019.8951884

Recyclability of Tungsten, Tantalum and Neodymium from Smartphones

Auteurs: Nils F. Nissen, Julia Reinhold, Karsten Schischke, Klaus-Dieter-Lang
Publié dans: Proceedings of 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign2019), Numéro Nov 25-27, 2019, 2019
Éditeur: Ecodenet

UPSCALING of COLLABORATIVE DISASSEM-BLY LINES for MOBILE PHONES – ECONOMIC and ENVIRONMENTAL CONSIDERATIONS

Auteurs: R. Pamminger, S. Glaser, R. Ambrosch, M. Genner
Publié dans: International Symposium for Production and Research, 2019, Vienna, 2019
Éditeur: ISPR 2019

Lifetime Extension by Design and a Fab Lab Level Digital Manufacturing Strategy: Tablet Case Study

Auteurs: J. Ospina, P. Maher, A. Galligan, MicroPro J. Gallagher, D. O’Donovan,GMIT Letterfrack; St. Knorr, Designing Berlin K. Schischke, Fraunhofer IZM
Publié dans: PLATE 2019 - Product Lifetimes And The Environment, Numéro Sep.19, 2019
Éditeur: PLATE 2019 - Product Lifetimes And The Environment

Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

Auteurs: D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann
Publié dans: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Page(s) 1-8, ISBN 978-0-9568086-6-0
Éditeur: IEEE
DOI: 10.23919/empc44848.2019.8951790

Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben

Auteurs: Tobias Kupka
Publié dans: 2018
Éditeur: Tobias Kupka

Characterization and modelling of the cure induced shrinkage of epoxy resin used in organic based electronic modules

Auteurs: Julia Verena Zündel
Publié dans: 2018
Éditeur: Julia Verena Zündel

Possible framework for the reuse of smartphones

Auteurs: Octavian Graf Pilati
Publié dans: 2018
Éditeur: Octavian Graf Pilati

Systemowy odzysk elementów elektronicznych - aspekt ekologiczny

Auteurs: Piotr Dawidowicz, Piotr Ciszewski (Semicon)
Publié dans: Elektronik, Numéro 10/2016, 2016, Page(s) 2
Éditeur: Elektronik

Semicon oraz ITR w projekcie w ramach Horyzontu 2020

Auteurs: Piotr Ciszewski
Publié dans: EVERTIQ, Numéro 04.11.2015, 2015
Éditeur: EVERTIQ

Drugie życie pamięci flash

Auteurs: Piotr Ciszewski
Publié dans: EVERTIQ, Numéro 17.11.2015, 2015
Éditeur: EVERTIQ

Elementy zrównoważonego rozwoju produktów elektronicznych w gospodarce o obiegu zamkniętym

Auteurs: Janusz Sitek
Publié dans: ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA, Numéro 1/6, 2016, Page(s) 119-122, ISSN 0033-2089
Éditeur: SIGMA-NOT
DOI: 10.15199/13.2016.6.25

Impact of modularity as a circular design strategy on materials use for smart mobile devices

Auteurs: Karsten Schischke, Marina Proske, Nils F. Nissen, Martin Schneider-Ramelow
Publié dans: MRS Energy & Sustainability, Numéro 6, 2019, ISSN 2329-2229
Éditeur: Cambridge University Press
DOI: 10.1557/mre.2019.17

Writing the next chapter for optical sorting

Auteurs: Kristin Linnenkoper
Publié dans: Recycling International, Numéro 10 times/year, 2016, Page(s) 32-33, ISSN 1387-8700
Éditeur: HUSS-VERLAG GmbH

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