Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies

Resultado final

Compilation of project publications

40 publications in total

Solid state memory data erasure: Guidance

D5.2 is the outcome of Task 5.2

Design for Disassembly Guidelines

D 7.4 is the final outcome from Task 7.4, is an input to the policy activities in WP 8.

Product repair guides

D 7.6 is the final outcome of Task 7.6 and is closely aligned with the product developments in WP 1.

D4R tablet: Fab Lab production model

D1.4 is the outcome of Task 1.7, and will be aligned with the findings of Task 6.3 (business model)

Policy Analysis: Summary of recommendations

Compilation of policy briefs and input provided to standardisation activities

Disassembly studies

D 7.1 is the outcome from Task 7.1 and will provide guidance for technology developments in WPs 1-5.

Disassembly equipment: Technology demonstration

D3.2 is the outcome of Task 3.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Puzzle IoT: Modular IoT system Technology Demonstrator, Technical documentation

D1.2 is the joint outcome of Tasks 1.4, 1.5

Reparability Score: Validation and tool implementation

D 7.5 is the final outcome of Task 7.5.

Device with reused components: Technology demonstration

D4.3 is the outcome of Task 4.3, and will be the point of reference for the final economic and environmental assessments in WP 7

Aligning, sorting and handling equipment: Technology demonstration

D3.1 is the outcome of Task 3.2, and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Pilot batch (30 units)

D1.9 is one of the outcomes of Task 1.7 and comprises physical units of tablets produced as a small batch

Remanufactured packaged semiconductors: Technology validation

D4.2 is the outcome of Task 4.2, will be the input for Task 4.3 and will be the point of reference for the final economic and environmental assessments in WP 7

D4R tablet: Concept and technology validation

D1.3 is the outcome of Task 1.6, and will be the input for Task 1.7

Dissemination events

3 dissemination events Europe wide organized and handouts available

Blog posts compilation

Compilation of 14 blog posts released over the project lifetime.

Publicaciones

Mobile Hydrometallurgy to recover rare and precious metals from WEEE

Autores: Bernd Kopacek
Publicado en: European Rare Earth Resources Conference - ERES2017, Edición May 29-31,2017, 2017
Editor: European Rare Earth Resources Conference - ERES2017

Recovery of precious and critical metals as a service

Autores: Bernd Kopacek
Publicado en: CRETE2018 - 6th International Conference on Industrial and Hazardous Waste, Edición September 4-7, 2018, 2018
Editor: TU Crete

MOBILE HYDROMETALLURGY TO RECOVER RARE AND PRECIOUS METALS FROM WEEE

Autores: Bernd Kopacek
Publicado en: SUM 2018 - Fourth Symposium on Urban Mining and Circular Economy, Edición May 21-23, 2018, 2018
Editor: Eurowaste

Developing a Reparability Indicator for Electronic Products

Autores: Bas Flipsen, Conny Bakker, Guus van Bohemen
Publicado en: Electronics Goes Green 2016+, Edición September 7-9, 2016, 2016
Editor: Fraunhofer IZM

Using machine learning to empower automation within reverse logistics

Autores: Johanna Reimers
Publicado en: Circular Materials Conference, Edición March 7-8, 2018, 2018
Editor: Nordic Publishing

Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications

Autores: Janusz Sitek, Marek Koscielski, Piotr Dawidowicz, Piotr Ciszewski, Mariia Khramova, Duc Nguyen Quang, Sergio Martinez
Publicado en: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, Página(s) 1-7, ISBN 978-0-9568086-4-6
Editor: IEEE
DOI: 10.23919/EMPC.2017.8346853

Recycling as a Service - a New Business Model to Recover Critical and Precious Metals from Industrial Wastes

Autores: Bernd Kopacek
Publicado en: 5th International Conference on Serviceology, Edición July 12-14, 2017, 2017
Editor: University of Vienna

INTELLIGENT DISASSEMBLY OF COMPENENTS FROM PRINTED CIRCUIT BOARDS TO ENABLE RE-USE AND MORE EFFICIENT RECOVERY OF CRITICAL METALS

Autores: Bernd Kopacek
Publicado en: PLATE 2017 - Product Lifetimes And The Environment, Edición November 8-10, 2017, 2017
Editor: TU Delft

Modular Smartphones: Design Strategies Driven by Life Cycle Assessment Evidence

Autores: Karsten Schischke, Marina Proske, Miquel Ballester Salvà, Laura Gerritsen, Nikolai Richter, Nils F. Nissen, Klaus‐Dieter Lang, Christian Clemm
Publicado en: 8th International Conference on Life Cycle Management, 2017
Editor: Luxembourg Institute of Science and Technology (LIST)

Product Design Features of Mobile Devices for Extended Product Life: Modularity as an Approach for Better Reparability, Upgradeability and Customization

Autores: Karsten Schischke
Publicado en: The Ecodesign Directive in a changing policy climate: challenges & opportunities, Edición January 25, 2018, 2018
Editor: eceee, Lund University

Modular products: Smartphone design from a circular economy perspective

Autores: Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Publicado en: 2016 Electronics Goes Green 2016+ (EGG), Edición September 7-9, 2016, 2016, Página(s) 1-8
Editor: IEEE
DOI: 10.1109/EGG.2016.7829810

Challenges of reuse and remanufacturing of modern chips in smart mobile devices

Autores: Sitek Janusz, Koscielski Marek, Arazna Aneta, Steplewski Wojciech, Janeczek Kamil
Publicado en: 2016 Electronics Goes Green 2016+ (EGG), Edición September 7-9, 2016, 2016, Página(s) 1-7
Editor: IEEE
DOI: 10.1109/EGG.2016.7829846

Analytics of Technology Endowment Making Business Ecosystems, Closing-the-Loop Chain Networks and Systemic Products Domains

Autores: Slowak, André P.; Regenfelder, Max; Manessis, Dionysios
Publicado en: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Edición 2016, 2016
Editor: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Achieving ‘Sustainable Smart Mobile Devices Lifecycles Through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technology’

Autores: Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Publicado en: Proceedings of Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Edición 2016, 2016
Editor: Management of Technologies - Step to Sustainable Production (MOTSP) 2016, Porec, Croatia

Closed-loop innovation for mobile electronics - the business model innovation approach of the sustainablySMART project

Autores: Max Regenfelder, Andre P. Slowak, Alejandro Santacreu
Publicado en: 2016 Electronics Goes Green 2016+ (EGG), Edición September 7-9, 2016, 2016, Página(s) 1-6
Editor: IEEE
DOI: 10.1109/EGG.2016.7829847

Re-design of a digital voice recorder to meet the needs of circular economy — Status analysis

Autores: Rainer Pamminger, Stefan Kuso, Wolfgang Wimmer, Gerhard Podhardsky
Publicado en: 2016 Electronics Goes Green 2016+ (EGG), Edición September 7-9, 2016, 2016, Página(s) 1-9
Editor: IEEE
DOI: 10.1109/EGG.2016.7829815

Experimental results of lithium polymer batteries ageing

Autores: Krystan Marquardt
Publicado en: Entwicklerforum Batterien & Ladekonzepte, Edición February 15-16, 2017, 2017
Editor: DESIGN&ELEKTRONIK

Modularity Meets Circular Economy - Environmental Gains of Emerging Designs for Smartphones and Tablets

Autores: Karsten Schischke
Publicado en: Emerging Green 2015, Edición Sept 22-24, 2015, 2015
Editor: Green Electronics Council

Implications of Circular Economy on Users Data Privacy: A Case Study on Android Smartphones Second-Hand Market

Autores: D. Nguyen, S. Martinez, M. Khramova, Blancco, FI
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Automated Identification and Sorting of Collected Smartphones

Autores: J. Reimers, Refind Technologies, SE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Getting the Balance Right between Circular Design and the Footprint of Modularity Materials for Smart Mobile Devices

Autores: Karsten Schischke, Marina Proske, Nils F. Nissen, Klaus-Dieter Lang
Publicado en: MRS Spring Meeting 2019, Symposium ES13: Materials Selection and Design—A Tool to Enable Sustainable Materials Development and a Reduced Materials Footprint, Edición April 22-26, 2019, 2019
Editor: MRS

Battery Health in a Circular Economy: Embedding an Ageing Model in the Smart Battery System

Autores: C. Clemm, K. Marquardt, N. Dethlefs, K. Schischke, R. Hahn, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Designing an iameco D4R Tablet for Fab-Lab Level Production

Autores: J. Ospina, P. Maher, A. Galligan, MicroPro, IE, J. Gallagher, D. O’Donovan, GMIT Letterfrack, IE, G. Kast, ReUse, DE, K. Schischke, Fraunhofer IZM, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Analysis of data remanence after Factory Reset, and sophisticated attacks on memory chips

Autores: M. Khramova, S. Martinez, Blancco, FI
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE ELectronics

New Business Models for Circular Economy

Autores: M. Regenfelder, ReUse, DE R. Pamminger, TU Wien, AT
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

The Life Cycle of Smart Devices in 2030: The Effect of Technology Trends and Circular Economy Drivers on Future Products

Autores: Karsten Schischke, Nils F. Nissen, Klaus-Dieter Lang
Publicado en: Sustainable Innovation 2019, 22nd International Conference, Road to 2030: Sustainability, Business Models, Innovation and Design, Edición March 4-5, 2019, 2019, Página(s) 179-187
Editor: The Centre for Sustainable Design

Modularization of Printed Circuit Boards through embedding technology and the Influence of highly integrated modules on the product carbon footprint of electronic systems

Autores: T. Kupka, G. Schulz, T. Krivec, AT&S, AT W. Wimmer, Vienna University of Technology, AT
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Let´s Fix the Scoring of Reparability

Autores: B. Flipsen, M. Huisken, iFixit, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Desoldering and remanufacturing of semiconductor components from electronic mobile devices

Autores: J. Sitek, M. Koscielski, A. Arazna, K. Janeczek, W. Steplewski, Tele and Radio Research Institute, PL P. Ciszewski, P. Dawidowicz, Semicon, PL G. Podhradsky, Speech Processing Solutions, AT R. Ambrosch, Pro Automation, AT
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Automation of Smartphone Disassembly: Collaborative Approach

Autores: R. Ambrosch, E. Ambrosch, Pro Automation, AT R. Pamminger, S. Glaser, Vienna University of Technology, AT M. Regenfelder, ReUse, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Guideline development to design modular products that meet the needs of Circular Economy

Autores: R. Pamminger, S. Glaser, W. Wimmer, Vienna University of Technology, AT G. Podhradsky, Speech Processing Solutions, AT
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

The Sustainability Connection for Mobile Electronics

Autores: B. May, A. Santacreu, Circular Devices, FI N. Nissen, K. Schischke, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Strategies for more Circularity in the Life Cycle of Mobile Information Technology

Autores: K. Schischke, M. Proske, J. Reinhold, Fraunhofer IZM, DE, M. Ballester, Fairphone, NL, K. Lang, TU Berlin, DE, M. Regenfelder, ReUse, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Technology Assessment of Wireless Charging using Life Cycle Tools

Autores: D. Sánchez, K. Schischke, N. Nissen, Fraunhofer IZM, DE K. Lang, TU Berlin, DE
Publicado en: Going Green - CARE INNOVATION 2018, 2018, ISBN 978-3-200-05942-9
Editor: CARE Electronics

Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment

Autores: Karsten Schischke, Martin Schneider-Ramelow, Klaus-Dieter Lang, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen
Publicado en: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Página(s) 1-8, ISBN 978-0-9568086-6-0
Editor: IEEE
DOI: 10.23919/empc44848.2019.8951816

The “Environmental Activation Energy” of Modularity and Conditions for an Environmental Payback

Autores: Karsten Schischke, Marina Proske, Rainer Pamminger, Sebastian Glaser, Nils F. Nissen, Martin Schneider-Ramelow
Publicado en: Life Cycle Management Conference, 2019, Poznan, Edición Sep.19, 2019
Editor: LCM 2019

"""I’LL BE BACK – MODELLING of DIFFERENT CIRCULAR END-OF-USE SCENARIOS for SMARTPHONES"""

Autores: Dr. Rainer Pamminger, Sebastian Glaser, Prof. Dr. Wolfgang Wimmer, Karsten Schischke, Marina Proske
Publicado en: Life Cycle Management Conference, 2019, Poznan, Edición Sep.19, 2019
Editor: LCM 2019

Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products.

Autores: Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch
Publicado en: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Página(s) 1-5, ISBN 978-0-9568086-6-0
Editor: IEEE
DOI: 10.23919/empc44848.2019.8951884

Recyclability of Tungsten, Tantalum and Neodymium from Smartphones

Autores: Nils F. Nissen, Julia Reinhold, Karsten Schischke, Klaus-Dieter-Lang
Publicado en: Proceedings of 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign2019), Edición Nov 25-27, 2019, 2019
Editor: Ecodenet

UPSCALING of COLLABORATIVE DISASSEM-BLY LINES for MOBILE PHONES – ECONOMIC and ENVIRONMENTAL CONSIDERATIONS

Autores: R. Pamminger, S. Glaser, R. Ambrosch, M. Genner
Publicado en: International Symposium for Production and Research, 2019, Vienna, 2019
Editor: ISPR 2019

Lifetime Extension by Design and a Fab Lab Level Digital Manufacturing Strategy: Tablet Case Study

Autores: J. Ospina, P. Maher, A. Galligan, MicroPro J. Gallagher, D. O’Donovan,GMIT Letterfrack; St. Knorr, Designing Berlin K. Schischke, Fraunhofer IZM
Publicado en: PLATE 2019 - Product Lifetimes And The Environment, Edición Sep.19, 2019
Editor: PLATE 2019 - Product Lifetimes And The Environment

Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

Autores: D. Manessis, K-D. Lang, K. Schischke, J. Pawlikowski, T. Krivec, G. Schulz, G. Podhradsky, R. Aschenbrenner, M. Schneider-Ramelow, A. Ostmann
Publicado en: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, Página(s) 1-8, ISBN 978-0-9568086-6-0
Editor: IEEE
DOI: 10.23919/empc44848.2019.8951790

Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben

Autores: Tobias Kupka
Publicado en: 2018
Editor: Tobias Kupka

Characterization and modelling of the cure induced shrinkage of epoxy resin used in organic based electronic modules

Autores: Julia Verena Zündel
Publicado en: 2018
Editor: Julia Verena Zündel

Possible framework for the reuse of smartphones

Autores: Octavian Graf Pilati
Publicado en: 2018
Editor: Octavian Graf Pilati

Systemowy odzysk elementów elektronicznych - aspekt ekologiczny

Autores: Piotr Dawidowicz, Piotr Ciszewski (Semicon)
Publicado en: Elektronik, Edición 10/2016, 2016, Página(s) 2
Editor: Elektronik

Semicon oraz ITR w projekcie w ramach Horyzontu 2020

Autores: Piotr Ciszewski
Publicado en: EVERTIQ, Edición 04.11.2015, 2015
Editor: EVERTIQ

Drugie życie pamięci flash

Autores: Piotr Ciszewski
Publicado en: EVERTIQ, Edición 17.11.2015, 2015
Editor: EVERTIQ

Elementy zrównoważonego rozwoju produktów elektronicznych w gospodarce o obiegu zamkniętym

Autores: Janusz Sitek
Publicado en: ELEKTRONIKA - KONSTRUKCJE, TECHNOLOGIE, ZASTOSOWANIA, Edición 1/6, 2016, Página(s) 119-122, ISSN 0033-2089
Editor: SIGMA-NOT
DOI: 10.15199/13.2016.6.25

Impact of modularity as a circular design strategy on materials use for smart mobile devices

Autores: Karsten Schischke, Marina Proske, Nils F. Nissen, Martin Schneider-Ramelow
Publicado en: MRS Energy & Sustainability, Edición 6, 2019, ISSN 2329-2229
Editor: Cambridge University Press
DOI: 10.1557/mre.2019.17

Writing the next chapter for optical sorting

Autores: Kristin Linnenkoper
Publicado en: Recycling International, Edición 10 times/year, 2016, Página(s) 32-33, ISSN 1387-8700
Editor: HUSS-VERLAG GmbH

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