The work performed since the beginning of the FineSol project is briefly presented below:
A. Generations of specifications and requirements:
i) Designs of atomization machine
ii) Protective coating - Chemistry of paste
iii) Reflow process – PCB assembly & QA
iv) NDT methods for inspection and tests
v) Demonstrators description
The relevant work has been reported in D2.1 2.2 2.3 2.4 and 2.5.
B. Development & integration of atomization production line:
i) Development of atomization sub-assembly and of coating sub-assembly
ii) Peripheral and support systems
iii) Control system and Integration of production line
The relevant work is almost finalised (D3.1 3.2 3.3 and 3.4 submitted)
C. Engineered design of solder paste formulation:
i) Selection of appropriate chemical ligand for surface oxidation protection
ii) Design of flux
iii) Solder paste production and characterization
The work performed for the selection of the appropriate organic agents for the surface oxidation protection was reported in details in D4.1. The design of flux and solder paste production continues. The D4.2 - Report on formulation of flux is submitted.
D. PCB assembly:
i) PCBs Assembly
ii) PCBs NTD inspection
Test patterns have been developed, PCBs have been evaluated, a reflow chamber has been built, CT X-ray has been upgraded and an automatic inspection system has been developed.
E. Demonstration activities of real devices in the FineSol project.
F. Industrial implementation issues:
i) Pre-normative research & standardization
ii) Life-cycle-analysis
A pre-normative research of standards relevant to FineSol was performed (D7.1). Information on existing standards related to the solder paste and fluxes was gathered. LCA has also started (D7.3).
G. Dissemination and exploitation. This includes:
i) Exploitation- Dissemination activities
ii) Knowledge management & IPR protection
iii) Innovation Management
iv) Training activities
v) Funding & investment plans
The business plan is being continuously updated. New market analysis data have been presented, including the identification & short description of the market leaders in the solder paste and PCB market, and the revenues of the market leaders. A list of SMEs that could be interested in the project results will also be identified in the remaining period. The competition analysis has revealed the competitor companies, information about their status in the market as well as the characteristics and the prices of the products they have launched. The pricing policy has been formed based on competition prices and on the total costs for production, labour and marketing. Simulations for future revenues are also planned for the remaining period.
The IP Registry has been completed. With respect to the ownership status, the cases of Joint Ownership have been identified and shares of ownership have been agreed based the nature of each beneficiary's contribution in the development of the Result.
Actions to protect the foreground have also been completed, as a patent application has been filed.
Based on the work in IP and Knowledge Management, additional business opportunities have been identified (licensing) as a result of the relevant patent application that has been filed recently.
Several dissemination and communication actions have taken place in Europe, and three actions have also taken place in Australia, Asia and America. In total, the consortium has so far completed 6 press releases, attended 4 exhibitions, communicated 3 flyers, used the social media pages to communicate the project, and has a dedicated website for the project. Additionally, the consortium has disseminated the Results in 9 scientific conferences where the partners participated, in 3 workshops, and in 5 events other than a conference or a workshop. Furthermore, the consortium has communicated the project in other events. D8.1 D8.2 and D8.5 have been submitted.
