Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Project Information

FineSol

Grant agreement ID: 680718

DOI 10.3030/680718

Project closed

EC signature date 3 August 2015

Start date 1 November 2015

End date 30 April 2019

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Advanced manufacturing and processing

Total cost € 6 148 635,00

EU contribution € 4 959 450,00

Coordinated by

ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS
Greece

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (1)

Presentation of dissemination material

Websites, patent fillings, videos etc. (1)

Project website

Publications

Conference proceedings (17)

Towards miniaturization of electronics by developing and characterizing hyperfine solder powders used in printed circuit boards

Author(s): Panagiota Aikaterini T. Dalla, Dimitrios Tzetzis, Alexandros E. Karantzalis, Dionysios Bochtis, Theodore E. Matikas, Dimitrios A. Exarchos
Published in: Smart Materials and Nondestructive Evaluation for Energy Systems IV, 2018, Page(s) 30, ISBN 9781-510616998
Publisher: SPIE
DOI: 10.1117/12.2323279

13th International Conference on Nanosciences & Nanotechnologies-NN16

Author(s): TBS
Published in: 2016
Publisher: -

IIW-International Institute of Welding - 69th Annual Assembly and International Conference

Author(s): TBS
Published in: 2016
Publisher: -

Euronanoforum 2017

Author(s): TBS
Published in: 2017
Publisher: -

EFFRA's Factories of the Future Conference 2016

Author(s): TBS
Published in: 2016
Publisher: -

15th International Conference on Nanosciences & Nanoechnologies-NN17 (booth and presentation)

Author(s): TBS
Published in: 2017
Publisher: -

"""IIW International Conference (by Prof Luisa Coutinho)"" "

Author(s): TBS
Published in: 2017
Publisher: -

16th International Conference on Nanosciences & Nanoechnologies-NN18 Characterization of Hyperfine Solder Powders used for Miniaturized Electronics

Author(s): D.A. Exarchos, P. T. Dalla, D. Tzetzis, A.E. Karantzalis, D. Bochtis, T.E. Matikas
Published in: 2018
Publisher: -

SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2018, /Towards miniaturization of electronics by developing and characterizing hyperfine solder powders used in printed circuit boards

Author(s): TBS
Published in: 2018
Publisher: -

Printed Electronics USA 2018

Author(s): TBS
Published in: 2017
Publisher: -

Going Green - CARE INNOVATION 2018

Author(s): TBS
Published in: 2018
Publisher: -

Printed Electronics EUROPE 2018

Author(s): TBS
Published in: 2018
Publisher: -

Printed Electronics USA 2018

Author(s): TBS
Published in: 2018
Publisher: -

EFFRA Project Event and Impact Workshop

Author(s): TBS
Published in: 2017
Publisher: -

IDTechEx Show EUROPE - Masterclass in Advanced Screen Printing in PE Applications

Author(s): TBS
Published in: 2018
Publisher: -

Project Presentation at ASR Joining Event

Author(s): TBS
Published in: 2018
Publisher: -

21st Edition of the Workshop on Electromagnetic,Nondestructive Evaluation (distribution of flyer)

Author(s): TBS
Published in: 2016
Publisher: -

Other (5)

IAB-IIW Members Meeting

Author(s): TBS
Published in: 2016
Publisher: -

EWF General Assembly

Author(s): TBS
Published in: 2016
Publisher: -

EFFRA’s Factories of the Future Community Day (flyer distribution)

Author(s): TBS
Published in: 2017
Publisher: -

IAB WG Inspection, Qualification and Certification of Welders, Genoa, Italy

Author(s): TBS
Published in: 2017
Publisher: -

III FPGA Symposium, poster session. Presentaion of Finesol to show future change in miniaturization

Author(s): TBS
Published in: 2018
Publisher: -